SIST EN IEC 61189-2-804:2023
(Main)Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300
This International Standard specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyzer (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 ºC, but are not limited to these values.
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen – Teil 2-804: Prüfverfahren für die Zeit bis zur Delaminierung – T260, T288, T300
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-804: Méthodes d'essai pour le temps de décollement interlaminaire - T260, T288, T300
L'IEC 61189-2-804:2023 définit une méthode d'essai pour déterminer le temps de décollement interlaminaire des matériaux de base et des cartes imprimées en utilisant un analyseur thermomécanique (TMA – thermomechanical analyser). Les températures utilisées pour cette évaluation sont généralement 260 °C, 288 °C et 300 °C, mais ne se limitent pas à ces valeurs.
Preskusne metode za električne materiale, tiskana vezja in druge povezovalne strukture in sestave - 2-804. del: Preskus ugotavljanja razmerja čas-delaminacija - T260, T288, T300
Ta mednarodni standard določa preskusno metodo za ugotavljanje razmerja čas-delaminacija osnovnih materialov in tiskanih vezij s termomehanskim analizatorjem (TMA). Ocenjevanje se običajno izvaja pri temperaturah 260 °C, 288 °C in 300 °C, vendar ni omejeno na te vrednosti.
General Information
- Status
- Published
- Public Enquiry End Date
- 26-Jan-2022
- Publication Date
- 14-Nov-2023
- Technical Committee
- ITIV - Electronics assembly technology and Environmental standardization
- Current Stage
- 6060 - National Implementation/Publication (Adopted Project)
- Start Date
- 17-Oct-2023
- Due Date
- 22-Dec-2023
- Completion Date
- 15-Nov-2023
Overview
SIST EN IEC 61189-2-804:2023 is an international standard developed by CLC and IEC that specifies test methods for determining the time to delamination of base materials and printed boards. This standard utilizes a thermomechanical analyzer (TMA) to assess the durability of electrical materials and interconnection structures at elevated temperatures, typically 260 °C, 288 °C, and 300 °C. Accurate measurement of time to delamination is critical for ensuring the integrity and reliability of printed circuit boards (PCBs) and related assemblies under thermal stress.
Key Topics
- Time to Delamination Testing: The standard defines procedures to measure how long a base material or printed circuit board remains intact before layers begin to separate (delamination) at specific temperatures.
- Specimen Preparation and Handling: It outlines the requirements for preparing test specimens, including sample size and preconditioning to simulate real-world conditions.
- Thermomechanical Analysis (TMA): SIST EN IEC 61189-2-804:2023 details the equipment and calibration necessary for accurate measurement, focusing on the TMA's ability to detect minute dimensional changes during thermal exposure.
- Test Parameters: Standard testing temperatures include 260 °C, 288 °C, and 300 °C, which are relevant for modern assembly and reflow soldering processes.
- Reporting Requirements: Comprehensive test reports must document all relevant variables, including material details, testing conditions, and observed times to delamination.
Applications
SIST EN IEC 61189-2-804:2023 is widely applicable in environments where thermal reliability and performance of electronic assemblies are paramount:
- PCB Manufacturing: Ensures that base materials and multilayer boards meet thermal durability requirements to withstand assembly and reflow processes.
- Quality Assurance Laboratories: Provides a repeatable method for verifying supplier material claims and conforming to customer specifications.
- Material Selection and Qualification: Assists engineers in selecting suitable laminates and substrates for products expected to endure challenging thermal cycles.
- Failure Analysis: Helps identify root causes of field failures related to delamination, enabling continuous improvement of electronic products.
- Regulatory and Contract Compliance: Offers an internationally recognized benchmark for delamination performance, useful for demonstrating compliance with customer contracts and industry regulations.
These applications are particularly crucial for high-reliability sectors such as telecommunications, automotive, aerospace, defense, and consumer electronics, where failures due to delamination could result in costly recalls or product malfunctions.
Related Standards
When using SIST EN IEC 61189-2-804:2023, the following related standards and references are important for a comprehensive approach to PCB quality and reliability:
- IEC 60194-1: Printed board design, manufacture, and assembly - Vocabulary, providing essential terminology for interpreting requirements and test results.
- IPC-TM-650 No. 2.4.24.1: Time to Delamination (TMA Method), a frequently referenced industry method for delamination testing.
- IEC 61189 series: Covers a broad range of test methods for electrical materials, printed boards, and assemblies, supporting consistent and repeatable testing practices.
Practical Value
Following SIST EN IEC 61189-2-804:2023 delivers significant value by:
- Enhancing product reliability and performance in demanding thermal environments.
- Supporting the reduction of field failures associated with delamination.
- Providing a standardized, internationally accepted method for material and process qualification.
- Helping organizations maintain competitive quality assurance and meet global industry benchmarks for electrical materials and printed boards.
Frequently Asked Questions
SIST EN IEC 61189-2-804:2023 is a standard published by the Slovenian Institute for Standardization (SIST). Its full title is "Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300". This standard covers: This International Standard specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyzer (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 ºC, but are not limited to these values.
This International Standard specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyzer (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 ºC, but are not limited to these values.
SIST EN IEC 61189-2-804:2023 is classified under the following ICS (International Classification for Standards) categories: 31.180 - Printed circuits and boards. The ICS classification helps identify the subject area and facilitates finding related standards.
SIST EN IEC 61189-2-804:2023 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.
Standards Content (Sample)
SLOVENSKI STANDARD
01-december-2023
Preskusne metode za električne materiale, tiskana vezja in druge povezovalne
strukture in sestave - 2-804. del: Preskus ugotavljanja razmerja čas-delaminacija -
T260, T288, T300
Test methods for electrical materials, printed board and other interconnection structures
and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen
und Baugruppen – Teil 2-804: Prüfverfahren für die Zeit bis zur Delaminierung – T260,
T288, T300
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles - Partie 2-804: Méthodes d'essai pour le temps
de décollement interlaminaire - T260, T288, T300
Ta slovenski standard je istoveten z: EN IEC 61189-2-804:2023
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN IEC 61189-2-804
NORME EUROPÉENNE
EUROPÄISCHE NORM October 2023
ICS 31.180
English Version
Test methods for electrical materials, printed board and other
interconnection structures and assemblies - Part 2-804: Test
methods for time to delamination - T260, T288, T300
(IEC 61189-2-804:2023)
Méthodes d'essai pour les matériaux électriques, les cartes Prüfverfahren für Elektromaterialien, Leiterplatten und
imprimées et autres structures d'interconnexion et andere Verbindungsstrukturen und Baugruppen - Teil 2-
ensembles - Partie 2-804: Méthodes d'essai pour le temps 804: Prüfverfahren für die Zeit bis zur Delaminierung -
de décollement interlaminaire - T260, T288, T300 T260, T288, T300
(IEC 61189-2-804:2023) (IEC 61189-2-804:2023)
This European Standard was approved by CENELEC on 2023-09-29. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2023 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 61189-2-804:2023 E
European foreword
The text of document 91/1874/FDIS, future edition 1 of IEC 61189-2-804, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61189-2-804:2023.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2024-06-29
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2026-09-29
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 61189-2-804:2023 was approved by CENELEC as a
European Standard without any modification.
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the
relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cencenelec.eu.
Publication Year Title EN/HD Year
IEC 60194-1 - Printed boards design, manufacture and - -
assembly - Vocabulary - Part 1: Common
usage in printed board and electronic
assembly technologies
IEC 61189-2-804 ®
Edition 1.0 2023-08
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Test methods for electrical materials, printed board and other interconnection
structures and assemblies –
Part 2-804: Test methods for time to delamination – T260, T288, T300
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles –
Partie 2-804: Méthodes d'essai pour le temps de décollement interlaminaire –
T260, T288, T300
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180 ISBN 978-2-8322-7422-4
– 2 – IEC 61189-2-804:2023 © IEC 2023
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Specimen preparation . 5
5 Test specimens . 5
6 Test equipment . 6
7 Test procedure . 6
8 Calculation . 6
9 Report . 7
Bibliography . 8
Figure 1 – A typical plot for an epoxy material at an isothermal temperature of 260 °C . 7
IEC 61189-2-804:2023 © IEC 2023 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –
Part 2-804: Test methods for time to delamination – T260, T288, T300
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters ex
...
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