EN 62137-4:2014

SLOVENSKI STANDARD
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Electronics assembly technology - Part 4: Endurance test methods for solder joint of area
array type package surface mount devices
Montageverfahren für elektronische Baugruppen - Teil 4: Oberflächenmontierbare
Bauteilgehäuse mit Flächenmatrix - (Lebens)dauerprüfungen für Lötverbindungen
Technique d'assemblage des composants électroniques - Partie 4: Méthodes d'essais
d'endurance des joints brasés des composants pour montage en surface à boîtiers de
type matriciel
Ta slovenski standard je istoveten z: EN 62137-4:2014
ICS:
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN 62137-4
NORME EUROPÉENNE
EUROPÄISCHE NORM
December 2014
ICS 31.190
English Version
Electronics assembly technology -
Part 4: Endurance test methods for solder joint of area array type
package surface mount devices
(IEC 62137-4:2014)
Technique d'assemblage des composants électroniques - Montageverfahren für elektronische Baugruppen -
Partie 4: Méthodes d'essais d'endurance des joints brasés Teil 4: Oberflächenmontierbare Bauteilgehäuse mit
des composants pour montage en surface à boîtiers de Flächenmatrix - (Lebens-)Dauerprüfungen für
type matriciel Lötverbindungen
(CEI 62137-4:2014) (IEC 62137-4:2014)
This European Standard was approved by CENELEC on 2014-11-13. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2014 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN 62137-4:2014 E
Foreword
The text of document 91/1188/FDIS, future edition 1 of IEC 62137-4, prepared by
IEC/TC 91 "Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and
approved by CENELEC as EN 62137-4:2014.

The following dates are fixed:
(dop) 2015-08-13
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2017-11-13
standards conflicting with the
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.
Endorsement notice
The text of the International Standard IEC 62137-4:2014 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:

IEC 60068-1:1988+A1:1992 NOTE Harmonized as EN 60068-1:1994 (not modified).
IEC 60068-2-2 NOTE Harmonized as EN 60068-2-2.
IEC 60068-2-6 NOTE Harmonized as EN 60068-2-6.
IEC 60068-2-21:2006 NOTE Harmonized as EN 60068-2-21:2006 (not modified).
IEC 60068-2-27 NOTE Harmonized as EN 60068-2-27.
IEC 60068-2-44:1995 NOTE Harmonized as EN 60068-2-44:1995 (not modified).
IEC 60068-2-58:2004 NOTE Harmonized as EN 60068-2-58:2004 (not modified).
1)
IEC 60068-2-78:2001 NOTE Harmonized as EN 60068-2-78:2001 (not modified).
IEC 60749-1:2002 NOTE Harmonized as EN 60749-1:2003 (not modified).
IEC 60749-20:2008 NOTE Harmonized as EN 60749-20:2009 (not modified).
IEC 60749-20-1:2009 NOTE Harmonized as EN 60749-20-1:2009 (not modified).
IEC 61188-5-8 NOTE Harmonized as EN 61188-5-8.
IEC 61189-3:2007 NOTE Harmonized as EN 61189-3:2008 (not modified).
IEC 61189-5 NOTE Harmonized as EN 61189-5.
IEC 61190-1-1 NOTE Harmonized as EN 61190-1-1.
IEC 61190-1-2 NOTE Harmonized as EN 61190-1-2.
IEC 61760-1:2006 NOTE Harmonized as EN 61760-1:2006 (not modified).
IEC 62137-1-3 NOTE Harmonized as EN 62137-1-3.
IEC 62137-1-4:2009 NOTE Harmonized as EN 62137-1-4:2009 (not modified).

1)
Superseded by EN 60068-2-78:2013 (IEC 60068-2-78:2012): DOW = 2015-12-03.

- 3 - EN 62137-4:2014
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.

NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu
Publication Year Title EN/HD Year

IEC 60068-2-14 -  Environmental testing - EN 60068-2-14 -
Part 2-14: Tests - Test N: Change of
temperature
IEC 60191-6-2 -  Mechanical standardization of EN 60191-6-2 -
semiconductor devices -
Part 6-2: General rules for the preparation
of outline drawings of surface mounted
semiconductor device packages - Design
guide for 1,50 mm, 1,27 mm and 1,00 mm
pitch ball and column terminal packages
IEC 60191-6-5 -  Mechanical standardization of EN 60191-6-5 -
semiconductor devices -
Part 6-5: General rules for the preparation
of outline drawings of surface mounted
semiconductor device packages - Design
guide for fine-pitch ball grid array (FBGA)
IEC 60194 -  Printed board design, manufacture and EN 60194 -
assembly - Terms and definitions
IEC 61190-1-3 -  Attachment materials for electronic EN 61190-1-3 -
assembly -
Part 1-3: Requirements for electronic
grade solder alloys and fluxed and non-
fluxed solid solders for electronic soldering
applications
IEC 61249-2-7 -  Materials for printed boards and other EN 61249-2-7 -
interconnecting structures -
Part 2-7: Reinforced base materials, clad
and unclad - Epoxide woven E-glass
laminated sheet of defined flammability
(vertical burning test), copper-clad
IEC 61249-2-8 -  Materials for printed boards and other EN 61249-2-8 -
interconnecting structures -
Part 2-8: Reinforced base materials, clad
and unclad - Modified brominated epoxide
woven fibreglass reinforced laminated
sheets of defined flammability (vertical
burning test), copper-clad
Publication Year Title EN/HD Year

IEC 62137-3 2011 Electronics assembly technology - EN 62137-3 2012
Part 3: Selection guidance of
environmental and endurance test
methods for solder joints
IEC 62137-4 ®
Edition 1.0 2014-10
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Electronics assembly technology –

Part 4: Endurance test methods for solder joint of area array type package

surface mount devices
Technique d'assemblage des composants électroniques –

Partie 4: Méthodes d'essais d'endurance des joints brasés des composants

pour montage en surface à boîtiers de type matriciel

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX X
ICS 31.190 ISBN 978-2-8322-1873-0

– 2 – IEC 62137-4:2014 © IEC 2014
CONTENTS
FOREWORD . 6
1 Scope . 8
2 Normative references . 8
3 Terms definitions and abbreviations . 9
3.1 Terms and definitions . 9
3.2 Abbreviations . 9
4 General . 9
5 Test apparatus and materials . 10
5.1 Specimen . 10
5.2 Reflow soldering equipment . 10
5.3 Temperature cycling chamber . 10
5.4 Electrical resistance recorder . 10
5.5 Test substrate . 10
5.6 Solder paste . 11
6 Specimen preparation . 11
7 Temperature cycling test . 13
7.1 Pre-conditioning . 13
7.2 Initial measurement . 13
7.3 Test procedure . 13
7.4 End of test criteria. 15
7.5 Recovery . 15
7.6 Final measurement . 15
8 Temperature cycling life . 15
9 Items to be specified in the relevant product specification . 15
Annex A (informative) Acceleration of the temperature cycling test for solder joints . 17
A.1 General . 17
A.2 Acceleration of the temperature cycling test for an Sn-Pb solder joint . 17
A.3 Temperature cycling life prediction method for an Sn-Ag-Cu solder joint . 18
A.4 Factor that affects the temperature cycling life of the solder joint . 22
Annex B (informative) Electrical continuity test for solder joints of the package . 23
B.1 General . 23
B.2 Package and daisy chain circuit . 23
B.3 Mounting condition and materials . 23
B.4 Test method . 23
B.5 Temperature cycling test using the continuous electric resistance monitoring
system . 23
Annex C (informative) Reflow solderability test method for package and test substrate
land . 25
C.1 General . 25
C.2 Test equipment . 25
C.2.1 Test substrate. 25
C.2.2 Pre-conditioning oven . 25
C.2.3 Solder paste . 25
C.2.4 Metal mask for screen printing . 25
C.2.5 Screen printing equipment . 25

IEC 62137-4:2014 © IEC 2014 – 3 –
C.2.6 Package mounting equipment . 25
C.2.7 Reflow soldering equipment . 25
C.2.8 X-ray inspection equipment . 26
C.3 Standard mounting process . 26
C.3.1 Initial measurement . 26
C.3.2 Pre-conditioning . 26
C.3.3 Package mounting on test substrate . 26
C.3.4 Recovery . 27
C.3.5 Final measurement . 27
C.4 Examples of faulty soldering of area array type packages . 27
C.4.1 Repelled solder by contamination on the ball surface of the BGA
package . 27
C.4.2 Defective solder ball wetting caused by a crack in the package . 27
C.5 Items to be given in the product specification . 28
Annex D (informative) Test substrate design guideline . 29
D.1 General . 29
D.2 Design standard . 29
D.2.1 General . 29
D.2.2 Classification of substrate specifications . 29
D.2.3 Material of the test substrate . 31
D.2.4 Configuration of layers of the test substrate . 31
D.2.5 Land shape of test substrate . 31
D.2.6 Land dimensions of the test substrate . 31
D.3 Items to be given in the product specification . 32
Annex E (informative) Heat resistance to reflow soldering for test substrate . 33
E.1 General . 33
E.2 Test apparatus . 33
E.2.1 Pre-conditioning oven . 33
E.2.2 Reflow soldering equipment . 33
E.3 Test procedure . 33
E.3.1 General . 33
E.3.2 Pre-conditioning . 33
E.3.3 Initial measurement . 33
E.3.4 Moistening process (1) . 34
E.3.5 Reflow heating (1) . 34
E.3.6 Moistening process (2) . 34
E.3.7 Reflow heating process (2) . 34
E.3.8 Final measurement . 34
E.4 Items to be given in the product specification . 34
Annex F (informative) Pull strength measurement method for the test substrate land . 35
F.1 General . 35
F.2 Test apparatus and materials . 35
F.2.1 Pull strength measuring equipment . 35
F.2.2 Reflow soldering equipment . 35
F.2.3 Test substrate. 35
F.2.4 Solder ball . 35
F.2.5 Solder paste . 35
F.2.6 Flux . 35
F.3 Measurement procedure . 36

– 4 – IEC 62137-4:2014 © IEC 2014
F.3.1 Pre-conditioning . 36
F.3.2 Solder paste printing . 36
F.3.3 Solder ball placement . 36
F.3.4 Reflow heating process . 36
F.3.5 Pull strength measurement . 36
F.3.6 Final measurement . 37
F.4 Items to be given in the product specification . 37
Annex G (informative) Standard mounting process for the packages . 38
G.1 General . 38
G.2 Test apparatus and materials . 38
G.2.1 Test substrate. 38
G.2.2 Solder paste . 38
G.2.3 Metal mask for screen printing . 38
G.2.4 Screen printing equipment . 38
G.2.5 Package mounting equipment . 38
G.2.6 Reflow soldering equipment . 38
G.3 Standard mounting process . 39
G.3.1 Initial measurement . 39
G.3.2 Solder paste printing . 39
G.3.3 Package mounting . 39
G.3.4 Reflow heating process . 39
G.3.5 Recovery . 40
G.3.6 Final measurement . 40
G.4 Items to be given in the product specification . 40
Annex H (informative) Mechanical stresses to the packages . 41
H.1 General . 41
H.2 Mechanical stresses . 41
Bibliography . 42

Figure 1 – Region for evaluation of the endurance test . 10
Figure 2 – Typical reflow soldering profile for Sn63Pb37 solder alloy . 12
Figure 3 – Typical reflow soldering profile for Sn96,5Ag3Cu,5 solder alloy . 13
Figure 4 – Test conditions of temperature cycling test. 14
Figure A.1 – FBGA package device and FEA model for calculation of acceleration
factors AF . 20
Figure A.2 – Example of acceleration factors AF with an FBGA package device using
Sn96,5Ag3Cu,5 solder alloy . 21
Figure A.3 – Fatigue characteristics of Sn96,5Ag3Cu,5 an alloy micro solder joint
(N = 20 % load drop from initial load) . 22
f
Figure B.1 – Example of a test circuit for the electrical continuity test of a solder joint . 23
Figure B.2 – Measurement example of continuously monitored resistance in the

temperature cycling test . 24
Figure C.1 – Temperature measurement of specimen using thermocouples . 26
Figure C.2 – Repelled solder caused by contamination on the solder ball surface . 27
Figure C.3 – Defective soldering as a result of a solder ball drop . 28
Figure D.1 – Standard land shapes of the test substrate . 31
Figure F.1 – Measuring methods for pull strength . 36

IEC 62137-4:2014 © IEC 2014 – 5 –
Figure G.1 – Example of printed conditions of solder paste . 39
Figure G.2 – Temperature measurement of the specimen using thermocouples . 40

Table 1 – Test conditions of temperature cycling test . 14
Table A.1 – Example of test results of the acceleration factor (Sn63Pb37 solder alloy) . 18
Table A.2 – Example test results of the acceleration factor (Sn96,5Ag3Cu,5 solder
alloy) . 20
Table A.3 – Material constant and inelastic strain range calculated by FEA for FBGA
package devices as shown in Figure A.1 (Sn96,5Ag3Cu,5 solder alloy) . 21
Table D.1 – Types classification of the test substrate . 30
Table D.2 – Standard layers' configuration of test substrates . 31
Table G.1 – Stencil design standard for packages . 38
Table H.1 – Mechanical stresses to mounted area array type packages . 41

– 6 – IEC 62137-4:2014 © IEC 2014
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
ELECTRONICS ASSEMBLY TECHNOLOGY –

Part 4: Endurance test methods for solder joint
of area array type package surface mount devices

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62137-4 has been prepared by IEC technical committee 91:
Electronics assembly technology.
IEC 62137-4 (first edition) cancels and replaces IEC 62137:2004. This edition constitutes a
technical revision.
IEC 62137-4 includes the following significant technical changes with respect to
IEC 62137:2004:
• test conditions for use of lead-free solder are included;
• test conditions for lead-free solders are added;
• accelerations of the temperature cycling test for solder joints are added.

IEC 62137-4:2014 © IEC 2014 – 7 –
The text of this standard is based on the following documents:
FDIS Report on voting
91/1188/FDIS 91/1205/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 62137 series, published under the general title Electronics
assembly technology can be found in the IEC website.
Future standards in this series will carry the new general title as cited above. Titles of existing
standards in this series will be updated at the time of the next edition.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
– 8 – IEC 62137-4:2014 © IEC 2014
ELECTRONICS ASSEMBLY TECHNOLOGY –

Part 4: Endurance test methods for solder joint
of area array type package surface mount devices

1 Scope
This part of IEC 62137 specifies the test method for the solder joints of area array type
packages mounted on the printed wiring board to evaluate solder joint durability against
thermo-mechanical stress.
This part of IEC 62137 applies to the surface mounting semiconductor devices with area array
type packages (FBGA, BGA, FLGA and LGA) including peripheral termination type packages
(SON and QFN) that are intended to be used in industrial and consumer electrical or
electronic equipment.
An acceleration factor for the degradation of the solder joints of the packages by the
temperature cycling test due to the thermal stress when mounted, is described Annex A.
Annex H provides some explanations concerning various types of mechanical stress when
mounted.
The test method specified in this standard is not intended to evaluate semiconductor devices
themselves.
NOTE 1 Mounting conditions, printed wiring boards, soldering materials, and so on, significantly affect the result
of the test specified in this standard. Therefore, the test specified in this standard is not regarded as the one to be
used to guarantee the mounting reliability of the packages.
NOTE 2 The test method is not necessary, if there is no stress (mechanical or other) to solder joints in field use
and handling after mounting.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60068-2-14, Environmental testing – Part 2-14: Tests – Test N: Change of temperature
IEC 60191-6-2, Mechanical standardization of semiconductor devices – Part 6-2: General
rules for the preparation of outline drawings of surface mounted semiconductor device
packages – Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal
packages
IEC 60191-6-5, Mechanical standardization of semiconductor devices – Part 6-5: General
rules for the preparation of outline drawings of surface mounted semiconductor device
packages – Design guide for fine-pitch ball grid array (FBGA)
IEC 60194, Printed board design, manufacture and assembly – Terms and definitions

IEC 62137-4:2014 © IEC 2014 – 9 –
IEC 61190-1-3, Attachment materials for electronic assembly – Part 1-3: Requirements for
electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering
applications
IEC 61249-2-7, Materials for printed boards and other interconnecting structures – Part 2-7:
Reinforced base materials clad and unclad – Epoxide woven E-glass laminated sheet of
defined flammability (vertical burning test), copper-clad
IEC 61249-2-8, Materials for printed boards and other interconnecting structures – Part 2-8:
Reinforced base materials clad and unclad – Modified brominated epoxide woven fibreglass
reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
IEC 62137-3:2011, Electronics assembly technology – Part 3: Selection guidance of
environmental and endurance test methods for solder joints
3 Terms definitions and abbreviations
3.1 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 60191-6-2,
IEC 60191-6-5 and IEC 60194, as well as the following, apply.
3.1.1
temperature cycling life
period of time to reach a lost performance state as agreed between the trading partners
during the temperature cycling test
3.1.2
momentary interruption detector
instrument capable to detect an electrical discontinuity in the daisy chain circuits
Note 1 to entry: See Annex B for the electrical continuity test of solder joint.
3.2 Abbreviations
FBGA Fine-pitch ball grid array
BGA Ball grid array
FLGA Fine-pitch land grid array
LGA Land grid array
SON Small outline non-leaded package
QFN Quad flat-pack non-leaded package
SMD Surface mounting device
OSP Organic solderability preservative
FR-4 Flame retardant type 4
FEA Finite element method analysis
CGA Column grid array
4 General
The regions of the solder joints to be evaluated are shown in Figure 1. The test method in this
standard is applicable to evaluate the durability of the solder joints against thermal stress to
the package mounted on substrate but not to test the mechanical strength of the package
itself.
– 10 – IEC 62137-4:2014 © IEC 2014
Therefore, the conditions for accelerated stress conditioning by a temperature cycling test
may exceed the maximum allowable temperature range for the package.
The test method specified in this standard is mainly applicable to the solder joint between
substrates of printed wiring board and the package as an evaluation target. However, the test
results depend on conditions such as the mounting method and the condition, materials and
the printed wiring board, etc. See Annex C to Annex G.
SMD (array type)
Substrate
Device
Device
Solder
Substrate
Device termination
Plating layers
Evaluation
Solder
area
Inter-metallic
Substrate
compound layers
Substrate Substrate land
IEC
Figure 1 – Region for evaluation of the endurance test
5 Test apparatus and materials
5.1 Specimen
Specimen is the package mounted on the test substrate (refer to Clause 6 for preparation).
5.2 Reflow soldering equipment
The reflow soldering equipment shall be able to realize the reflow soldering temperature
profile specified in Clause 6. Examples of temperature profile are shown in Figure 2 and
Figure 3.
NOTE A standard mounting process for the package is shown in Annex G.
5.3 Temperature cycling chamber
The temperature cycling chamber shall be able to realize the temperature cycling profile
specified in Figure 4. The general requirements for the temperature cycling chamber are
specified in IEC 60068-2-14.
5.4 Electrical resistance recorder
The electrical resistance recorder shall be able to detect electrical continuity interruption in
the daisy chain circuit. If there is no doubt of the measuring result, an electrical resistance
measuring instrument featured with a momentary interruption detector and/or a continuous
electrical resistance data logger should be used.
The interruption detector should be sufficiently sensitive to detect a 100 µs momentary
interruption. Furthermore, the electrical resistance measuring instrument should be able to
measure a resistance exceeding 1 000 Ω.
5.5 Test substrate
Unless otherwise specified in the product specification, the test substrate shall be as follows.
a) Test substrate material
IEC 62137-4:2014 © IEC 2014 – 11 –
Test substrate material shall be a single sided printed wiring board for general use, for
example, copper-clad epoxide woven fiberglass reinforced laminated sheets as specified
in IEC 61249-2-7 or IEC 61249-2-8. The thickness shall be (1,6 ± 0,2) mm including
copper foil. The copper foil thickness shall be (35 ± 10) µm.
NOTE 1 Heat resistance to reflow soldering for the test substrate is described in Annex E.
b) Test substrate dimensions
The test substrate dimensions depend on the mounted package size and shape. However,
the test substrate dimensions shall be fixed on the pull strength test equipment.
c) Land shape and land dimensions
Land shape and land dimensions should be as specified in IEC 61188-5-8 or as
recommended by the package manufacturer.
Moreover, the test substrate and the test package shall be designed in such a way that
their land pattern forms a daisy chain circuit after mounting for the electrical continuity
measurement.
NOTE 2 Annex D provides a test substrate design guide.
NOTE 3 Annex C provides a solderability test for the substrate land. And Annex F provides a strength test for
the substrate land.
d) Surface finish of land pattern
If specified in the product specification, a solderable region (land pattern of the test
substrate) shall be treated suitably against oxidization, for example, by means of an
organic solderability preservative (OSP) layer. The surface protection shall not interfere
with the solderability of the land pattern being soldered by using the reflow soldering
equipment specified in 5.2.
5.6 Solder paste
Solder paste is made of flux, finely divided particles of solder and additives to promote wetting
and to control viscosity, tackiness, slumping, drying rate, etc. Unless otherwise specified in
the product specification, one of the solder alloys listed below (as specified in IEC 61190-1-3)
shall be used. The product specification shall specify details of the solder paste.
The major composition of the solder alloys are as follows:
a) 63 % mass fraction of Sn (tin) and 37 % mass fraction on Pb (lead);
b) from 3,0 % to 4,0 % mass fraction of Ag (silver), from 0,5 % to 1,0 % mass fraction of Cu
(copper) and the remainder of Sn (tin).
Example: Sn-Ag-Cu ternary alloy such as Sn96,5Ag3Cu,5 alloy is used.
6 Specimen preparation
The package shall be mounted on the test substrate using the following reflow soldering
process. The package for the specimen shall be modified as for test dummy package to form
a daisy chain circuit with a land pattern of the test substrate after reflow soldering.
NOTE The solderability test to confirm the termination of the package and the test substrate land which affects
the solder joint strength is described in Annex C.
The specimen preparation process and the conditions are as follows.
a) Unless otherwise specified in the product specification, the solder paste specified in 5.6
shall be printed on the test substrate land specified in 5.5, using a stencil made of
stainless steel being 120 µm to 150 µm thick, and that have the same aperture
dimensions as the dimensions, shape and arrangement of the test substrate land.
b) The package shall be placed onto the printed solder paste.

– 12 – IEC 62137-4:2014 © IEC 2014
c) The reflow soldering equipment specified in 5.2 shall be used for soldering the package
terminals under the conditions shown in Figure 2 or Figure 3. The measuring point of the
temperature shall be on the land portion.
Figure 2 shows an example of a typical reflow soldering profile using Sn63Pb37 solder alloy,
as stated in IEC 61760-1:2006, Figure 13.
Figure 3 shows an example of a typical reflow soldering profile using Sn96,5Ag3Cu,5 solder
alloy, as stated in IEC 61760-1:2006, Figure 14.
SnPb Reflow
250 240 °C
230 °C
215 °C
180 °C
160 °C
ca. 60 s > 180 °C
150 °C
130 °C
Pre-heating
Ramp down rate < 6 K/s
Typical
Ramp up rate < 3 K/s
0 20 40 60 80 100 120 140 160 180 200 220 240
Time  s
Continous line: typical process (terminal temperature)
Dotted line: process limits. Bottom process limit (terminal temperature). Upper process limit (top surface
temperature)
IEC
Figure 2 – Typical reflow soldering profile for Sn63Pb37 solder alloy
Temperature  °C
IEC 62137-4:2014 © IEC 2014 – 13 –
SnAgCu Reflow
250 °C
245 °C
235 °C
...