EN 62326-4-1:1997

Overview

EN 62326-4-1:1997 (CLC) covers capability qualification for rigid multilayer printed boards with interlayer connections. This sectional specification (Part 4 - Section 1) defines the capability detail specification used to assess production and process capability at three performance levels: A, B and C. It specifies the capability-qualifying component, the characteristics to be tested, the appropriate test methods and environmental/conditioning requirements, and the pass/fail requirements for capability demonstration.

Keywords: rigid multilayer printed boards, interlayer connections, capability qualification, performance levels A B C, PCB test methods.

Key topics and requirements

• Scope of application: Qualification of rigid multilayer PCBs that include interlayer connections (e.g., plated-through vias and other internal interconnects).
• Capability qualifying component: Defines the sample or representative component used to validate a manufacturer’s process capability.
• Characteristics to be tested: Lists electrical, mechanical and metallurgical attributes relevant to interlayer connections (as specified in the standard).
• Test methods and conditions: Specifies which test procedures, environmental conditioning and acceptance criteria are applied when demonstrating capability.
• Performance levels A, B, C: Three ordered performance classes that determine the extent and severity of testing required to qualify a process or product; each level corresponds to different application-critical requirements and production confidence.
• Acceptance requirements: Defines the criteria a supplier or process must meet to be judged capable at the selected performance level.

Practical applications

• Supplier and process qualification: Use the standard to qualify PCB fabricators and specific multilayer board processes before production runs.
• Quality assurance and control: Establish repeatable test regimes to confirm manufacturing capability for interlayer connections.
• Design-to-manufacturing handoff: Provide procurement and engineering teams with objective capability evidence for boards with complex internal interconnects.
• Risk reduction for critical products: Demonstrate reliability and manufacturing consistency for safety-, performance- or mission-critical electronics.

Who uses this standard

• PCB manufacturers and process engineers validating multilayer fabrication
• Quality managers and test laboratories performing capability assessments
• OEMs, contract manufacturers and procurement teams specifying supplier acceptance criteria
• Design engineers requiring assurance that multilayer interconnects meet production capability

Related standards

• EN 62326 series (other parts addressing printed board requirements and sectional specifications)
• General international PCB and electronics manufacturing standards and supplier qualification frameworks

Using EN 62326-4-1 helps organizations standardize how they qualify multilayer PCB processes, ensuring that interlayer connections meet defined capability and performance expectations.