EN 60384-1:2009

SLOVENSKI STANDARD
01-marec-2010
1DGRPHãþD
SIST EN 60384-1:2002
Fiksni kondenzatorji za elektronsko opremo - 1. del: Rodovna specifikacija (IEC
60384-1:2008 (EQV) + corrigendum Nov. 2008)
Fixed capacitors for use in electronic equipment - Part 1: Generic specification (IEC
60384-1:2008 (EQV) + corrigendum Nov. 2008 )
Festkondensatoren zur Verwendung in Geräten der Elektronik - Teil 1:
Fachgrundspezifikation
Condensateurs fixes utilisés dans les équipements électroniques - Partie 1: Spécification
générique
Ta slovenski standard je istoveten z: EN 60384-1:2009
ICS:
31.060.10 Fiksni kondenzatorji Fixed capacitors
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD
EN 60384-1
NORME EUROPÉENNE
December 2009
EUROPÄISCHE NORM
ICS 31.060 Supersedes EN 60384-1:2001 + corr. Oct. 2001

English version
Fixed capacitors for use in electronic equipment -
Part 1: Generic specification
(IEC 60384-1:2008 + corrigendum 2008)

Condensateurs fixes utilisés  Festkondensatoren zur Verwendung
dans les équipements électroniques - in Geräten der Elektronik -
Partie 1: Spécification générique Teil 1: Fachgrundspezifikation
(CEI 60384-1:2008 + (IEC 60384-1:2008 +
corrigendum 2008) Corrigendum 2008)

This European Standard was approved by CENELEC on 2009-10-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the
Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: Avenue Marnix 17, B - 1000 Brussels

© 2009 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60384-1:2009 E
Foreword
The text of document 40/1915/FDIS, future edition 4 of IEC 60384-1, prepared by IEC TC 40, Capacitors
and resistors for electronic equipment, was submitted to the IEC-CENELEC parallel vote and was
approved by CENELEC as EN 60384-1 on 2009-10-01.
This European Standard supersedes EN 60384-1:2001.
references.
It contains the following significant technical changes with respect to EN 60384-1:2001:
– implementation of Annex Q which replaces Clause 3.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
(dop) 2010-07-01
national standard or by endorsement
– latest date by which the national standards conflicting
(dow) 2012-10-01
with the EN have to be withdrawn
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60384-1:2008 + corrigendum November 2008 was approved
by CENELEC as a European Standard without any modification.
__________
- 3 - EN 60384-1:2009
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year

IEC 60027 Series Letter symbols to be used in electrical EN 60027 Series
technology
IEC 60050 Series International Electrotechnical Vocabulary -
(IEV)
1) 2)
IEC 60062 - Marking codes for resistors and capacitors EN 60062 2005
+ corr. January 2007
1)
IEC 60063 - Preferred number series for resistors and - -
capacitors
3)
IEC 60068-1 1988 Environmental testing - EN 60068-1 1994
Part 1: General and guidance
IEC 60068-2-1 2007 Environmental testing - EN 60068-2-1 2007
Part 2-1: Tests - Test A: Cold

IEC 60068-2-2 2007 Environmental testing - EN 60068-2-2 2007
Part 2-2: Tests - Test B: Dry heat

IEC 60068-2-6 2007 Environmental testing - EN 60068-2-6 2008
Part 2-6: Tests - Test Fc: Vibration
(sinusoidal)
IEC 60068-2-13 1983 Environmental testing - EN 60068-2-13 1999
Part 2-13: Tests - Test M: Low air pressure

IEC 60068-2-14 2009 Environmental testing - EN 60068-2-14 2009
Part 2-14: Tests - Test N: Change of
temperature
IEC 60068-2-17 1994 Environmental testing - EN 60068-2-17 1994
Part 2-17: Tests - Test Q: Sealing

4)
IEC 60068-2-20 1979 Environmental testing - HD 323.2.20 S3 1988
Part 2-20: Tests - Test T: Soldering

IEC 60068-2-21 2006 Environmental testing - EN 60068-2-21 2006
Part 2-21: Tests - Test U: Robustness of
terminations and integral mounting devices

IEC 60068-2-27 2008 Environmental testing - EN 60068-2-27 2009
Part 2-27: Tests - Test Ea and guidance:
Shock
1)
Undated reference.
2)
Valid edition at date of issue.
3)
EN 60068-1 includes corrigendum October 1988 + A1:1992 to IEC 60068-1.
4)
HD 323.2.20 S3 includes A2:1987 to IEC 60068-2-20; it is superseded by EN 60068-2-20:2008, which is based on
IEC 60068-2-20:2008.
Publication Year Title EN/HD Year

5)
IEC 60068-2-29 1987 Environmental testing - EN 60068-2-29 1993
Part 2-29: Tests - Test Eb and guidance:
Bump
IEC 60068-2-30 2005 Environmental testing - EN 60068-2-30 2005
Part 2-30: Tests - Test Db: Damp heat, cyclic
(12 h + 12 h cycle)
IEC 60068-2-45 1980 Environmental testing - EN 60068-2-45 1992
Part 2-45: Tests - Test Xa and guidance:
Immersion in cleaning solvents

IEC 60068-2-54 2006 Environmental testing - EN 60068-2-54 2006
Part 2-54: Tests - Test Ta: Solderability
testing of electronic components by the
wetting balance method
IEC 60068-2-58 2004 Environmental testing - EN 60068-2-58 2004
Part 2-58: Tests - Test Td: Test methods for + corr. December 2004
solderability, resistance to dissolution of
metallization and to soldering heat of surface
mounting devices (SMD)
IEC 60068-2-69 2007 Environmental testing - EN 60068-2-69 2007
Part 2-69: Tests - Test Te: Solderability
testing of electronic components for surface
mounting devices (SMD) by the wetting
balance method
IEC 60068-2-78 2001 Environmental testing - EN 60068-2-78 2001
Part 2-78: Tests - Test Cab: Damp heat,
steady state
1)
IEC 60294 - Measurement of the dimensions of a - -
cylindrical component having two axial
terminations
IEC 60410 1973 Sampling plans and procedures for inspection - -
by attributes
IEC 60617 Data- Graphical symbols for diagrams - -
base
IEC 60695-11-5 2004 Fire hazard testing - EN 60695-11-5 2005
Part 11-5: Test flames - Needle-flame test
method - Apparatus, confirmatory test
arrangement and guidance
1)
IEC 60717 - Method for the determination of the space - -
required by capacitors and resistors with
unidirectional terminations
1) 2)
IEC 61193-2 - Quality assessment systems - EN 61193-2 2007
Part 2: Selection and use of sampling plans
for inspection of electronic components and
packages
IEC 61249-2-7 2002 Materials for printed boards and other EN 61249-2-7 2002
interconnecting structures - + corr. September 2005
Part 2-7: Reinforced base materials, clad and
unclad - Epoxide woven E-glass laminated
sheet of defined flammability (vertical burning
test), copper-clad
5)
EN 60068-2-29 is superseded by EN 60068-2-27:2009, which is based on IEC 60068-2-27:2008.

- 5 - EN 60384-1:2009
Publication Year Title EN/HD Year

1)
IEC QC 001002-3 - IEC Quality Assessment System - -
for Electronic Components (IECQ) - Rules of
Procedure - Part 3: Approval procedures

1)
ISO 3 - Preferred numbers - Series of preferred - -
numbers
1)
ISO 1000 - SI units and recommendations for the use of - -
their multiples and of certain other units

1) 2)
ISO 9000 - Quality management systems - EN ISO 9000 2005
Fundamentals and vocabulary
IEC 60384-1
Edition 4.0 2008-07
INTERNATIONAL
STANDARD
QC 300000
Fixed capacitors for use in electronic equipment –
Part 1: Generic specification
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
XC
ICS 31.060 ISBN 2-8318-9907-9
– 2 – 60384-1 © IEC:2008(E)
CONTENTS
FOREWORD.7
1 General .9
1.1 Scope.9
1.2 Normative references .9
2 Technical data.10
2.1 Units and symbols .10
2.2 Terms and definitions .11
2.3 Preferred values.17
2.3.1 General .17
2.3.2 Preferred values of nominal capacitance .17
2.3.3 Preferred values of rated voltage.17
2.4 Marking .17
2.4.1 General .17
2.4.2 Coding.17
3 Quality assessment procedures.17
4 Tests and measurement procedures.18
4.1 General .19
4.2 Standard atmospheric conditions.19
4.2.1 Standard atmospheric conditions for testing .19
4.2.2 Recovery conditions .19
4.2.3 Referee conditions .20
4.2.4 Reference conditions.20
4.3 Drying .20
4.4 Visual examination and check of dimensions.20
4.4.1 Visual examination .20
4.4.2 Dimensions (gauging).20
4.4.3 Dimensions (detail).20
4.5 Insulation resistance .21
4.5.1 Preconditioning.21
4.5.2 Measuring conditions.21
4.5.3 Test points .21
4.5.4 Test methods.21
4.5.5 Temperature compensation .22
4.5.6 The relevant specification shall prescribe: .22
4.6 Voltage proof.23
4.6.1 Test circuit (for the test between terminations) .23
4.6.2 Test.24
4.6.3 Requirements .26
4.6.4 Conditions to be prescribed in the relevant specification.26
4.7 Capacitance .26
4.7.1 Measuring frequency and measuring voltage .26
4.7.2 Measuring equipment .26
4.7.3 Conditions to be prescribed in the relevant specification.26
4.8 Tangent of loss angle and equivalent series resistance (ESR).27
4.8.1 Tangent of loss angle .27
4.8.2 Equivalent series resistance (ESR).27

60384-1 © IEC:2008(E) – 3 –
4.9 Leakage current .27
4.9.1 Preconditioning.27
4.9.2 Test method .28
4.9.3 Power source .28
4.9.4 Measuring accuracy.28
4.9.5 Test circuit .28
4.9.6 Conditions to be prescribed in the relevant specification.28
4.10 Impedance .28
4.11 Self-resonant frequency and inductance.29
4.11.1 Self-resonant frequency (f ) .29
r
4.11.2 Inductance.32
4.11.3 Conditions to be prescribed in the relevant specification.32
4.12 Outer foil termination.32
4.13 Robustness of terminations .33
4.13.1 Test Ua – Tensile.33
4.13.2 Test Ub – Bending (half of the sample).33
4.13.3 Test Uc – Torsion (remaining sample) .33
4.13.4 Test Ud – Torque (for terminations with threaded studs or screws
and for integral mounting devices) .33
4.13.5 Visual examination .34
4.14 Resistance to soldering heat .34
4.14.1 Preconditioning.34
4.14.2 Test procedure .34
4.14.3 Recovery .34
4.14.4 Final inspection, measurement and requirements .34
4.15 Solderability .34
4.15.1 Preconditioning.34
4.15.2 Test procedure .35
4.15.3 Final inspection, measurements and requirements .35
4.16 Rapid change of temperature .35
4.16.1 Initial measurement .35
4.16.2 Test procedure .35
4.16.3 Final inspection, measurements and requirements .35
4.17 Vibration.36
4.17.1 Initial measurement .36
4.17.2 Test procedure .36
4.17.3 Electrical test.36
4.17.4 Final inspection, measurements and requirements .36
4.18 Bump .36
4.18.1 Initial measurement .36
4.18.2 Test procedure .36
4.18.3 Final inspection, measurements and requirements .36
4.19 Shock.36
4.19.1 Initial measurement .36
4.19.2 Test procedure .36
4.19.3 Final inspection, measurements and requirements .37
4.20 Container sealing .37
4.21 Climatic sequence .37
4.21.1 Initial measurements .37

– 4 – 60384-1 © IEC:2008(E)
4.21.2 Dry heat .37
4.21.3 Damp heat, cyclic, test Db, first cycle .37
4.21.4 Cold .37
4.21.5 Low air pressure.38
4.21.6 Damp heat, cyclic, test Db, remaining cycles .38
4.21.7 Final measurements .38
4.22 Damp heat, steady state.38
4.22.1 Initial measurement .38
4.22.2 Test procedure .38
4.22.3 Final inspection, measurements and requirements .39
4.23 Endurance.39
4.23.1 Initial measurements .39
4.23.2 Test procedure .39
4.23.3 Conditions to be prescribed in the relevant specification.39
4.23.4 Test voltage.39
4.23.5 Placement in the test chamber.40
4.23.6 Recovery .40
4.23.7 Final inspection, measurements and requirements .40
4.24 Variation of capacitance with temperature .41
4.24.1 Static method .41
4.24.2 Dynamic method.41
4.24.3 Methods of calculation.42
4.25 Storage .43
4.25.1 Storage at high temperature .43
4.25.2 Storage at low temperature.43
4.26 Surge .43
4.26.1 Initial measurement .43
4.26.2 Test procedure .43
4.26.3 Final inspection, measurements and requirements .45
4.26.4 Information to be given in the relevant detail specification .45
4.27 Charge and discharge tests and inrush current test .45
4.27.1 Initial measurement .45
4.27.2 Test procedure .45
4.27.3 Charge and discharge .47
4.27.4 Inrush current .47
4.27.5 Final inspection, measurements and requirements .47
4.28 Pressure relief (for aluminium electrolytic capacitors).47
4.28.1 a.c. test .47
4.28.2 d.c. test .47
4.28.3 Pneumatic test.47
4.28.4 Final inspection, measurements and requirements .48
4.29 Characteristics at high and low temperature .48
4.29.1 Test procedure .48
4.29.2 Requirements .48
4.30 Thermal stability test .48
4.31 Component solvent resistance.48
4.31.1 Initial measurements .48
4.31.2 Test procedure .48
4.31.3 Final inspection, measurements and requirements .49

60384-1 © IEC:2008(E) – 5 –
4.32 Solvent resistance of marking.49
4.32.1 Test procedure .49
4.32.2 Final inspection, measurements and requirements .49
4.33 Mounting (for surface mount capacitors only) .49
4.33.1 Substrate.49
4.34 Shear test .52
4.34.1 Test procedure .52
4.34.2 Final inspection, measurements and requirements .52
4.35 Substrate bending test .52
4.35.1 Test procedure .52
4.35.2 Recovery .52
4.35.3 Final inspection and requirements .52
4.36 Dielectric absorption.52
4.36.1 Test procedure .52
4.36.2 Requirement.53
4.37 Accelerated damp heat, steady state (for multilayer ceramic capacitors only).53
4.37.1 Mounting of capacitors .53
4.37.2 Initial measurement .53
4.37.3 Test procedure .53
4.37.4 Recovery .54
4.37.5 Final inspection, measurements and requirements .54
4.38 Passive flammability.54
4.38.1 Test procedure .54
4.38.2 Final inspection, measurements and requirements .54
4.39 High surge current test .55
4.39.1 Initial measurements .55
4.39.2 Test procedure .55
4.39.3 Requirements for the charging circuit .55
4.39.4 Nonconforming items.56
4.40 Voltage transient overload (for aluminium electrolytic capacitors with non-
solid electrolyte) .56
4.40.1 Initial measurement .56
4.40.2 Test procedure .56
4.40.3 Final inspection, measurements and requirements .57
4.40.4 Conditions to be prescribed in the relevant specification.57
Annex A (normative) Interpretation of sampling plans and procedures as described in
IEC 60410 for use within the IECQ system.58
Annex B (normative) Rules for the preparation of detail specifications for capacitors
and resistors for electronic equipment for use within the IECQ system.59
Annex C (normative) Layout of the first page of a PCP/CQC specification.60
Annex D (normative) Requirements for capability approval test report .61
Annex E (informative) Guide for pulse testing of capacitors .62
Annex F (informative) Guidance for the extension of endurance tests on fixed
capacitors .65
Annex G (normative) Damp heat, steady state with voltage applied, for metallized film
capacitors only .66
Annex Q (normative) Quality assessment procedures .67

Figure 1 – Reactive power against frequency.13

– 6 – 60384-1 © IEC:2008(E)
Figure 2 – Relation between category temperature range and applied voltage .16
Figure 3 – Voltage-proof test circuit .24
Figure 4 – Schematic diagram of the impedance measuring circuit .28
Figure 5 – Capacitor mounting arrangement .30
Figure 6 – Capacitor mounting arrangement .30
Figure 7 – Typical diagram of an absorption oscillator-wavemeter .31
Figure 8 – Schematic diagram of the measuring circuit .31
Figure 9 – Test circuit .32
Figure 10 – Test circuit for electrolytic capacitors .40
Figure 11 – Relay circuit .44
Figure 12 – Thyristor circuit .44
Figure 13 – Voltage waveform across capacitor .45
Figure 14 – Voltage and current waveform.46
Figure 15 – Suitable substrate for mechanical tests (may not be suitable for impedance
measurements) .51
Figure 16 – Suitable substrate for electrical tests.51
Figure 17 – High surge current test.55
Figure 18 – Voltage transient overload test circuit.56
Figure 19 – Voltage waveform .57
Figure Q.1 – General scheme for capability approval .70

Table 1 – Referee conditions .20
Table 2 – Measurement of insulation resistance.21
Table 3 – Measuring points.23
Table 4 – Tensile force .33
Table 5 – Torque .33
Table 6 – Number of cycles .38
Table 7 – Severities and requirements .54

60384-1 © IEC:2008(E) – 7 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT –

Part 1: Generic specification
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60384-1 has been prepared by IEC technical committee 40:
Capacitors and resistors for electronic equipment
This fourth edition cancels and replaces the third edition issued in 1999 and constitutes a
technical revision, including minor revisions related to tables, figures and references.
This edition contains the following significant technical changes with respect to the previous
edition:
• implementation of Annex Q which replaces Clause 3.
The text of this standard is based on the following documents:
FDIS Report on voting
40/1915/FDIS 40/1924/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.

– 8 – 60384-1 © IEC:2008(E)
The QC number that appears on the front cover of this publication is the specification number
in the IECQ Quality Assessment System for Electronic Componenets (IECQ).
A list of all the parts of the IEC 60384 series, under the general title Fixed capacitors for use
in electronic equipment, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later stage.
The contents of the corrigendum of November 2008 have been included in this copy.

60384-1 © IEC:2008(E) – 9 –
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT –

Part 1: Generic specification
1 General
1.1 Scope
This part of IEC 60384 is a generic specification and is applicable to fixed capacitors for use
in electronic equipment.
It establishes standard terms, inspection procedures and methods of test for use in sectional
and detail specifications of electronic components for quality assessment or any other
purpose.
1.2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60027, Letter symbols to be used in electrical technology
IEC 60050 (all parts), International Electrotechnical Vocabulary (IEV)
IEC 60062, Marking codes for resistors and capacitors
IEC 60063, Preferred number series for resistors and capacitors
IEC 60068-1:1988, Environmental testing – Part 1: General and guidance
IEC 60068-2-1:2007, Environmental testing – Part 2-1: Tests – Tests A: Cold
IEC 60068-2-2:2007, Environmental testing – Part 2-2: Tests – Tests B: Dry heat
IEC 60068-2-6:2007, Environmental testing – Part 2: Tests – Test Fc: Vibration (sinusoidal)
IEC 60068-2-13:1983, Environmental testing – Part 2: Tests – Test M: Low air pressure
IEC 60068-2-14:1984, Environmental testing – Part 2: Tests – Test N: Change of temperature
IEC 60068-2-17:1994, Environmental testing – Part 2-17: Tests – Test Q: Sealing
IEC 60068-2-20:1979, Environmental testing – Part 2-20: Tests – Test T: Soldering
IEC 60068-2-21:2006, Environmental testing – Part 2-21: Tests – Test U: Robustness of
terminations and integral mounting devices
IEC 60068-2-27:2008, Environmental testing – Part 2-27: Tests – Test Ea and guidance:
Shock
IEC 60068-2-29:1987, Environmental testing – Part 2-29: Tests – Test Eb and guidance:
Bump
– 10 – 60384-1 © IEC:2008(E)
IEC 60068-2-30:2005, Environmental testing – Part 2-30: Tests – Test Db: Damp heat, cyclic
(12 h + 12 h cycle)
IEC 60068-2-45:1980, Environmental testing – Part 2-45: Tests – Test XA and guidance:
Immersion in cleaning solvents
IEC 60068-2-54:2006, Environmental testing – Part 2-54: Tests – Test Ta: Solderability
testing of electronic components by the wetting balance method
IEC 60068-2-58:2004, Environmental testing – Part 2-58: Tests – Test Td: Test methods for
solderability, resistance to dissolution of metallization and to soldering heat of surface
mounting devices (SMD)
IEC 60068-2-69:2007, Environmental testing – Part 2: Tests – Test Te: Solderability testing of
electronic components for surface mounting devices (SMD) by the wetting balance method
IEC 60068-2-78:2001, Environmental testing – Part 2-78: Tests – Test Cab: Damp heat,
steady state
IEC 60294, Measurement of the dimensions of a cylindrical component having two axial
terminations
IEC 60410:1973, Sampling plans and procedures for inspection by attributes
IEC 60617, Graphical symbols for diagrams
IEC 60695-11-5:2004, Fire hazard testing – Part 11-5: Test flames – Needle-flame test
method – Apparatus, confirmatory test arrangement and guidance
IEC 60717, Method for the determination of the space required by capacitors and resistors
with unidirectional terminations
IEC 61193-2, Quality assessment systems – Part 2: Selection and use of sampling plans for
inspection of electronic components and packaging
IEC 61249-2-7:2002, Materials for printed boards and other interconnecting structures –
Part 2-7: Reinforced base materials clad and unclad – Epoxide woven E-glass laminated
sheet of defined flammability (vertical burning test), copper-clad
IEC QC 001002-3, Rules of Procedure – Part 3: Approval procedures
ISO 3, Preferred numbers – Series of preferred numbers
ISO 1000, SI units and recommendations for the use of their multiples and of certain other units
ISO 9000, Quality management systems – Fundament
...