Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases (IEC 60749-7:2025)

IEC 60749-7:2025 specifies the testing and measurement of water vapour and other gas content of the atmosphere inside a metal or ceramic hermetically sealed device. The test is used as a measure of the quality of the sealing process and to provide information about the long-term chemical stability of the atmosphere inside the package. It is applicable to semiconductor devices sealed in such a manner but generally only used for high reliability applications such as military or aerospace.
Of particular interest is the measurement of the primary sealing gases (or lack thereof), the moisture content, the presence of bombing gases that are indicative of non-hermeticity (e.g. helium), oxygen to argon ratio indicative of room air ~ 20 to 1 (± 10 %), dissimilar concentration of internally sealed gases (e.g. nitrogen, helium) than originally sealed in the device package, the presence of leak test fluid (i.e. fluorocarbon, helium, air), and all other gases to determine if the device meets the specified moisture, hermeticity and other criteria. Also of interest is the measurement of all the other gases since they reflect upon the quality of the sealing process and provide information about the long-term chemical stability of the atmosphere inside the device. The presence of leak test fluorocarbon vapour in the internal gas analysis (IGA) is an indication of failure to meet leak test requirements of IEC 60749‑8.
This test is destructive.
This edition includes the following significant technical changes with respect to the previous edition:
a) This document has been re-written and rearranged to align with the text of MIL-STD-883, Method 1018.10.
b) Additional detail has been provided in the calibration requirements.

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 7: Messung des inneren Feuchtegehaltes und Analyse von anderen Restgasen (IEC 60749-7:2025)

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 7: Mesure de la teneur en humidité interne et analyse des autres gaz résiduels (IEC 60749-7:2025)

L’IEC 60749-7:2025 spécifie les essais et les mesures de la teneur en vapeur d'eau et en autres gaz de l'atmosphère à l'intérieur d'un dispositif métallique ou céramique scellé hermétiquement. L'essai vise à mesurer la qualité du procédé de scellement et à donner des informations relatives à la stabilité chimique à long terme de l'atmosphère à l'intérieur du boîtier. Il est applicable à tous les dispositifs à semiconducteurs scellés de cette manière, mais généralement réservés pour les applications à haute fiabilité comme dans les domaines militaire et spatial.
Le mesurage des principaux gaz d'étanchéité (ou de leur absence), de la teneur en humidité, de la présence de gaz de bombardement révélatrice de l'absence d'herméticité (l'hélium, par exemple), du rapport oxygène/argon révélateur d'un air ambiant d'environ 20:1 (± 10 %), de la concentration différente de gaz scellé en interne (l'azote ou l'hélium, par exemple) par rapport à celui d'origine scellé dans le boîtier du dispositif, de la présence d'une fuite de liquide d'essai (c'est-à-dire le fluorocarbure, l'hélium, l'air) et de tous les autres gaz permettant de déterminer si le dispositif satisfait aux critères spécifiés en matière d'humidité, d'herméticité, etc., présente un intérêt particulier. Le mesurage de tous les autres gaz reflétant la qualité du procédé de scellement et donnant des informations relatives à la stabilité chimique à long terme de l'atmosphère à l'intérieur du dispositif présente également un intérêt. La présence d'une fuite de vapeur de fluorocarbure d'essai dans l'analyse des gaz internes (IGA, Internal Gas Analysis) est révélatrice d'une défaillance à satisfaire aux exigences d'essai de fuite de l'IEC 60749‑8.
Cet essai est destructif.
Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
a) Le présent document a été remanié et réorganisé de manière à l'aligner sur le texte de la MIL-STD-883, méthode 1018.10.
b) Des détails supplémentaires ont été fournis dans les exigences d'étalonnage.

Polprevodniški elementi - Metode za mehansko in klimatsko preskušanje - 7. del: Merjenje količine notranje vlage in analiza drugih preostalih plinov (IEC 60749-7:2025)

General Information

Status
Published
Public Enquiry End Date
31-Jan-2025
Publication Date
27-Jan-2026
Technical Committee
I11 - Imaginarni 11
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
20-Jan-2026
Due Date
27-Mar-2026
Completion Date
28-Jan-2026

Relations

Effective Date
01-Mar-2026

Overview

EN IEC 60749-7:2026 specifies internal gas analysis (IGA) methods for measuring water vapour and other residual gases inside metal or ceramic hermetically sealed semiconductor devices. The procedure is a destructive test used primarily for high‑reliability applications (for example, military and aerospace) to verify sealing quality and to assess long‑term chemical stability of the package atmosphere. This edition has been re-written to align with MIL‑STD‑883 Method 1018.10 and includes expanded calibration requirements.

Key Topics

  • Scope and purpose: Measurement of primary sealing gases, moisture content, presence of bombing/leakage indicators (e.g., helium), oxygen-to-argon ratios, and leak-test traces such as fluorocarbon vapour.
  • Instrumentation: Mass spectrometer capable of reading 1–140 AMU, with signal‑to‑noise ratio >= 20:1 for specified detection limits.
  • Detection limits:
    • Moisture: capable of detecting specified limits (example 5 000 ppmv) with reproducible SNR ≥ 20:1; minimum moisture detection limit 250 ppmv.
    • Other gases: minimum detection limit 50 ppmv for nitrogen, oxygen, argon, carbon dioxide, hydrogen, helium and fluorocarbons. Fluorocarbons are identified by masses 69 and 119.
  • Test fixtures and chambers: Vacuum opening chamber with vacuum transfer passage to preserve moisture during transfer; piercing arrangement to release internal gas without breaking chamber vacuum; pressure sensing device to record relative pressure rise on puncture.
  • Calibration & controls: Laboratory calibration capability for moisture (two‑pressure, divided flow or cryogenic methods), dew point hygrometer recalibrated at least annually and capable of ±0.2 °C accuracy; pressure sensor accuracy ±300 Pa in the measurement range; quarterly system qualification and daily calibration checks are defined.

Applications

  • Quality assurance: Confirms hermeticity and sealing process integrity during incoming inspection, failure analysis and R&D for hermetic packages.
  • Reliability engineering: Provides insight into long‑term chemical stability of the internal atmosphere, detection of contamination or ingress, and verification after leak testing (IEC 60749‑8).
  • High‑reliability sectors: Particularly relevant for aerospace, military, and other mission‑critical electronics where package atmosphere composition affects lifetime and performance.

Related Standards

  • IEC 60749 series (mechanical and climatic test methods for semiconductor devices) - Part 8 referenced for leak‑test requirements.
  • MIL‑STD‑883, Method 1018.10 - alignment of procedure and structure in this edition.

Practical value: EN IEC 60749‑7:2026 provides a standardized, laboratory‑grade approach to quantify internal moisture and gas composition. By specifying instrumentation, calibration, detection limits and test practice, it enables consistent assessment of hermeticity and helps prevent latent field failures in high‑reliability semiconductor packages.

Standard

SIST EN IEC 60749-7:2026

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16 pages
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Frequently Asked Questions

SIST EN IEC 60749-7:2026 is a standard published by the Slovenian Institute for Standardization (SIST). Its full title is "Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases (IEC 60749-7:2025)". This standard covers: IEC 60749-7:2025 specifies the testing and measurement of water vapour and other gas content of the atmosphere inside a metal or ceramic hermetically sealed device. The test is used as a measure of the quality of the sealing process and to provide information about the long-term chemical stability of the atmosphere inside the package. It is applicable to semiconductor devices sealed in such a manner but generally only used for high reliability applications such as military or aerospace. Of particular interest is the measurement of the primary sealing gases (or lack thereof), the moisture content, the presence of bombing gases that are indicative of non-hermeticity (e.g. helium), oxygen to argon ratio indicative of room air ~ 20 to 1 (± 10 %), dissimilar concentration of internally sealed gases (e.g. nitrogen, helium) than originally sealed in the device package, the presence of leak test fluid (i.e. fluorocarbon, helium, air), and all other gases to determine if the device meets the specified moisture, hermeticity and other criteria. Also of interest is the measurement of all the other gases since they reflect upon the quality of the sealing process and provide information about the long-term chemical stability of the atmosphere inside the device. The presence of leak test fluorocarbon vapour in the internal gas analysis (IGA) is an indication of failure to meet leak test requirements of IEC 60749‑8. This test is destructive. This edition includes the following significant technical changes with respect to the previous edition: a) This document has been re-written and rearranged to align with the text of MIL-STD-883, Method 1018.10. b) Additional detail has been provided in the calibration requirements.

IEC 60749-7:2025 specifies the testing and measurement of water vapour and other gas content of the atmosphere inside a metal or ceramic hermetically sealed device. The test is used as a measure of the quality of the sealing process and to provide information about the long-term chemical stability of the atmosphere inside the package. It is applicable to semiconductor devices sealed in such a manner but generally only used for high reliability applications such as military or aerospace. Of particular interest is the measurement of the primary sealing gases (or lack thereof), the moisture content, the presence of bombing gases that are indicative of non-hermeticity (e.g. helium), oxygen to argon ratio indicative of room air ~ 20 to 1 (± 10 %), dissimilar concentration of internally sealed gases (e.g. nitrogen, helium) than originally sealed in the device package, the presence of leak test fluid (i.e. fluorocarbon, helium, air), and all other gases to determine if the device meets the specified moisture, hermeticity and other criteria. Also of interest is the measurement of all the other gases since they reflect upon the quality of the sealing process and provide information about the long-term chemical stability of the atmosphere inside the device. The presence of leak test fluorocarbon vapour in the internal gas analysis (IGA) is an indication of failure to meet leak test requirements of IEC 60749‑8. This test is destructive. This edition includes the following significant technical changes with respect to the previous edition: a) This document has been re-written and rearranged to align with the text of MIL-STD-883, Method 1018.10. b) Additional detail has been provided in the calibration requirements.

SIST EN IEC 60749-7:2026 is classified under the following ICS (International Classification for Standards) categories: 19.020 - Test conditions and procedures in general; 31.080.01 - Semiconductor devices in general. The ICS classification helps identify the subject area and facilitates finding related standards.

SIST EN IEC 60749-7:2026 has the following relationships with other standards: It is inter standard links to SIST EN 60749-7:2011. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.

SIST EN IEC 60749-7:2026 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.

Standards Content (Sample)


SLOVENSKI STANDARD
01-marec-2026
Nadomešča:
SIST EN 60749-7:2011
Polprevodniški elementi - Metode za mehansko in klimatsko preskušanje - 7. del:
Merjenje količine notranje vlage in analiza drugih preostalih plinov (IEC 60749-
7:2025)
Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal
moisture content measurement and the analysis of other residual gases (IEC 60749-
7:2025)
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 7: Messung
des inneren Feuchtegehaltes und Analyse von anderen Restgasen (IEC 60749-7:2025)
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 7:
Mesure de la teneur en humidité interne et analyse des autres gaz résiduels (IEC 60749-
7:2025)
Ta slovenski standard je istoveten z: EN IEC 60749-7:2026
ICS:
19.020 Preskuševalni pogoji in Test conditions and
postopki na splošno procedures in general
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 60749-7

NORME EUROPÉENNE
EUROPÄISCHE NORM January 2026
ICS 31.080.01 Supersedes EN 60749-7:2011
English Version
Semiconductor devices - Mechanical and climatic test methods -
Part 7: Internal moisture content measurement and the analysis
of other residual gases
(IEC 60749-7:2025)
Dispositifs à semiconducteurs - Méthodes d'essais Halbleiterbauelemente - Mechanische und klimatische
mécaniques et climatiques - Partie 7: Mesure de la teneur Prüfverfahren - Teil 7: Messung des inneren
en humidité interne et analyse des autres gaz résiduels Feuchtegehaltes und Analyse von anderen Restgasen
(IEC 60749-7:2025) (IEC 60749-7:2025)
This European Standard was approved by CENELEC on 2026-01-01. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2026 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 60749-7:2026 E

European foreword
The text of document 47/2861/CDV, future edition 3 of IEC 60749-7, prepared by TC 47
"Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 60749-7:2026.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2027-01-31
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2029-01-31
document have to be withdrawn
This document supersedes EN 60749-7:2011 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 60749-7:2025 was approved by CENELEC as a European
Standard without any modification.
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1  Where an International Publication has been modified by common modifications, indicated by (mod),
the relevant EN/HD applies.
NOTE 2  Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cencenelec.eu.
Publication Year Title EN/HD Year
IEC 60749-8 - Semiconductor devices - Mechanical and EN 60749-8 -
climatic test methods - Part 8: Sealing

IEC 60749-7 ®
Edition 3.0 2025-11
INTERNATIONAL
STANDARD
Semiconductor devices - Mechanical and climatic test methods -
Part 7: Internal moisture content measurement and the analysis of other residual
gases
ICS 31.080.01  ISBN 978-2-8327-0867-5

IEC 60749-7:2025-11(en)
IEC 60749-7:2025 © IEC 2025
CONTENTS
FOREWORD . 2
1 Scope . 4
2 Normative references . 4
3 Terms and definitions . 4
4 Test apparatus – Mass spectrometer . 4
4.1 Internal gas analysis (IGA) laboratory . 4
4.2 Mass spectrometer requirements . 5
4.2.1 Spectra range . 5
4.2.2 Moisture content . 5
4.2.3 Other gases . 5
4.2.4 Minimum detection limit for moisture . 5
4.2.5 Minimum detection limit for other gases. 5
4.3 Vacuum opening chamber . 5
4.4 Temperature control . 5
4.5 Piercing arrangement . 5
4.6 Pressure sensing device. 6
4.7 Package simulators. 6
4.8 Calibration capability . 6
5 Calibration requirements . 6
5.1 System calibration requirements . 6
5.2 Quarterly calibration for other gases . 7
5.3 Daily calibration check . 7
5.4 Daily calibration check substitution . 8
6 Procedure . 8
7 Failure criteria . 9
8 Implementation . 10
9 Summary . 11
Bibliography . 12

IEC 60749-7:2025 © IEC 2025
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
Semiconductor devices -
Mechanical and climatic test methods -
Part 7: Internal moisture content measurement
and the analysis of other residual gases

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as "IEC Publication(s)"). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) IEC draws attention to the possibility that the implementation of this document may involve the use of (a)
patent(s). IEC takes no position concerning the evidence, validity or applicability of any claimed patent rights in
respect thereof. As of the date of publication of this document, IEC had not received notice of (a) patent(s), which
may be required to implement this document. However, implementers are cautioned that this may not represent
the latest information, which may be obtained from the patent database available at https://patents.iec.ch. IEC
shall not be held responsible for identifying any or all such patent rights.
IEC 60749-7 has been prepared by IEC technical committee 47: Semiconductor devices. It is
an International Standard.
This third edition cancels and replaces the second edition published in 2011. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) This document has been re-written and rearranged to align with the text of MIL-STD-883,
Method 1018.10.
b) Additional detail has been provided in the calibration requirements.
IEC 60749-7:2025 © IEC 2025
The text of this International Standard is based on the following documents:
Draft Report on voting
47/2861/CDV 47/2918A/RVC
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/publications.
A list of all parts in the IEC 60749 series, under the general title Semiconductor devices -
Mechanical and climatic test methods, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
– reconfirmed,
– withdrawn, or
– revised.
IEC 60749-7:2025 © IEC 2025
1 Scope
This part of IEC 60749 specifies the testing and measurement of water vapour and other gas
content of the atmosphere inside a metal or ceramic hermetically sealed device. The test is
used as a measure of the quality of the sealing process and to provide information about the
long-term chemical stability of the atmosphere inside the package. It is applicable to
semiconductor devices sealed in such a manner but generally only used for high reliability
applications such as military or aerospace.
Of particular interest is the measurement of the primary sealing gases (or lack thereof), the
moisture content, the presence of bombing gases that are indicative of non-hermeticity (e.g.
helium), oxygen to argon ratio indicative of room air ~ 20 to 1 (± 10 %), dissimilar concentration
of internally sealed gases (e.g. nitrogen, helium) than originally sealed in the device package,
the presence of leak test fluid (i.e. fluorocarbon, helium, air), and all other gases to determine
if the device meets the specified moisture, hermeticity and other criteria. Also of interest is the
measurement of all the other gases since they reflect upon the quality of the sealing process
and provide information about the long-term chemical stability of the atmosphere inside the
device. The presence of leak test fluorocarbon vapour in the internal gas analysis (IGA) is an
indication of failure to meet leak test requirements of IEC 60749-8.
This test is destructive.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60749-8, Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
ISO and IEC maintain terminology databases for use in standardization at the following
addresses:
– IEC Electropedia: available at https://www.electropedia.org/
– ISO Online browsing platform: available at https://www.iso.org/obp
3.1
parts per million by volume
ppmv
concentration of one substance in another substance expressed as a ratio of parts of the one
substance in a million parts of the other substance, measured by volume
4 Test apparatus – Mass spectrometer
4.1 Internal gas analysis (IGA) laboratory
The mass spectrometer shall be operated and maintained by an IGA laboratory meeting the
requirements of this document.
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