I11 - Imaginarni 11

This part of IEC 63287 specifies guidelines for a reliability qualification plan for power semiconductor modules to assure reliability targets over the entire product life.
Power semiconductor modules with incorporated control circuits are excluded. Clamped packages that need external pressure for being mounted in a system are excluded, e.g. disctype pressure pack devices.
This document is not intended for medical, military, aeronautics and astronautics-related applications.
NOTE Throughout the document, the term power semiconductor module refers to multichip semiconductor power modules as defined in 3.3.

This part of IEC 62228 specifies test and measurement methods for the EMC evaluation of CXPI transceiver ICs under network condition. It defines test configurations, test conditions, test signals, failure criteria, test procedures, test setups and test boards. This specification is applicable for standard CXPI transceiver ICs and ICs with embedded CXPI transceiver and covers
– the emission of RF disturbances;
– the immunity against RF disturbances;
– the immunity against impulses;
– the immunity against electrostatic discharges (ESD).

This document specifies requirements, recommendations, and examples for implementing a risk-informed decision-making (RIDM) process for managing existing network assets in power systems. The intended audience concerns power network organizations' stakeholders and decision makers, such as asset managers, risk managers, regulators, asset owners, and service providers. The RIDM process details the steps to ensure transparency, consistency, and traceability of the decision by:
– specifying the risk decision-making context depending on asset management objectives, available knowledge, and risk stakeholders' concerns;
– identifying the appropriate risk management strategies and the knowledge supporting the analyses;
– detailing the essential steps for conducting a risk analysis and justifying investments, regardless of the calculation methods used;
– providing essential information and warnings to decision makers;
– implementing performance evaluation and continuous improvement.
The document is based on the asset management principles from ISO 55000:2024 [1] and is aligned with ISO 55001:2024 [2]. Compliance with the requirements of this document is independent of compliance with ISO 55001:2024 [2].

This document establishes general rules and safety requirements on the application of capacitors, resistors, inductors, and complete filter units for electromagnetic interference
suppression which will be connected to an AC mains or other supply (DC or AC) with a nominal voltage not exceeding 1 000 V AC having a nominal frequency not exceeding 400 Hz, or 1 500 V DC.
It facilitates drafters of product safety standards and other stakeholders such as designers, manufacturers, se rvice providers, policy makers and regulators to consider safety aspects for the intended use and the reasonably foreseeable misuse of these components in its products and systems and apply risk reduction measures to achieve a tolerable risk level.

This part of IEC 60115 is applicable to fixed power resistors with axial leads for through hole assembly (THT) on circuit boards for use in electronic equipment.
The document is applicable to the drafting of detail specifications for fixed low-power film resistors with leads classified to level G, which is defined in IEC 60115-1:2020, 3.4 for general electronic equipment, typically operated under benign or moderate environmental conditions, where the major requirement is function. Examples for level G include consumer products and telecommunication user terminals.
This detail specification is based upon the blank detail specification IEC 60115-4-10:202X. This detail specification establishes test schedules and performance requirements permitting the quality assessment of the resistors covered herein according to the quality assessment procedures prescribed by IEC 60115-1:2020, Annex Q.

This part of IEC 60115 is applicable to fixed power resistors with axial leads for through hole assembly (THT) on circuit boards for use in electronic equipment. The document is applicable to the drafting of detail specifications for fixed low-power film resistors with leads classified to level G, which is defined in IEC 60115-1:2020, 3.4 for general electronic equipment, typically operated under benign or moderate environmental conditions, where the major requirement is function. Examples for level G include consumer products and telecommunication user terminals. This detail specification is based upon the blank detail specification IEC 60115-4-10:202X. This detail specification establishes test schedules and performance requirements permitting the quality assessment of the resistors covered herein according to the quality assessment procedures prescribed by IEC 60115-1:2020, Annex Q.

This part of IEC 63171 covers two-way, shielded or unshielded, free and fixed connectors known as Type 1, for balanced single-pair data transmission with frequencies up to 600 MHz and with current carrying capacity up to 2,0 A at 60 °C.
It specifies the common dimensions, and provides the mechanical, electrical, signal integrity, and environmental characteristics, the reliability specifications and corresponding tests for these connectors.

IEC 62275:2022 specifies requirements for metallic, non-metallic and composite cable ties and their associated fixing devices as a means used for managing or securing the wiring systems in electrical installations. Cable ties and associated fixing devices can also be suitable for other applications, such as support of wiring systems, and where so used, additional requirements can apply. This fourth edition cancels and replaces the third edition published in 2018. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
- scope clarification,
- new definitions,
- deletion of the exception for the stabilization of the moisture content,
- possibility to carry out tensile strength tests with dead weights,
- differentiation of rubber and acrylic adhesive fixings,
- clarification for mechanical testing of integral devices,
- clarifications on Table 6,
- clarifications in 9.1,
- the minimum installation temperature test for cable ties is carried out only when the declared minimum temperature is lower than 0 °C,
- a requirement that metallic cable ties be classified according to 6.2.3,
- definition of colours to be tested for contribution to fire,
- addition of a "some countries" note in Clause 10,
- clarification of the mounting of fixing devices in the resistance to ultraviolet light test,
- clarification on the testing of integral devices in the resistance to ultraviolet light test.

This document provides a multi-dimensional assessment framework of data spaces maturity, considering the different needs of data spaces, their participants, domain, or scope.
Specifically, it defines a maturity model concept, structure, methodology and measurable criteria, with related requirements and guidance for the assessment of data space maturity.
This document applies to all types of organizations, regardless of their type or size.

IEC 60444-11:2026 defines the standard method of measuring load resonance frequency fL at the nominal value of CL, and the determination of the effective load capacitance CLeff at the nominal frequency for crystals with the figure of merit M > 4.
This edition includes the following significant technical changes with respect to the previous edition:
a) key content of withdrawn IEC TR 60444-4 is reproduced as Annex A;
b) some formulae in the first edition have been corrected.

This document provides guidance on how and when to address adaptation to climate change in European standardization deliverables. It helps TCs to recognize when climate change or extreme weather may affect a standardization deliverable over its lifespan, understand when new or updated climate and weather data are needed, and incorporate adaptive and flexible solutions into standardization deliverables. This document is applicable to infrastructure, product and service standards. It provides a structured and practical framework to write, review and update standards in light of changing climate conditions.

This document gives the sector specific requirements for the provision of private security services in the energy sector that are additional to the requirements of EN 17483-1.
This document specifies service requirements for quality in organization, processes, personnel and management of a security service provider and/or its independent branches and establishments under commercial law and trade as a provider with regard to security services in the energy sector.
This document defines quality criteria for the delivery of security services in the energy sector requested by public and private clients. This document is suitable for the selection, attribution, awarding and reviewing of the most suitable provider of security services in the energy sector.
NOTE 1 This document is the Part 4 of a series of standards on the provision of private security services for critical infrastructure. See Figure 2.
NOTE 2 It is important that the selection of a private security service provider always represents the best balance between quality and price. This document sets out the minimum requirements that providers are expected to comply with in order for this balance to be struck.
This document is not applicable to private security services in nuclear power plants.
A list of activities for Private Security Companies (PSC) in Critical Infrastructure Protection (CIP) in the energy sector comprises:
1. Perimeter Protection and Surveillance:
-  human - reception services, static guarding, patrols, dog-handler;
- technology – CCTV, unmanned vehicles (air/ground/sea); others;
- operation of a control/monitoring room;
- operation of an alarm monitoring centre;
- access Control and Management (turnstiles, barriers, authorization and badges).
2. Human and technology, e.g. use of screening and detection equipment for:
- vehicles;
- goods;
- visitors;
- staff;
- contractors;
3. Site security and mobile patrolling/ Static guarding activities required to secure a specific facility/area and mobile patrolling on-site and in buildings within the site;
4. Emergency response;
- alarm response;
- first aid response.

This part of IEC 60115 is applicable to fixed low-power film resistors with termination leads for use in electronic equipment, which are typically assembled in through-hole technology (THT) on circuit boards.  
These resistors are typically described according to types (different geometric shapes) and styles (different dimensions)
and product technology. The resistive element of these resistors is typically protected by a conformal lacquer coating.
These resistors have wire terminations and are primarily intended to be mounted on a circuit board in through-hole
technique.  
The object of this standard is to prescribe preferred ratings and characteristics and to select from IEC 60115-1, the
appropriate quality assessment procedures, tests and measuring methods and to give general performance requirements
for this type of resistor.

This part of IEC 60115 is applicable to leaded fixed low-power film resistors for use in electronic equipment and is
applicable to the drafting of detail specifications for leaded fixed low-power film resistors classified to level G, which is
defined in IEC 60115-1:2020, 3.4 for general electronic equipment, typically operated under benign or moderate
environmental conditions, where the major requirement is function. Examples for level G include consumer products and
telecommunication user terminals.
The resistors covered herein are classified to level G, as defined in IEC 60115-1:2020, 3.4 for general electronic
equipment, typically operated under benign or moderate environmental conditions, where the major requirement is
function. Examples for level G include consumer products and telecommunication user terminals.  
Since the documents of the 60115-X series are exempted from the parallel procedure (D162/C089), this New Work Item Proposal aims to endorse the main IEC document IEC 60115-2-10:2023 as a European standard. The standard shall be published together with the finalised Common Modifications.

This part of IEC 60115 is applicable to fixed power resistors for use in electronic equipment.  
This standard relates to resistors having a rated dissipation typically greater than 1W up to and including 1000W for use in
electronic equipment. This standard is applicable to fixed power resistors with a maximum surface temperature (MET)
higher than the preferred upper category temperature (UCT) of 200°C.  
These resistors are typically described according to types (different geometric shapes) and styles (different dimensions)
and product technology.  
The resistive element of these resistors is typically  
- protected by a conformal lacquer coating or  
- cement coating or  
- vitreous enamel or  
- a ceramic body or  
- any other housing, which is to be described in the relevant specification.  
The electrical connection of these resistors is typically achieved by means of  
- lead wire terminations or  
- punched terminals or lug terminals or  
- push on terminals or  
- screw terminals or  
- any other termination, which is to be described in the relevant specification  
In special cases, a heat sink may be applicable but not mandatory.  
The object of this standard is to prescribe preferred ratings and characteristics and to select from IEC 60115-1 the
appropriate quality assessment procedures, tests and measuring methods and to give general performance requirements
for this type of resistor.  
Test severities and requirements prescribed in detail specifications referring to this sectional specification shall be of equal
or higher performance level, because lower performance levels are not permitted

This part of IEC 60115 is applicable to leaded fixed low-power film resistors for use in electronic equipment and is
applicable to the drafting of detail specifications for leaded fixed low-power film resistors classified to level G, which is
defined in IEC 60115-1:2020, 3.4 for general electronic equipment, typically operated under benign or moderate
environmental conditions, where the major requirement is function. Examples for level G include consumer products and
telecommunication user terminals.
The resistors covered herein are classified to level G, as defined in IEC 60115-1:2020, 3.4 for general electronic
equipment, typically operated under benign or moderate environmental conditions, where the major requirement is
function. Examples for level G include consumer products and telecommunication user terminals.  
This detail specification is based upon the blank detail specification IEC 60115-2-10:202X. This detail specification
establishes test schedules and performance requirements permitting the quality assessment of the resistors covered
herein according to the quality assessment procedures prescribed by IEC 60115-1:2020, Annex Q.

IEC 63041-3:2026 is applicable to piezoelectric physical sensors mainly used in the field of process control, wireless monitoring, dynamics, thermodynamics, vacuum engineering, and environmental sciences. This document provides users with technical guidelines as well as basic knowledge of common physical sensors. Piezoelectric sensors covered herein are those applied to the detection and measurement of physical quantities such as force, pressure, torque, viscosity, temperature, film thickness, acceleration, vibration, and tilt angle.
This edition includes the following significant technical changes with respect to the previous edition:
a) Some terms in Clause 3 have been updated to be consistent with IEC TS 61994-5:2023.

This part of IEC 60115 is applicable to fixed low-power film resistors with termination leads for use in electronic equipment, which are typically assembled in through-hole technology (THT) on circuit boards.  
These resistors are typically described according to types (different geometric shapes) and styles (different dimensions)
and product technology. The resistive element of these resistors is typically protected by a conformal lacquer coating.
These resistors have wire terminations and are primarily intended to be mounted on a circuit board in through-hole
technique.  
The object of this standard is to prescribe preferred ratings and characteristics and to select from IEC 60115-1, the
appropriate quality assessment procedures, tests and measuring methods and to give general performance requirements
for this type of resistor.
Since the documents of the 60115-X series are exempted from the parallel procedure (D162/C089), this New Work Item Proposal aims to endorse the main IEC document IEC 60115-2:2023 as a European standard. The standard shall be published together with the finalised Common Modifications.

This part of IEC 60115 is applicable to fixed surface mount resistors for use in electronic equipment.
These resistors are typically described according to types (different geometric shapes) and styles (different dimensions)
and product technology. These resistors have metallized terminations and are primarily intended to be mounted directly
onto a circuit board.
The object of this document is to specify preferred ratings and characteristics and to select from IEC 60115-1, the
appropriate quality assessment procedures, tests and measuring methods and to give general performance requirements
for this type of resistor.
Since the documents of the 60115-X series are exempted from the parallel procedure (D162/C089), this New Work Item
Proposal aims to endorse the main IEC document IEC 60115-8:2023 as a European standard. The standard shall be
published together with the finalised Common Modifications.

This part of IEC 60115 is applicable to fixed power resistors for use in electronic equipment.  
This standard relates to resistors having a rated dissipation typically greater than 1W up to and including 1000W for use in
electronic equipment. This standard is applicable to fixed power resistors with a maximum surface temperature (MET)
higher than the preferred upper category temperature (UCT) of 200°C.  
These resistors are typically described according to types (different geometric shapes) and styles (different dimensions)
and product technology.  
The resistive element of these resistors is typically  
- protected by a conformal lacquer coating or  
- cement coating or  
- vitreous enamel or  
- a ceramic body or  
- any other housing, which is to be described in the relevant specification.  
The electrical connection of these resistors is typically achieved by means of  
- lead wire terminations or  
- punched terminals or lug terminals or  
- push on terminals or  
- screw terminals or  
- any other termination, which is to be described in the relevant specification  
In special cases, a heat sink may be applicable but not mandatory.  
The object of this standard is to prescribe preferred ratings and characteristics and to select from IEC 60115-1 the
appropriate quality assessment procedures, tests and measuring methods and to give general performance requirements
for this type of resistor.  
Test severities and requirements prescribed in detail specifications referring to this sectional specification shall be of equal
or higher performance level, because lower performance levels are not permitted.
Since the documents of the 60115-X series are exempted from the parallel procedure (D162/C089), this New Work Item Proposal aims to endorse the main IEC document IEC 60115-4:2022 as a European standard. The standard shall be published together with the finalised Common Modifications.

This part of IEC 60115 is applicable to fixed surface mount resistors for use in electronic equipment.
These resistors are typically described according to types (different geometric shapes) and styles (different dimensions)
and product technology. These resistors have metallized terminations and are primarily intended to be mounted directly
onto a circuit board.
The object of this document is to specify preferred ratings and characteristics and to select from IEC 60115-1, the
appropriate quality assessment procedures, tests and measuring methods and to give general performance requirements
for this type of resistor

This document defines terms used in the field of cloud computing.

Building on the consolidated definitions of NbS, this document establishes a terminology to support the development of an agreed vocabulary, forming the basis of the standardisation process.

This document specifies concepts used in the field of cloud computing. These concepts expand upon the cloud computing vocabulary defined in ISO/IEC 22123-1 and provide a foundation for other documents that are associated with cloud computing.

This document specifies the cloud computing reference architecture (CCRA).

This part of IEC 61076 describes 3-way to 12-way circular connectors with M8 screw-locking or with nominal ∅ 8 mm snap-locking, for connection of automation devices, for signal and power transmission up to 50 V AC / 60 V DC rated voltage and up to 4 A rated current.
These connectors are available as fixed or free connectors, either rewirable or non-rewirable. Male connectors have round contacts ∅ 0,48 mm, ∅ 0,6 mm, ∅ 0,7 mm and ∅ 1,0 mm, depending on the number of ways and coding, with all contacts being of the same size.
The different codings prevent the mating of differently coded male and female connectors.
NOTE M8 is the dimension of the thread of the screw locking mechanism of these circular connectors.

This document provides terminology, concepts and a description of mechanisms in the field of data exchange focusing on trusted data transactions.
Those elements can be used in the development of standards in support of trusted data transactions and constitute a basis to identify key dimensions and criteria that contribute to the trust in a data transaction between interested parties.
Therefore, those elements constitute a foundational understanding on which trusted data transactions can be based, independently of any architectural choices or technical implementation.

IEC 62132-8:2026 specifies a method for measuring the immunity of an integrated circuit (IC) to radio frequency (RF) radiated electromagnetic disturbances using an IC stripline.
This edition includes the following significant technical changes with respect to the previous edition:
a) frequency range of 150 kHz to 3 GHz was deleted from the scope;
b) extension of upper usable frequency to 6 GHz or higher as long as the defined requirements are fulfilled.
This part of IEC 62132 is to be read in conjunction with IEC 62132-1.

IEC 63378-6:2026 specifies a thermal resistance and capacitance model for semiconductor packages. This model is named the digital transformation using thermal resistance and capacitance (DXRC) model. It predicts transient temperature at junction and measurement points.
This document applies to semiconductor packages such as TO-252, TO-263, and HSOP. It supports single chip packages dissipated heat from single package surface.

IEC 60050-831:2025 gives the terms and definitions used in smart cities and smart city systems, as well as general terms pertaining to specific applications and associated technologies. This terminology is consistent with the terminology developed in the other specialized parts of the IEV. It has the status of a horizontal standard in accordance with IEC Guide 108.

IEC 60749-20-1:2019 applies to all devices subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages, process sensitive devices, and other moisture-sensitive devices made with moisture-permeable materials (epoxies, silicones, etc.) that are exposed to the ambient air. The purpose of this document is to provide SMD manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow sensitive SMDs that have been classified to the levels defined in IEC 60749-20. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved, with the dry packing process, providing a minimum shelf life capability in sealed dry-bags from the seal date. This edition includes the following significant technical changes with respect to the previous edition: - updates to subclauses to better align the test method with IPC/JEDEC J-STD-033C, including new sections on aqueous cleaning and dry pack precautions; - addition of two annexes on colorimetric testing of HIC (humidity indicator card) and derivation of bake tables.

This part of IEC 60352 is applicable to spring clamp connections made with stripped wire of the following types and sizes according to IEC 60228 or IEC 60189-3, without further preparation (later described “unprepared”):
– solid conductors (e.g. class 1 of IEC 60228) of 0,32 mm to 3,7 mm nominal diameter (0,08 mm2 to 10 mm2 cross-section), or
– stranded conductors (e.g. class 2 of IEC 60228) of 0,08 mm2 to 10 mm2 cross-section, or
– flexible conductors (e.g. class 5 or 6 of IEC 60228) of 0,08 mm2 to 10 mm2 cross-section, for use in electrical and electronic equipment and components.
Information on materials and data from industrial experience is included in addition to the test procedures to provide electrically stable connections under prescribed environmental conditions.
The object of this document is to determine the suitability of spring clamp connections under specified mechanical, electrical and atmospheric conditions.
NOTE IEC Guide 109 advocates the need to minimize the impact of a product on the natural environment throughout the product life cycle. It is understood that some of the materials permitted in this document can have a negative environmental impact. As technological advances lead to acceptable alternatives for these materials, they will be
eliminated from this document.

IEC 60749-26:2025 establishes the procedure for testing, evaluating, and classifying components and microcircuits in accordance with their susceptibility (sensitivity) to damage or degradation by exposure to a defined human body model (HBM) electrostatic discharge (ESD). The purpose of this document is to establish a test method that will replicate HBM failures and provide reliable, repeatable HBM ESD test results from tester to tester, regardless of component type. Repeatable data will allow accurate classifications and comparisons of HBM ESD sensitivity levels. ESD testing of semiconductor devices is selected from this test method, the machine model (MM) test method (see IEC 60749‑27) or other ESD test methods in the IEC 60749 series. Unless otherwise specified, this test method is the one selected.
This edition includes the following significant technical changes with respect to the previous edition:
a) new definitions have been added;
b) text has been added to clarify the designation of and allowances resulting from “low parasitics”. The new designation includes the maximum number of pins of a device that can pass the test procedure.

IEC 63541:2025 applies to lithium tantalate (LT) and lithium niobate (LN) crystals for surface acoustic wave devices, including the as-grown crystals and lumbered crystals.

This part of IEC 61076-2 describes 4- to 6-way circular connectors with M12 screw-locking with current ratings 8, 12 or 16 A per contact and voltage ratings of 50 V AC / 60 V DC or 630 V according to their coding, that are typically used for power supply and power applications in industrial premises.
These connectors consist of both fixed and free connectors, either rewirable or non-rewirable.
Male connectors have round contacts Ø1,0 mm and Ø1,5 mm.
The different codings provided by this document prevent the mating of differently coded male or female connectors to any other similarly sized interfaces, covered by other standards and the cross-mating between the different codings provided by this document.
NOTE 1 M12 is the dimension of the thread of the screw locking mechanism of these circular connectors.
NOTE 2 Several other IEC standards are available covering additional styles of circular connectors with M12 × 1 screw-locking, see Bibliography.

This document provides guidance to contracting authorities on how to determine contract award criteria to meet the accessibility requirements of Directive (EU) 2019/882 (European Accessibility Act, EAA) and Directive (EU) 2016/2102 (Web Accessibility Directive, WAD); and on how to verify the conformance of publicly procured ICT products and services with these requirements. The present document describes how the accessibility requirements for the ICT should be specified, documented and assessed in the frame of the procurement process, under the EU public procurement directives1. The different mechanisms for conformity assessment with the applicable accessibility requirements are explained. It discusses how these mechanisms can be applied both in the pre-procurement research phase and when awarding a contract, as well as part of contract management in the post-award stage.
This document also provides a useful guidance for bidders who prepare an offer for public procurement of ICT products and services, and others aiming to procure accessible ICT.
Aspects that do not deal with accessibility in ICT procurement in Europe are outside the scope of this document.

IEC 60749-23:2025 specifies the test used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the device operating condition in an accelerated way and is primarily for device qualification and reliability monitoring. A form of high temperature bias life using a short duration, popularly known as "burn-in", can be used to screen for infant-mortality related failures. The detailed use and application of burn-in is outside the scope of this document.
This edition includes the following significant technical changes with respect to the previous edition:
a) absolute stress test definitions and resultant test durations have been updated.

IEC 60749-21:2025 establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or lead-free (Pb-free) solder for the attachment. This test method provides a procedure for “dip and look” solderability testing of through hole, axial and surface mount devices (SMDs) as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application. The test method also provides optional conditions for ageing. This test is considered destructive unless otherwise detailed in the relevant specification.
NOTE 1 This test method does not assess the effect of thermal stresses which can occur during the soldering process. More details can be found in IEC 60749‑15 or IEC 60749‑20.
NOTE 2 If a qualitative test method is preferred, the Wetting balance test method can be found in IEC 60068-2-69.
This edition includes the following significant technical changes with respect to the previous edition:
- revision to certain operating conditions in line with current working practices.

This document provides the guidelines of CEN and CENELEC’s policy towards building partnerships with European organizations, associations and other recognized stakeholders who have an interest in European standardization and are willing and able to provide added-value knowledge and to actively contribute with inputs and proposals to CEN and/or CENELEC corporate and technical bodies.

IEC 62065:2025 specifies the minimum operational and performance requirements, test methods and required test results conforming to performance standards adopted by the IMO in resolution MSC.74(69) Annex 2 Recommendation on Performance Standards for Track Control Systems. In addition, it takes into account IMO resolution A.694(17) to which IEC 60945 is associated. It also takes into account IMO resolution MSC.302(87) on bridge alert management (BAM), to which IEC 62923-1 and IEC 62923-2 are associated.
This third edition cancels and replaces the second edition published in 2014. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition:
a) alert management has been brought in line with MSC.302(87), IEC 62923-1 and IEC 62923‑2, reducing the number of alerts for one situation and improving the information provided by alerts. An overview is provided in Annex F;
b) the previous Annex F has been removed as it was outdated and not instrumental in this document;
c) the requirements in Clause 5 have been further detailed:
d) the structure of Clause 6 has been updated.

IEC 61252:2025 specifies
– performance specifications for personal sound exposure meters,
– details of the tests necessary to verify conformance to all mandatory specifications for the purpose of pattern evaluation, and
– procedures for periodic testing of a personal sound exposure meter.
Personal sound exposure meters conforming to the requirements of this document have a specified frequency response for sound incident on the microphone from all directions.
This document is applicable to instruments that are designed to be worn on a person in a configuration specified by the manufacturer for the measurement of sound immission resulting from steady, intermittent, fluctuating, irregular, or impulsive sounds. For reproducibility of results, specifications and tests for the response to sound waves apply without an operator present in the sound field.
Pattern evaluation tests and periodic tests described in this this document apply to personal sound exposure meters for which the manufacturer claims conformance to the specifications given in this document.
IEC 61252:2025 cancels and replaces the first edition published in 1993, Amendment 1:2000, and Amendment 2:2017. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition:
a) personal sound exposure meters are required to provide indications of time-averaged sound level and peak sound level;
b) sound exposure is an optional quantity for indication;
c) specifications for physical quantities that do not follow the principle of equal-energy exchange rate have been added;
d) specifications for directional response have been added;
e) specifications for frequency weightings apply to the relative diffuse-field frequency response;
f) determination of conformance to specifications takes account of uncertainties of measurement;
g) detailed requirements for pattern-evaluation tests and periodic testing have been added.

IEC 60749-24:2025 specifies unbiased highly accelerated stress testing (HAST). HAST is performed for the purpose of evaluating the reliability of non-hermetically packaged solid-state devices in humid environments. It is a highly accelerated test which employs temperature and humidity under non-condensing conditions to accelerate the penetration of moisture through the external protective material (encapsulant or seal) or along the interface between the external protective material and the metallic conductors which pass through it. Bias is not applied in this test to ensure that the failure mechanisms potentially overshadowed by bias can be uncovered (e.g. galvanic corrosion).
This test is used to identify failure mechanisms internal to the package and is destructive.
This edition includes the following significant technical changes with respect to the previous edition:
a) rearrangement of clauses to reposition requirements;
b) addition of two notes to the post-test electrical procedures.

IEC 60749-22-2:2025 establishes a means for determining the strength of a ball bond to a die or package bonding surface and can be performed on pre-encapsulation or post-encapsulation devices. This measure of bond strength is extremely important in determining two features:
a) the integrity of the metallurgical bond which has been formed, and
b) the quality of ball bonds to die or package bonding surfaces.
This test method covers thermosonic (ball) bonds made with small diameter wire from 15 µm to 76 µm (0,000 6" to 0,003").
This test method can only be used when the bonds are large enough to allow for proper contact with the shear test chisel and when there are no adjacent interfering structures that would hinder the movement of the chisel. For consistent shear results the ball height will be at least 4,0 µm (0,000 6 ") for ball bonds, which is the current state of the art for bond shear test equipment at the time of this revision.
This test method can also be used on ball bonds that have had their wire removed and on to which a second bond wire (typically a stitch bond) is placed. This is known as "stitch on ball" and "reverse bonding". See Annex A for additional information.
The wire bond shear test is destructive. It is appropriate for use in process development, process control, or quality assurance, or both.
This test method can be used on ultrasonic (wedge) bonds, however its use has not been shown to be a consistent indicator of bond integrity. See Annex B for information on performing shear testing on wedge bonds.
This test method does not include bond strength testing using wire bond pull testing. Wire bond pull testing is described in IEC 60749-22-1.
This first edition, together with the first edition of IEC 60749-22-1, cancels and replaces the first edition IEC 60749-22 published in 2002. This International Standard is to be used in conjunction with IEC 60749-22-1:2025.
This edition includes the following significant technical changes with respect to the previous edition:
a) Major update, including new techniques and use of new materials (e.g. copper wire) involving a complete rewrite as two separate subparts (this document and IEC 60749‑22‑1).

IEC 62933-4-3:2025 applies to the effects of the environmental conditions on Battery Energy Storage Systems (BESS). This document addresses these effects and identifies causes, chain of events and final effects on the BESS. Based on those effects, preventative or mitigating measures are described. Typical environmental effects on the BESS include, but are not limited to, the effects of lightning, seismic activities, water, air, flora, fauna, and humans. The described measures focus as a guideline on the entire BESS including all power and communication connections and its Point of Connections (POCs).
The scope of this document is limited to BESS specific requirements and operating conditions. Specific design or safety requirements of individual BESS subsystems are excluded from this document.

This part of IEC 61076 establishes uniform specifications and technical information for circular connectors. This document is to be used in conjunction with the generic specification IEC 61076-1 for product requirements as the basis for preparation of detail product specifications for circular connectors.
NOTE The quality assessment requirements for connectors whose product requirements are given in IEC 61076 series are detailed in IEC 62197-1. This can be used as the basis for preparation of detail quality assessment specifications for circular connectors.
In the event of conflict between this sectional product specification and the detail product specification, it is intended that the requirements of the detail product specification prevail.

IEC 62933-3-1:2025 is applicable to EES systems designed for grid-connected indoor or outdoor installation and operation. This document considers:
necessary functions and capabilities of EES systems; sizing and design of EES system; operation of EES system; test items and performance assessment methods for EES systems; requirements for monitoring and acquisition of EES system operating parameters; exchange of system information and control capabilities required; maintenance of EES system. Stakeholders of this document comprise personnel involved with EES systems, which include:
- planners of electric power systems and EES systems;
- owners of EES systems;
- operators of electric power systems and EES systems;
- constructors;
- suppliers of EES systems and its equipment;
- aggregators.
Use-case-specific technical documentation, including planning and installation specific tasks such as system design, monitoring, measurement, tests, operation and maintenance, are very important and can be found throughout this document.