Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices

Corrigendum to add the missing superseding information in the title pages and in the foreword

Montageverfahren für elektronische Baugruppen - Teil 4: Oberflächenmontierbare Bauteilgehäuse mit Flächenmatrix - (Lebens-)Dauerprüfungen für Lötverbindungen

Technique d'assemblage des composants électroniques - Partie 4: Méthodes d'essais d'endurance des joints brasés des composants pour montage en surface à boîtiers de type matriciel

Tehnologija elektronskega sestavljanja - 4. del: Metode za preskušanje vzdržljivosti kositrnih spojev elementov za površinsko montažo z okrovi z matričnimi priključki v ravnini - Popravek AC

General Information

Status
Published
Publication Date
12-Feb-2015
Current Stage
6060 - Document made available - Publishing
Start Date
13-Feb-2015
Completion Date
13-Feb-2015

Relations

Effective Date
27-Jan-2023
Corrigendum

EN 62137-4:2015/AC:2015

English language
1 pages
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Frequently Asked Questions

EN 62137-4:2014/AC:2015 is a corrigendum published by CLC. Its full title is "Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices". This standard covers: Corrigendum to add the missing superseding information in the title pages and in the foreword

Corrigendum to add the missing superseding information in the title pages and in the foreword

EN 62137-4:2014/AC:2015 is classified under the following ICS (International Classification for Standards) categories: 31.190 - Electronic component assemblies. The ICS classification helps identify the subject area and facilitates finding related standards.

EN 62137-4:2014/AC:2015 has the following relationships with other standards: It is inter standard links to EN 62137-4:2014. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.

EN 62137-4:2014/AC:2015 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.

Standards Content (Sample)


2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.ãDQMHMontageverfahren für elektronische Baugruppen - Teil 4: Oberflächenmontierbare Bauteilgehäuse mit Flächenmatrix - (Lebens-)Dauerprüfungen für LötverbindungenTechnique d'assemblage des composants électroniques - Partie 4: Méthodes d'essais d'endurance des joints brasés des composants pour montage en surface à boîtiers de type matricielElectronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface
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