31 - ELECTRONICS
ICS 31 Details
ELECTRONICS
ELEKTRONIK
ELECTRONIQUE
ELEKTRONIKA
General Information
Frequently Asked Questions
ICS 31 is a classification code in the International Classification for Standards (ICS) system. It covers "ELECTRONICS". The ICS is a hierarchical classification system used to organize international, regional, and national standards, facilitating the search and identification of standards across different fields.
There are 6676 standards classified under ICS 31 (ELECTRONICS). These standards are published by international and regional standardization bodies including ISO, IEC, CEN, CENELEC, and ETSI.
The International Classification for Standards (ICS) is a hierarchical classification system maintained by ISO to organize standards and related documents. It uses a three-level structure with field (2 digits), group (3 digits), and sub-group (2 digits) codes. The ICS helps users find standards by subject area and enables statistical analysis of standards development activities.
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This part of IEC 63287 specifies guidelines for a reliability qualification plan for power semiconductor modules to assure reliability targets over the entire product life.
Power semiconductor modules with incorporated control circuits are excluded. Clamped packages that need external pressure for being mounted in a system are excluded, e.g. disctype pressure pack devices.
This document is not intended for medical, military, aeronautics and astronautics-related applications.
NOTE Throughout the document, the term power semiconductor module refers to multichip semiconductor power modules as defined in 3.3.
- Standard38 pagesEnglish languagee-Library read for1 day
This document specifies test methods for surface electromyography (sEMG) sensors by evaluating the quality of sEMG signals obtained from contracting the muscles of the forearm and hand for wearable applications. It is applicable to sEMG sensors that are used to decipher movement intentions and use them as control signals in situations such as virtual reality, game, unmanned aerial vehicles (UAV), robot control, and home automation. This document does not apply to sEMG sensors intended for medical diagnosis or treatment. For medical devices, national requirements can apply.
- Standard22 pagesEnglish languagee-Library read for1 day
This part of IEC 62228 specifies test and measurement methods for the EMC evaluation of CXPI transceiver ICs under network condition. It defines test configurations, test conditions, test signals, failure criteria, test procedures, test setups and test boards. This specification is applicable for standard CXPI transceiver ICs and ICs with embedded CXPI transceiver and covers
– the emission of RF disturbances;
– the immunity against RF disturbances;
– the immunity against impulses;
– the immunity against electrostatic discharges (ESD).
- Standard57 pagesEnglish languagee-Library read for1 day
IEC 60115-8-10:2026 is applicable to the drafting of detail specifications for surface mount (SMD) low-power film resistors, classified to level G, based on the definition of the product classification levels in IEC 60115‑1:2020, 3.4.
This edition includes the following significant technical changes with respect to the previous edition IEC 60115‑8‑1:2014:
a) it supports solderability testing for both traditional lead-bearing soldering and up-to-date lead-free soldering, as required;
b) it supports the provision of detailed visual acceptance criteria;
c) it includes the requirement for a visual examination of the primary and proximity packaging;
d) it provides for the inclusion of specific visual acceptance criteria, to be applied in addition to those given in Annex B of the sectional specification IEC 60115‑8:2023.
- Standard46 pagesEnglish languagesale 15% off
- Standard48 pagesFrench languagesale 15% off
This part of IEC 63287 specifies guidelines for a reliability qualification plan for power semiconductor modules to assure reliability targets over the entire product life.
Power semiconductor modules with incorporated control circuits are excluded. Clamped packages that need external pressure for being mounted in a system are excluded, e.g. disctype pressure pack devices.
This document is not intended for medical, military, aeronautics and astronautics-related applications.
NOTE Throughout the document, the term power semiconductor module refers to multichip semiconductor power modules as defined in 3.3.
- Standard38 pagesEnglish languagee-Library read for1 day
This document specifies test methods for surface electromyography (sEMG) sensors by evaluating the quality of sEMG signals obtained from contracting the muscles of the forearm and hand for wearable applications. It is applicable to sEMG sensors that are used to decipher movement intentions and use them as control signals in situations such as virtual reality, game, unmanned aerial vehicles (UAV), robot control, and home automation. This document does not apply to sEMG sensors intended for medical diagnosis or treatment. For medical devices, national requirements can apply.
- Standard22 pagesEnglish languagee-Library read for1 day
This document specifies procedures and techniques for obtaining comparable values for the absorptance of optical laser components.
- Standard26 pagesEnglish languagee-Library read for1 day
This document specifies three techniques for the determination of free Bisphenol A (BPA) in plastics of electrotechnical products.
This document describes the use of liquid chromatography–diode array detector (LC-DAD), liquid chromatography mass spectrometry (LC-MS), liquid chromatography tandem mass spectrometry (LC-MS/MS) with these test methods detailed in Annex A and Annex B.
These test methods have been evaluated for use with PC, PC/ABS, PP matrices containing free BPA between 20 mg/kg to 500 mg/kg as shown in the Pre-IIS 13 results in Annex C and IIS 13 results in Annex D [1], [2]. The use of these methods for BPA concentration ranges of plastics, other than those specified in Annex C and Annex D, has not been evaluated.
This document is a basic environment horizontal publication focusing on test methods and is primarily intended for use by committees in the preparation of publications within the area of environment in accordance with the principles laid down in IEC Guide 123. Wherever applicable, it is the responsibility of committees to make use of environment basic publications in the preparation of their environment group and product publications. Committees can apply this document directly to products when they do not develop a product publication in the area of environment.
WARNING – Persons using this document should be familiar with normal laboratory practice. This document does not purport to address all of the safety problems, if any, associated with its use. It is the responsibility of the user to establish appropriate safety and health practices and to ensure compliance with any national regulatory conditions.
- Standard35 pagesEnglish languagee-Library read for1 day
This part of IEC 61760 defines requirements for component specifications of electronic components that are intended for usage in surface mounting technology. To this end, it specifies a reference set of process conditions and related test conditions to be considered when compiling component specifications.
The objective of this document is to ensure that a wide variety of SMDs can be subjected to the same placement, mounting and subsequent processes (e.g. cleaning, inspection) during assembly. This document defines tests and requirements that are included in any SMD component’s general, sectional or detail specification. In addition, this document provides component users and manufacturers with a reference set of typical process conditions used in surface mounting technology.
Some of the requirements for component specifications in this document are also applicable to components with leads intended for mounting on a circuit board, including solderless interconnection technology. Cases for which this is appropriate are indicated in the relevant subclauses.
NOTE Solderless interconnection technology refers to a mounting method which is not part of the surface-mounting process and the components do not undergo a soldering operation. Such components are included in this document because the mounting of components for solderless interconnection commonly occurs after the mounting of SMDs.
- Standard55 pagesEnglish languagee-Library read for1 day
This part of IEC 62228 specifies test and measurement methods for the EMC evaluation of CXPI transceiver ICs under network condition. It defines test configurations, test conditions, test signals, failure criteria, test procedures, test setups and test boards. This specification is applicable for standard CXPI transceiver ICs and ICs with embedded CXPI transceiver and covers
– the emission of RF disturbances;
– the immunity against RF disturbances;
– the immunity against impulses;
– the immunity against electrostatic discharges (ESD).
- Standard57 pagesEnglish languagee-Library read for1 day
This part of the EN IEC 61360 specifies the new data dictionary (domain) “IEC 61360-7 - General items” including its generic concepts. The IEC 61360-7 data dictionary provides concepts (dictionary elements e.g. classes, properties) intended for cross-domain use.
- Standard14 pagesEnglish languagee-Library read for1 day
This document establishes general rules and safety requirements on the application of capacitors, resistors, inductors, and complete filter units for electromagnetic interference
suppression which will be connected to an AC mains or other supply (DC or AC) with a nominal voltage not exceeding 1 000 V AC having a nominal frequency not exceeding 400 Hz, or 1 500 V DC.
It facilitates drafters of product safety standards and other stakeholders such as designers, manufacturers, se rvice providers, policy makers and regulators to consider safety aspects for the intended use and the reasonably foreseeable misuse of these components in its products and systems and apply risk reduction measures to achieve a tolerable risk level.
- Standard31 pagesEnglish languagee-Library read for1 day
This part of IEC 61076 specifies circular connectors with bayonet locking size B12, B17, B23 and B40, typically used for power, signal and data transmissions in industrial applications. These connectors consist of fixed and free connectors either rewirable or non-rewirable.
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- Standard105 pagesFrench languagesale 15% off
IEC 63287-4:2026 gives guidelines for the development of reliability qualification plans using the early failure assessment, based on the environmental conditioning and proposed usage of the product. This document is not intended for military- and space-related applications.
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- Standard30 pagesEnglish and French languagesale 15% off
This document deals with all significant hazards, hazardous situations or hazardous events relevant to hand-held or hand-operated laser processing machines (HLMs), when they are used as intended and under conditions of misuse which are reasonably foreseeable by the manufacturer. HLM is the machine, as defined in ISO 11553-1:2020, 3.7, in which laser radiation is generated, where the laser provides sufficient energy/power to cause a phase transition in a part of the workpiece and where the laser output or workpiece to be processed is guided manually or hand-held during the laser material processing. This document defines general design requirements of HLM. HLM includes the laser device, beam-guiding device (e.g. mirror, fibre, lenses), beam-shaping device (e.g. telescope, focusing), and controls. The laser assembly as an integral part of the HLM or only the laser processing head is hand-held or hand-operated during the laser material processing. This document does not apply to laser processing machines which are remotely controlled by a manual controller (hand-operated controller), such as joy sticks, keyboard, etc., without touching a workpiece or a part mechanically connected with the laser material processing head by using the hand(s) of the operator (user) to laser processing machines without a drive system which may not belong to machinery. And the laser processing apparatus without moving parts, which may not be considered as machinery in “Type C standard”. to medical or cosmetic applications for the treatment of living human or animal tissue; to weapon applications, (e.g. such as with regard to military applications, direct close combat.) NOTE “hand-operated laser processing machine” is synonymous with “hand-guided laser processing machine” in this document. Hand-operated laser processing machines often use manual force reduction means such as wheels, supports, etc., for manual positioning of the laser processing heads or the workpieces. It is applicable to HLMs using laser radiation to process materials. The purpose of this document is to draw attention to the hazards related to HLMs and to prevent personal injury. Depending on the application and the location/operating conditions of HLMs, a number of different significant hazards can arise. This document describes both the areas of hazards analysis and risk assessment as well as protective measures. Requirements dealing with noise as a hazard are covered by ISO 11553-3:2013. This document does not apply to laser products or equipment manufactured solely or expressly for applications which are excluded from the Scope of ISO 11553-1:2020. This document is not applicable for HLMs which have been manufactured before the date of publication of this standard. HLMs include the following types: HLMs which are designed as all-in-one laser assembly including the beam delivery/forming(shaping) system and optional features such as gas nozzles, material (e.g. powder, wire) feed system; HLMs where the relevant devices are connected by a beam guidance system (e.g. optical fibre) and power/control cables to an external laser assembly device and which includes only the beam delivery/forming(shaping) system and optional features such as gas nozzles, material (e.g. powder, wire) feed system; laser processing machines where the workpiece is manually moved under/relative to the laser beam (see informative Annex A). The intended use of HLMs covers both: movement of elements or workpieces by hand to be processed under/relatively to stationary laser beams as shielded , and movement of the laser processing head (beam shaping device) by hand to move laser beam(s) over or relative to elements or workpieces to be processed. Laser processing machines, where laser processing is performed with hand-held or hand-operated workpieces outside the fixed (neither hand-held nor hand-operated by the operator or user) laser processing machines are out of the scope of this document. Su
- Standard71 pagesEnglish languagesale 15% off
- Standard77 pagesFrench languagesale 15% off
ISO 11553-2:2026 This document deals with all significant hazards, hazardous situations or hazardous events relevant to hand-held or hand-operated laser processing machines (HLMs), when they are used as intended and under conditions of misuse which are reasonably foreseeable by the manufacturer. HLM is the machine, as defined in ISO 11553-1:2020, 3.7, in which laser radiation is generated, where the laser provides sufficient energy/power to cause a phase transition in a part of the workpiece and where the laser output or workpiece to be processed is guided manually or hand-held during the laser material processing.
This document defines general design requirements of HLM. HLM includes the laser device, beam-guiding device (e.g. mirror, fibre, lenses), beam-shaping device (e.g. telescope, focusing), and controls. The laser assembly as an integral part of the HLM or only the laser processing head is hand-held or hand-operated during the laser material processing.
This document does not apply
- to laser processing machines which are remotely controlled by a manual controller (hand-operated controller), such as joy sticks, keyboard, etc., without touching a workpiece or a part mechanically connected with the laser material processing head by using the hand(s) of the operator (user)
- to laser processing machines without a drive system which may not belong to machinery. And the laser processing apparatus without moving parts, which may not be considered as machinery in “Type C standard”.
- to medical or cosmetic applications for the treatment of living human or animal tissue;
- to weapon applications, (e.g. such as with regard to military applications, direct close combat.)
NOTE “hand-operated laser processing machine” is synonymous with “hand-guided laser processing machine” in this document. Hand-operated laser processing machines often use manual force reduction means such as wheels, supports, etc., for manual positioning of the laser processing heads or the workpieces.
It is applicable to HLMs using laser radiation to process materials.
The purpose of this document is to draw attention to the hazards related to HLMs and to prevent personal injury. Depending on the application and the location/operating conditions of HLMs, a number of different significant hazards can arise. This document describes both the areas of hazards analysis and risk assessment as well as protective measures.
Requirements dealing with noise as a hazard are covered by ISO 11553-3:2013.
This document does not apply to laser products or equipment manufactured solely or expressly for applications which are excluded from the Scope of ISO 11553-1:2020. This document is not applicable for HLMs which have been manufactured before the date of publication of this standard.
HLMs include the following types:
HLMs which are designed as all-in-one laser assembly including the beam delivery/forming(shaping) system and optional features such as gas nozzles, material (e.g. powder, wire) feed system;
HLMs where the relevant devices are connected by a beam guidance system (e.g. optical fibre) and power/control cables to an external laser assembly device and which includes only the beam delivery/forming(shaping) system and optional features such as gas nozzles, material (e.g. powder, wire) feed system;
laser processing machines where the workpiece is manually moved under/relative to the laser beam (see informative Annex A).
The intended use of HLMs covers both:
movement of elements or workpieces by hand to be processed under/relatively to stationary laser beams as shielded , and
movement of the laser processing head (beam shaping device) by hand to move laser beam(s) over or relative to elements or workpieces to be processed.
Laser processing machines, where laser processing is performed with hand-held or hand-operated workpieces outside the fixed (neither hand-held nor hand-operated by the operator or user) laser processing machines are out of the scope
- Standard71 pagesEnglish languagesale 15% off
- Standard71 pagesFrench languagesale 15% off
IEC 60679-2:2026 describes the general properties, performance characteristics and usage precautions for quartz crystal oscillators. This document mainly describes crystal oscillators, but some descriptions also apply to oscillators other than crystal units (e.g. MEMS resonators).
This edition includes the following significant technical changes with respect to the previous edition:
a) some new contents that reflect the latest manufacturing technologies;
b) added contents about the operating principle of crystal oscillators;
c) added contents about usage precautions for crystal oscillators.
- Standard93 pagesEnglish and French languagesale 15% off
- Standard93 pagesEnglish and French languagesale 15% off
- Amendment9 pagesEnglish languagee-Library read for1 day
This document specifies procedures and techniques for obtaining comparable values for the absorptance of optical laser components.
- Standard26 pagesEnglish languagee-Library read for1 day
This part of IEC 60115 is applicable to fixed power resistors with axial leads for through hole assembly (THT) on circuit boards for use in electronic equipment.
The document is applicable to the drafting of detail specifications for fixed low-power film resistors with leads classified to level G, which is defined in IEC 60115-1:2020, 3.4 for general electronic equipment, typically operated under benign or moderate environmental conditions, where the major requirement is function. Examples for level G include consumer products and telecommunication user terminals.
This detail specification is based upon the blank detail specification IEC 60115-4-10:202X. This detail specification establishes test schedules and performance requirements permitting the quality assessment of the resistors covered herein according to the quality assessment procedures prescribed by IEC 60115-1:2020, Annex Q.
- Standard50 pagesEnglish languagee-Library read for1 day
This part of IEC 60115 is applicable to fixed power resistors with axial leads for through hole assembly (THT) on circuit boards for use in electronic equipment. The document is applicable to the drafting of detail specifications for fixed low-power film resistors with leads classified to level G, which is defined in IEC 60115-1:2020, 3.4 for general electronic equipment, typically operated under benign or moderate environmental conditions, where the major requirement is function. Examples for level G include consumer products and telecommunication user terminals. This detail specification is based upon the blank detail specification IEC 60115-4-10:202X. This detail specification establishes test schedules and performance requirements permitting the quality assessment of the resistors covered herein according to the quality assessment procedures prescribed by IEC 60115-1:2020, Annex Q.
- Amendment6 pagesEnglish languagee-Library read for1 day
This part of IEC 61760 defines requirements for component specifications of electronic components that are intended for usage in surface mounting technology. To this end, it specifies a reference set of process conditions and related test conditions to be considered when compiling component specifications.
The objective of this document is to ensure that a wide variety of SMDs can be subjected to the same placement, mounting and subsequent processes (e.g. cleaning, inspection) during assembly. This document defines tests and requirements that are included in any SMD component’s general, sectional or detail specification. In addition, this document provides component users and manufacturers with a reference set of typical process conditions used in surface mounting technology.
Some of the requirements for component specifications in this document are also applicable to components with leads intended for mounting on a circuit board, including solderless interconnection technology. Cases for which this is appropriate are indicated in the relevant subclauses.
NOTE Solderless interconnection technology refers to a mounting method which is not part of the surface-mounting process and the components do not undergo a soldering operation. Such components are included in this document because the mounting of components for solderless interconnection commonly occurs after the mounting of SMDs.
- Standard55 pagesEnglish languagee-Library read for1 day
This document specifies the protective cover for all receptacles series 2 and series 31 used in the family of rectangular electrical connectors.
The receptacle connectors corresponding to those protective covers are specified in EN 4165-004, EN 4165-011 and EN 4165-025.
- Standard10 pagesEnglish languagee-Library read for1 day
This document specifies the female coding and attachment system for mounting on free housing in the family of rectangular electrical connectors with sealed and non-sealed rear, plastic housing, locking device, for operating temperatures from -55 °C to 175 °C.
- Standard7 pagesEnglish languagee-Library read for1 day
This part of IEC 61249 specifies requirements for properties of polytetrafluoroethylene (PTFE) filled unreinforced laminated sheet of a thickness 0,02 mm up to 3,2 mm, of defined flammability (vertical burning test), copper-clad.
This document is applicable to the design, manufacture, use of PTFE filled unreinforced laminated sheet of defined flammability (vertical burning test), copper-clad.
Its flame resistance is defined in terms of the flammability requirements of 8.3.
- Standard23 pagesEnglish languagee-Library read for1 day
This document defines basic terms, symbols and units of measurement for the field of laser technology in order to unify the terminology, and to arrive at clear definitions and reproducible tests of beam parameters and laser-oriented product properties.
NOTE The laser hierarchical vocabulary laid down in this document differs from that given in IEC 60825–1. ISO and IEC have discussed this difference and agree that it reflects the different purposes for which the two standards serve. For more details, see informative Annex A.
- Standard27 pagesEnglish languagee-Library read for1 day
This part of IEC 62321 specifies one technique for the determination of short-chain and medium-chain chlorinated paraffins (SCCPs: C10-C13 and MCCPs: C14-C17) in plastics of electrotechnical products.
This document specifies a quantitative method for the determination of short-chain and mediumchain chlorinated paraffins in electrotechnical products by means of solvent extraction and gas chromatography-negative chemical ionization-mass spectrometry (GC-NCI-MS).
This test method has been evaluated for use with ABS (acrylonitrile butadiene styrene) and PVC (polyvinyl chloride) containing individual SCCPs ranging from 369,7 mg/kg to 8 653,9 mg/kg and MCCPs ranging from 2 141,1 mg/kg to 27 329,6 mg/kg as shown in the pre-IIS 14 results in Annex C. The use of this test method for other plastics and concentration ranges has not been specifically evaluated.
This document is a basic environment horizontal publication focusing on test methods and is primarily intended for use by committees in the preparation of publications within the area of environment in accordance with the principles laid down in IEC Guide 123. Wherever applicable, it is the responsibility of committees to make use of environment basic publications in the preparation of their environment group and product publications. Committees can apply this document directly to products when they do not develop a product publication in the area of environment.
WARNING – Persons using this International Standard should be familiar with normal laboratory practice. This International Standard does not purport to address all of the safety problems, if any, associated with its use. It is the responsibility of the user to establish appropriate safety and health practices and to ensure compliance with any national regulatory conditions.
- Standard26 pagesEnglish languagee-Library read for1 day
- Standard26 pagesEnglish languagee-Library read for1 day
This document specifies procedures and techniques for obtaining comparable values for the absorptance of optical laser components.
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- Standard18 pagesFrench languagesale 15% off
This document specifies methods by which the measurement of irradiance (fluence) distribution is made and specifies parameters for the characterization of the spatial properties of laser irradiance (fluence) distribution functions at a given plane.
The methods given in this document are intended to be used for the testing and characterization of both continuous wave (cw) and pulsed laser beams used in optics and optical instruments.
This document provides definitions of terms and symbols to be used in referring to irradiance distribution, as well as requirements for its measurement. For pulsed lasers, the distribution of time-integrated irradiance (i.e. radiant exposure) is the quantity most often measured.
- Standard26 pagesEnglish languagee-Library read for1 day
This part of IEC 62321 describes the screening analysis of substances, specifically lead (Pb), mercury (Hg), cadmium (Cd), total chromium (Cr), total bromine (Br), total phosphorus (P), assuming the source of P is related to TCEP (CAS 115-96-8), Trixylyl‑phosphate (CAS 25155-23-1), total chlorine (Cl), assuming the source of Cl is related to SCCP (CAS 85535-84-8), TCEP (CAS 115-96-8) , TBTC (CAS 1461-22-9), total tin (Sn), assuming the source of Sn is related to restricted organo‑tin compounds, total antimony (Sb), assuming the source of Sb is related to Pyrochlore, and antimony lead yellow (CAS 8012-00-8) in uniform materials found in electrotechnical products, using the analytical technique of X‑ray fluorescence (XRF) spectrometry.
The same methodology can also be used for screening of substances discussed as critical raw materials in various countries (for example currently discussed in the EU: antimony (Sb), baryte, bismuth (Bi), cobalt (Co), fluorspar, gallium (Ga), germanium (Ge), hafnium (Hf), indium (In), magnesium (Mg), niobium (Nb), phosphorus (P), scandium (Sc), tantalum (Ta), tungsten (W), vanadium (V), platinum group metals, heavy rare earth elements, light rare earth elements).
NOTE From EU information on critical raw materials [1]1 raw materials are crucial to Europe's economy. They form a strong industrial base, producing a broad range of goods and applications used in everyday life and modern technologies. Reliable and unhindered access to certain raw materials is a growing concern within the EU and across the globe. To address this challenge, the European Commission has created a list of critical raw materials (CRMs) for the EU, which is subject to a regular review and update. CRMs combine raw materials of high importance to the EU economy and of high risk associated with their supply.
The method is applicable to plastics, metals and ceramic materials. The test method can be applied to raw materials, individual materials taken from products and "homogenized" mixtures of more than one material. Screening of a sample is performed using any type of XRF spectrometer, provided it has the performance characteristics specified in this test method. Not all types of XRF spectrometers are suitable for all sizes and shapes of sample. The appropriate spectrometer design will be selected with care for the task concerned.
The performance of this test method has been tested for the following substances in various media and within the concentration ranges as specified in Table 1 to Table 5. During an IIS (international interlaboratory study) the feasibility of the test method to use for the added elements was tested. The results are listed in Table 6 to Table 10.
These substances in similar media outside of the specified concentration ranges can be analysed according to this test method; however, the performance has not been established for this document.
WARNING – Persons using this International Standard should be familiar with normal laboratory practice. This standard does not purport to address all of the safety problems, if any, associated with its use. It is the responsibility of the user to establish appropriate safety and health practices and to ensure compliance with any national regulatory conditions.
This document is a basic environment horizontal publication focusing on test methods and is primarily intended for use by committees in the preparation of publications within the area of environment in accordance with the principles laid down in IEC Guide 123. Wherever applicable, it is the responsibility of committees to make use of environment basic publications in the preparation of their environment group and product publications. Committees can apply this document directly to products when they do not develop a product publication in the area of environment.
- Standard50 pagesEnglish languagee-Library read for1 day
- Standard50 pagesEnglish languagee-Library read for1 day
This part of IEC 61760 specifies the classification of moisture sensitive device into moisture sensitivity level related to soldering heat, and provisions for packaging, labelling and handling.
It extends the classification and packaging methods to such components, where currently existing standards are not required or not appropriate. For such cases, this document
introduces additional moisture sensitivity levels and an alternative method for packaging. This document applies to devices intended for reflow soldering, like surface mount devices, including specific through-hole devices (where the device supplier has specifically documented support for reflow soldering), but not to
– semiconductor devices,
– devices for flow (wave) soldering.
NOTE Background of this document and its relation to currently existing standards, e.g. IEC 60749-20 [1] or J-STD-020F [2] and J-STD-033 [3], are described in the Introduction.
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This part of IEC 63171 covers two-way, shielded or unshielded, free and fixed connectors known as Type 1, for balanced single-pair data transmission with frequencies up to 600 MHz and with current carrying capacity up to 2,0 A at 60 °C.
It specifies the common dimensions, and provides the mechanical, electrical, signal integrity, and environmental characteristics, the reliability specifications and corresponding tests for these connectors.
- Standard24 pagesEnglish languagee-Library read for1 day
IEC 61076-8-110:2026 This part describes free and fixed rectangular connectors, hereinafter referred to as “connector”, with:
2P power plus 2P signal contacts;
- plastic housing with locking lever and four possible codings;
- 300 A rated current, 1 000 V DC rated voltage on the power section;
- 5 A rated current, 50 V DC rated voltage on the signal section;
- individual shielding around each power contact with relevant shielding termination;
- IP65/IP68 degree of protection when mated and locked and IPXXB on both plug and receptacle parts when unmated
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IEC 61076-2-117:2026 This part covers shielded and unshielded, free and fixed circular connectors without breaking capacity (COC) for power, signal and data transmission, and specifies the common dimensions, mechanical, electrical and transmission characteristics and environmental requirements as well as test specifications, respectively.
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- Standard184 pagesEnglish and French languagesale 15% off
This part of IEC 60115 is applicable to fixed power resistors with axial leads for through hole assembly (THT) on circuit boards for use in electronic equipment. The document is applicable to the drafting of detail specifications for fixed low-power film resistors with leads classified to level G, which is defined in IEC 60115-1:2020, 3.4 for general electronic equipment, typically operated under benign or moderate environmental conditions, where the major requirement is function. Examples for level G include consumer products and telecommunication user terminals. This detail specification is based upon the blank detail specification IEC 60115-4-10:202X. This detail specification establishes test schedules and performance requirements permitting the quality assessment of the resistors covered herein according to the quality assessment procedures prescribed by IEC 60115-1:2020, Annex Q.
- Standard50 pagesEnglish languagee-Library read for1 day
This part of IEC 60115 is applicable to fixed power resistors with axial leads for through hole assembly (THT) on circuit boards for use in electronic equipment. The document is applicable to the drafting of detail specifications for fixed low-power film resistors with leads classified to level G, which is defined in IEC 60115-1:2020, 3.4 for general electronic equipment, typically operated under benign or moderate environmental conditions, where the major requirement is function. Examples for level G include consumer products and telecommunication user terminals. This detail specification is based upon the blank detail specification IEC 60115-4-10:202X. This detail specification establishes test schedules and performance requirements permitting the quality assessment of the resistors covered herein according to the quality assessment procedures prescribed by IEC 60115-1:2020, Annex Q.
- Amendment6 pagesEnglish languagee-Library read for1 day
IEC PAS 63720:2026 defines standardized routing parameter tables applicable to the design of rigid circuit board with mechanically or laser drilled vias.
These parameter tables are based on the concept of "Routing Classes" initially introduced in the French standard NF-93713 (1971-1989, cancelled: 2019). They are linked to the pitch of electronic components (e.g., BGA, QFN, connector, etc.) and thus allow a better coupling with component and circuit board manufacturers.
They can be easily integrated into EDA tools to facilitate the work of designers, while ensuring a common standard of communication between customers and manufacturers.
Routing classes should not be confused with IPC performance classes, which are used in the context of circuit board acceptance (IPC-A-600) as well as qualification and performance (IPC-6012) standards. Additional information on circuit board design is provided by IPC-2221 (Generic Standard on Printed Board Design), IPC-2222 (Sectional Design Standard for Rigid Organic Printed Boards) and IPC-2226 (Sectional Design Standard for High Density Interconnect (HDI) Printed Boards).
This document is based on French AFNOR Spec 2212 and was submitted as a PAS document.
- Technical specification24 pagesEnglish languagesale 15% off
IEC 63287-3:2026 specifies guidelines for a reliability qualification plan for power semiconductor modules to assure reliability targets over the entire product life.
Power semiconductor modules with incorporated control circuits are excluded. Clamped packages that need external pressure for being mounted in a system are excluded, e.g. disc-type pressure pack devices.
This document is not intended for medical, military, aeronautics and astronautics-related applications.
NOTE Throughout the document, the term power semiconductor module refers to multichip semiconductor power modules as defined in IEC 60191-4.
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IEC 63203-403-1:2026 specifies test methods for surface electromyography (sEMG) sensors by evaluating the quality of sEMG signals obtained from contracting the muscles of the forearm and hand for wearable applications. It is applicable to sEMG sensors that are used to decipher movement intentions and use them as control signals in situations such as virtual reality, game, unmanned aerial vehicles (UAV), robot control, and home automation. This document does not apply to sEMG sensors intended for medical diagnosis or treatment. For medical devices, national requirements can apply.
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This part of IEC 63171 covers two-way, shielded or unshielded, free and fixed connectors known as Type 1, for balanced single-pair data transmission with frequencies up to 600 MHz and with current carrying capacity up to 2,0 A at 60 °C. It specifies the common dimensions, and provides the mechanical, electrical, signal integrity, and environmental characteristics, the reliability specifications and corresponding tests for these connectors
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This part of IEC 61760 specifies the classification of moisture sensitive device into moisture sensitivity level related to soldering heat, and provisions for packaging, labelling and handling.
It extends the classification and packaging methods to such components, where currently existing standards are not required or not appropriate. For such cases, this document
introduces additional moisture sensitivity levels and an alternative method for packaging. This document applies to devices intended for reflow soldering, like surface mount devices, including specific through-hole devices (where the device supplier has specifically documented support for reflow soldering), but not to
– semiconductor devices,
– devices for flow (wave) soldering.
NOTE Background of this document and its relation to currently existing standards, e.g. IEC 60749-20 [1] or J-STD-020F [2] and J-STD-033 [3], are described in the Introduction.
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IEC 62146-1:2026 is available as IEC 62146-1:2026 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62146-1:2026 includes generalities of capacitors used on alternating current circuit-breakers and introduces specifications for grading capacitors. Regarding grading capacitors, their function is to control the voltage distribution across the individual interrupter units of a multi-break circuit-breaker.
This document applies to grading capacitors falling into one or both of the following categories for:
- mounting on air-insulated circuit-breakers.
- mounting on enclosed circuit-breakers (for example immersed in insulating gas, in oil, etc.).
The object of this document is:
- to define uniform rules regarding performances, testing and rating;
- to define specific safety rules;
- to provide a guidance for installation and operation.
This document does not apply to capacitors not directly associated with high-voltage alternating current circuit-breakers.
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This document specifies methods by which the measurement of irradiance (fluence) distribution is made and specifies parameters for the characterization of the spatial properties of laser irradiance (fluence) distribution functions at a given plane.
The methods given in this document are intended to be used for the testing and characterization of both continuous wave (cw) and pulsed laser beams used in optics and optical instruments.
This document provides definitions of terms and symbols to be used in referring to irradiance distribution, as well as requirements for its measurement. For pulsed lasers, the distribution of time-integrated irradiance (i.e. radiant exposure) is the quantity most often measured.
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This document defines basic terms, symbols and units of measurement for the field of laser technology in order to unify the terminology, and to arrive at clear definitions and reproducible tests of beam parameters and laser-oriented product properties.
NOTE The laser hierarchical vocabulary laid down in this document differs from that given in IEC 60825–1. ISO and IEC have discussed this difference and agree that it reflects the different purposes for which the two standards serve. For more details, see informative Annex A.
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This document specifies a method of testing the laser-induced ignition and damage of medical beam delivery systems to allow checking of suitable products according to the classification system.
NOTE 1 Take care when interpreting these results, since the direct applicability of the results of this test method to the clinical situation has not been fully established.
NOTE 2 Users of products tested by this method are cautioned that the laser will be wavelength sensitive and tested at the wavelength for which it is intended to be used. If tested using other wavelengths, the power settings and modes of beam delivery need to be explicitly stated.
CAUTION — This test method can involve hazardous materials, operations and equipment. This document provides advice on minimizing some of the risks associated with its use but does not purport to address all such risks. It is the responsibility of the user of this document to establish appropriate safety and health practices and to determine the applicability of regulatory limitations prior to use.
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IEC 62228-7:2026 specifies test and measurement methods for the EMC evaluation of CXPI transceiver ICs under network condition. It defines test configurations, test conditions, test signals, failure criteria, test procedures, test setups and test boards. This specification is applicable for standard CXPI transceiver ICs and ICs with embedded CXPI transceiver and covers:
- the emission of RF disturbances;
- the immunity against RF disturbances;
- the immunity against impulses;
- the immunity against electrostatic discharges (ESD).
This edition includes the following significant technical changes with respect to the previous edition:
a) change transceiver terms and definitions from master to commander and slave to responder in 3.1.5 and 3.1.6.
b) change test configuration for embedded transceiver in 5.3.1 and add on Figure A.4 accordingly.
c) change the definition of TX2 test signal for Type-B transceiver in 5.4.2.
d) add examples for test limits in Annex C.
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IEC TR 62271-322: 2026 describes trends and the state-of-the-art of digital technologies enabling their use in switchgear and controlgear along their life cycle. The report is a guidance for the IEC TC17 and supported by use cases or by emerging technologies, able to be implemented in power grids. The report can be used by designers, asset managers and any stakeholder dealing with interoperable and digital technologies for a switchgear and controlgear over their whole life cycle. The document consists of three main parts.
Clause 4 describes the trends in user exploitation of digital technologies within the switchgear and controlgear. Clause 5 focuses on trends regarding technology and consequences for system architectures. Clause 6 gives guidance for use of new technologies in substations.
This edition includes the following significant technical changes with respect to the previous edition:
a) IEC numbering has been modified;
b) title has been modified;
c) updates in the field of digital technologies, like Internet of Things, cloud and edge computing, digital twins, artificial intelligence and cybersecurity have been added; in accordance with the IEC strategy themes and goals;
d) synchronization and updates in the context of the latest standards of TC 17: IEC 62271-1 and IEC 62271-3;
e) Bibliography has been added.
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This document defines basic terms, symbols and units of measurement for the field of laser technology in order to unify the terminology, and to arrive at clear definitions and reproducible tests of beam parameters and laser-oriented product properties. NOTE The laser hierarchical vocabulary laid down in this document differs from that given in IEC 60825–1. ISO and IEC have discussed this difference and agree that it reflects the different purposes for which the two standards serve. For more details, see informative Annex A.
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This document specifies methods by which the measurement of irradiance (fluence) distribution is made and specifies parameters for the characterization of the spatial properties of laser irradiance (fluence) distribution functions at a given plane. The methods given in this document are intended to be used for the testing and characterization of both continuous wave (cw) and pulsed laser beams used in optics and optical instruments. This document provides definitions of terms and symbols to be used in referring to irradiance distribution, as well as requirements for its measurement. For pulsed lasers, the distribution of time-integrated irradiance (i.e. radiant exposure) is the quantity most often measured.
- Standard18 pagesEnglish languagesale 15% off
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