Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance

IEC 61189-2-720:2024 provides a method to evaluate specific characteristics of circuit boards by measuring the capacitance between conductor traces and a ground plane and can be used for qualitative comparison of a test specimen to a reference board. This method is not intended for quantitative measurements and for assessment of conformity to a specification.

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 2-720: Erkennung von Fehlern in Verbindungsstrukturen durch Messung der Kapazität

Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-720 : Détection de défauts présents dans les structures d'interconnexion par mesurage de la capacité

L’IEC 61189-2-720:2024 fournit une méthode pour évaluer les caractéristiques spécifiques des circuits imprimés en mesurant la capacité entre les traces conductrices et un plan de masse. Elle peut être utilisée pour établir une comparaison qualitative d'un spécimen d'essai par rapport à un circuit de référence. Cette méthode n'est pas destinée aux mesures quantitatives ni à l'évaluation de la conformité à une spécification.

Preskusne metode za električne materiale, tiskana vezja in druge povezovalne strukture in sestave - 2-720. del: Odkrivanje napak v povezovalnih strukturah z merjenjem kapacitivnosti

Standard IEC 61189-2-720:2024 določa metodo za ocenjevanje posameznih lastnosti tiskanih vezij z merjenjem kapacitivnosti med prevodnimi sledmi in ozemljitveno ploščo ter ga je mogoče uporabiti za kvalitativno primerjavo preskusnega vzorca z referenčno ploščo. Ta metoda ni namenjena za kvantitativne meritve in ocenjevanje skladnosti s specifikacijo.

General Information

Status
Published
Publication Date
11-Apr-2024
Drafting Committee
IEC/TC 91 - IEC_TC_91
Current Stage
6060 - Document made available - Publishing
Start Date
12-Apr-2024
Due Date
31-May-2024
Completion Date
12-Apr-2024

Overview

EN IEC 61189-2-720:2024 is a European and international standard that specifies a qualitative test method for evaluating defects in interconnection structures, such as circuit boards and assemblies, using capacitance measurement. Developed by the European Committee for Electrotechnical Standardization (CENELEC/CLC) in alignment with the International Electrotechnical Commission (IEC), this standard is designed to enhance early-stage reliability testing of printed circuit boards (PCBs) and related electrical materials.

This method assesses the capacitance between conductor traces and a ground plane on a test specimen, allowing for qualitative comparison with a reference board. EN IEC 61189-2-720:2024 is not intended for quantitative conformity assessment, but rather to identify potential defects during R&D or reliability testing phases.

Key Topics

  • Qualitative Defect Detection: Focuses on identifying defects such as mouse bites, delamination, voids, cracks, and open/short circuits by analyzing variations in capacitance.
  • Capacitance Measurement Method: Utilizes a capacitance tester (such as an LCR meter or impedance tester) to measure differences between the test specimen and a reference board.
  • Test Specimen Preparation: Outlines requirements for specimen warpage and attachment to the ground plate to ensure accurate readings and repeatability.
  • Testing Procedure:
    • Conditioning specimens at standard laboratory conditions before testing
    • Measuring and comparing capacitance values on both sides of the specimen
    • Analyzing average error ratios for pass/fail judgment
  • Test Reporting: Specifies the required details for documenting test results, including schematic diagrams, measuring equipment, test environment, sequence of measurements, error thresholds, and summary evaluation.

Applications

EN IEC 61189-2-720:2024 offers practical benefits for:

  • Reliability Testing in Development: Provides a valuable tool for R&D teams to qualitatively compare PCB prototypes to reference boards, revealing hidden process defects before mass production.
  • Quality Assurance: Enables manufacturers of printed circuit boards, electronic assemblies, and electrical materials to screen for common manufacturing defects that may not be detected by traditional open/short tests.
  • Defect Localization: Supports identification of specific problem areas (such as mouse bites or delamination) based on capacitance variance, allowing targeted improvements.
  • Supplier Evaluation: Facilitates comparison of material and build quality from different suppliers, supporting sourcing decisions for high-reliability electronics.
  • Pre-Compliance Screening: Although not designed for specification conformity assessments, the method can be used as an internal check prior to formal compliance testing.

Related Standards

The following standards are closely related or referenced within EN IEC 61189-2-720:2024, enhancing its value in electronics assembly and printed circuit board testing:

  • IEC 61189 Series: Comprehensive standards on test methods for electrical materials, circuit boards, and assemblies.
  • IEC 60194-2: Defines terminology and vocabulary for printed board and electronic assembly technologies, forming the basis for consistent communication and interpretation.
  • Other IPC and IEC Test Standards: For quantitative measurements and specification compliance, refer to dedicated standards such as IPC-2221 (generic requirements for PCB design) and other relevant parts of IEC 61189 addressing specific test methods.

Applying EN IEC 61189-2-720:2024 helps electronics manufacturers improve early detection of defects and enhance the reliability and performance of circuit boards. By integrating capacitance-based qualitative assessment into the development process, organizations can drive higher quality and deliver more reliable electronic products to the market.

Buy Documents

Standard

EN IEC 61189-2-720:2025 - BARVE

English language (13 pages)
Preview
Preview
e-Library read for
1 day

Frequently Asked Questions

EN IEC 61189-2-720:2024 is a standard published by CLC. Its full title is "Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance". This standard covers: IEC 61189-2-720:2024 provides a method to evaluate specific characteristics of circuit boards by measuring the capacitance between conductor traces and a ground plane and can be used for qualitative comparison of a test specimen to a reference board. This method is not intended for quantitative measurements and for assessment of conformity to a specification.

IEC 61189-2-720:2024 provides a method to evaluate specific characteristics of circuit boards by measuring the capacitance between conductor traces and a ground plane and can be used for qualitative comparison of a test specimen to a reference board. This method is not intended for quantitative measurements and for assessment of conformity to a specification.

EN IEC 61189-2-720:2024 is classified under the following ICS (International Classification for Standards) categories: 31.180 - Printed circuits and boards. The ICS classification helps identify the subject area and facilitates finding related standards.

EN IEC 61189-2-720:2024 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.

Standards Content (Sample)


SLOVENSKI STANDARD
01-maj-2025
Preskusne metode za električne materiale, tiskana vezja in druge povezovalne
strukture in sestave - 2-720. del: Odkrivanje napak v povezovalnih strukturah z
merjenjem kapacitivnosti
Test methods for electrical materials, printed board and other interconnection structures
and assemblies - Part 2-720: Detection of defects in interconnection structures by
measurement of capacitance
Prüfverfahren für elektrische Materialien, Leiterplatten und andere
Verbindungsstrukturen und -Baugruppen - Teil 2-720: Erkennung von Fehlern in
Verbindungsstrukturen durch Messung der Kapazität
Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres
structures d’interconnexion et ensembles - Partie 2-720: Détection de défauts présents
dans les structures d’interconnexion par mesurage de la capacité
Ta slovenski standard je istoveten z: EN IEC 61189-2-720:2024
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 61189-2-720

NORME EUROPÉENNE
EUROPÄISCHE NORM April 2024
ICS 31.180
English Version
Test methods for electrical materials, circuit boards and other
interconnection structures and assemblies - Part 2-720:
Detection of defects in interconnection structures by
measurement of capacitance
(IEC 61189-2-720:2024)
Méthodes d'essai pour les matériaux électriques, les cartes Prüfverfahren für elektrische Materialien, Leiterplatten und
imprimées et autres structures d'interconnexion et andere Verbindungsstrukturen und -Baugruppen - Teil 2-
ensembles - Partie 2-720 : Détection de défauts présents 720: Erkennung von Fehlern in Verbindungsstrukturen
dans les structures d'interconnexion par mesurage de la durch Messung der Kapazität
capacité (IEC 61189-2-720:2024)
(IEC 61189-2-720:2024)
This European Standard was approved by CENELEC on 2024-04-10. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2024 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 61189-2-720:2024 E

European foreword
The text of document 91/1923/FDIS, future edition 1 of IEC 61189-2-720, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61189-2-720:2024.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2025-01-10
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2027-04-10
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 61189-2-720:2024 was approved by CENELEC as a
European Standard without any modification.
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the
relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cencenelec.eu.
Publication Year Title EN/HD Year
IEC 60194-2 - Printed boards design, manufacture and - -
assembly - Vocabulary - Part 2: Common
usage in electronic technologies as well as
printed board and electronic assembly
technologies
IEC 61189-2-720 ®
Edition 1.0 2024-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Test methods for electrical materials, circuit boards and other interconnection

structures and assemblies –
Part 2-720: Detection of defects in interconnection structures by measurement

of capacitance
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres

structures d'interconnexion et ensembles –

Partie 2-720 : Détection de défauts présents dans les structures

d'interconnexion par mesurage de la capacité

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180  ISBN 978-2-8322-8327-1

– 2 – IEC 61189-2-720:2024 © IEC 2024
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Objective . 5
5 Test specimen . 6
6 Test method . 6
7 Test procedures . 7
8 Report . 8
Annex A (informative) The capacitive test method . 9
A.1 Test schematic . 9
A.2 Test result. 9

Figure 1 – Capacitance difference depending on the defect of mouse bite . 6
Figure 2 – Test specimen . 6
Figure 3 – Schematic of the capacitance test method . 7
Figure A.1 – Test schematic . 9

Table 1 – Definition of uppercase . 8
Table A.1 – Test result for the test specimen . 10

IEC 61189-2-720:2024 © IEC 2024 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
TEST METHODS FOR ELECTRICAL MATERIALS, CIRCUIT BOARDS AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 2-720: Detection of defects in interconnection
structures by measurement of capacitance

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other
...

Questions, Comments and Discussion

Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.

Loading comments...