Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

Gives recommended practice for the designation of package outlines and for the classification into forms of package outlines for semiconductor devices.

Mechanische Normung von Halbleiterbauelementen - Teil 4: Codierungssystem für Gehäuse und Eingruppierung der Gehäuse nach der Gehäuseform für Halbleiterbauelemente

Normalisation mécanique des dispositifs à semiconducteurs - Partie 4: Système de codification et classification en formes des boîtiers pour dispositifs à semiconducteurs

Donne des recommandations pour la désignation des boîtiers et pour la classification en formes des boîtiers pour les dispositifs à semiconducteurs.

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device package (IEC 60191-4:1999)

General Information

Status
Withdrawn
Publication Date
20-Oct-1999
Withdrawal Date
30-Sep-2002
ICS
31.080 - Semiconductor devices
Technical Committee
CLC/SR 47D - Mechanical standardization of semiconductor devices
Drafting Committee
IEC/SC 47D - IEC_SC_47D
Parallel Committee
IEC/SC 47D - IEC_SC_47D
Current Stage
9960 - Withdrawal effective - Withdrawal
Start Date
14-Nov-2016
Completion Date
21-Jan-2026
Ref Project
SIST EN 60191-4:2002 - Mechanical standardization of semiconductor devices -- Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

Relations

Replaced By
EN 60191-4:2014 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
Effective Date
28-Jan-2023
Amended By
EN 60191-4:1999/A1:2002 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
Effective Date
28-Jan-2023
Amended By
EN 60191-4:1999/A2:2002 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
Effective Date
28-Jan-2023

Frequently Asked Questions

EN 60191-4:1999 is a standard published by CLC. Its full title is "Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages". This standard covers: Gives recommended practice for the designation of package outlines and for the classification into forms of package outlines for semiconductor devices.

Gives recommended practice for the designation of package outlines and for the classification into forms of package outlines for semiconductor devices.

EN 60191-4:1999 is classified under the following ICS (International Classification for Standards) categories: 31.080 - Semiconductor devices. The ICS classification helps identify the subject area and facilitates finding related standards.

EN 60191-4:1999 has the following relationships with other standards: It is inter standard links to EN 60191-4:2014, EN 60191-4:1999/A1:2002, EN 60191-4:1999/A2:2002. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.

EN 60191-4:1999 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.

Standards Content (Sample)


2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device package (IEC 60191-4:1999)Mechanische Normung von Halbleiterbauelementen -- Teil 4: Codierungssystem für Gehäuse und Eingruppierung der Gehäuse nach der Gehäuseform für HalbleiterbauelementeNormalisation mécanique des dispositifs à semiconducteurs -- Partie 4: Système de codification et classification en formes des boîtiers pour dispositifs à semiconducteursMechanical standardization of semiconductor devices -- Part 4: Coding system and classification into forms of package outlines for semiconductor device packages31.240Mehanske konstrukcije za elektronsko
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