CEN ISO/TS 80004-8:2015

SLOVENSKI STANDARD
01-julij-2015
Nanotehnologije - Slovar - 8. del: Procesi nanoproizvodnje (ISO/TS 80004-8:2013)
Nanotechnologies - Vocabulary - Part 8: Nanomanufacturing processes (ISO/TS 80004-
8:2013)
Nanotechnologien - Fachwörterverzeichnis - Teil 8: Industrieller
Nanoherstellungsprozess (ISO/TS 80004-8:2013)
Nanotechnologies - Vocabulaire - Partie 8: Processus de nanofabrication (ISO/TS 80004
-8:2013)
Ta slovenski standard je istoveten z: CEN ISO/TS 80004-8:2015
ICS:
01.040.07 Naravoslovne in uporabne Natural and applied sciences
vede (Slovarji) (Vocabularies)
07.120 Nanotehnologije Nanotechnologies
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

TECHNICAL SPECIFICATION
CEN ISO/TS 80004-8
SPÉCIFICATION TECHNIQUE
TECHNISCHE SPEZIFIKATION
May 2015
ICS 07.030; 01.040.07
English Version
Nanotechnologies - Vocabulary - Part 8: Nanomanufacturing
processes (ISO/TS 80004-8:2013)
Nanotechnologies - Vocabulaire - Partie 8: Processus de Nanotechnologien - Fachwörterverzeichnis - Teil 8:
nanofabrication (ISO/TS 80004-8:2013) Industrieller Nanoherstellungsprozess (ISO/TS 80004-
8:2013)
This Technical Specification (CEN/TS) was approved by CEN on 16 May 2015 for provisional application.

The period of validity of this CEN/TS is limited initially to three years. After two years the members of CEN will be requested to submit their
comments, particularly on the question whether the CEN/TS can be converted into a European Standard.

CEN members are required to announce the existence of this CEN/TS in the same way as for an EN and to make the CEN/TS available
promptly at national level in an appropriate form. It is permissible to keep conflicting national standards in force (in parallel to the CEN/TS)
until the final decision about the possible conversion of the CEN/TS into an EN is reached.

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Kingdom.
EUROPEAN COMMITTEE FOR STANDARDIZATION
COMITÉ EUROPÉEN DE NORMALISATION

EUROPÄISCHES KOMITEE FÜR NORMUNG

CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2015 CEN All rights of exploitation in any form and by any means reserved Ref. No. CEN ISO/TS 80004-8:2015 E
worldwide for CEN national Members.

Contents
Page
Foreword .3

Foreword
The text of ISO/TS 80004-8:2013 has been prepared by Technical Committee ISO/TC 229
“Nanotechnologies” of the International Organization for Standardization (ISO) and has been taken over as
is held by AFNOR.
Attention is drawn to the possibility that some of the elements of this document may be the subject of patent
rights. CEN [and/or CENELEC] shall not be held responsible for identifying any or all such patent rights.
According to the CEN-CENELEC Internal Regulations, the national standards organizations of the following
countries are bound to announce this Technical Specification: Austria, Belgium, Bulgaria, Croatia, Cyprus,
Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany,
Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland,
Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom.
Endorsement notice
The text of ISO/TS 80004-8:2013 has been approved by CEN as CEN ISO/TS 80004-8:2015 without any
modification.
TECHNICAL ISO/TS
SPECIFICATION 80004-8
First edition
2013-12-15
Nanotechnologies — Vocabulary —
Part 8:
Nanomanufacturing processes
Nanotechnologies — Vocabulaire —
Partie 8: Processus de nanofabrication
Reference number
ISO/TS 80004-8:2013(E)
©
ISO 2013
ISO/TS 80004-8:2013(E)
© ISO 2013
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized otherwise in any form
or by any means, electronic or mechanical, including photocopying, or posting on the internet or an intranet, without prior
written permission. Permission can be requested from either ISO at the address below or ISO’s member body in the country of
the requester.
ISO copyright office
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Tel. + 41 22 749 01 11
Fax + 41 22 749 09 47
E-mail copyright@iso.org
Web www.iso.org
Published in Switzerland
ii © ISO 2013 – All rights reserved

ISO/TS 80004-8:2013(E)
Contents Page
Foreword .iv
Introduction .vi
1 Scope . 1
2 Terms and definitions from other parts of ISO/TS 80004 . 1
3 General terms . 3
4 Directed assembly . 4
5 Self-assembly processes . 4
6 Synthesis . 5
6.1 Gas process phase — Physical methods . 5
6.2 Gas process phase — Chemical methods . 6
6.3 Liquid process phase — Physical methods . 7
6.4 Liquid process phase — Chemical methods . 8
6.5 Solid process phase — Physical methods . 8
6.6 Solid process phase — Chemical methods .10
7 Fabrication .11
7.1 Nanopatterning lithography .11
7.2 Deposition processes .14
7.3 Etching processes .16
7.4 Printing and coating .18
Annex A (informative) Identification of output resulting from defined synthesis processes .19
Annex B (informative) Index .21
Bibliography .27
ISO/TS 80004-8:2013(E)
Foreword
ISO (the International Organization for Standardization) is a worldwide federation of national standards
bodies (ISO member bodies). The work of preparing International Standards is normally carried out
through ISO technical committees. Each member body interested in a subject for which a technical
committee has been established has the right to be represented on that committee. International
organizations, governmental and non-governmental, in liaison with ISO, also take part in the work.
ISO collaborates closely with the International Electrotechnical Commission (IEC) on all matters of
electrotechnical standardization.
The procedures used to develop this document and those intended for its further maintenance are
described in the ISO/IEC Directives, Part 1. In particular the different approval criteria needed for the
different types of ISO documents should be noted. This document was drafted in accordance with the
editorial rules of the ISO/IEC Directives, Part 2. www.iso.org/directives
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. ISO shall not be held responsible for identifying any or all such patent rights. Details of any
patent rights identified during the development of the document will be in the Introduction and/or on
the ISO list of patent declarations received. www.iso.org/patents
Any trade name used in this document is information given for the convenience of users and does not
constitute an endorsement.
For an explanation on the meaning of ISO specific terms and expressions related to conformity
assessment, as well as information about ISO’s adherence to the WTO principles in the Technical
Barriers to Trade (TBT) see the following URL: Foreword - Supplementary information
ISO/TS 80004-8 was prepared jointly by Technical Committee ISO/TC 229, Nanotechnologies, and Technical
Committee IEC/TC 113, Nanotechnology standardization for electrical and electronic products and systems.
Documents in the 80000 to 89999 range of reference numbers are developed by collaboration
between ISO and IEC.
ISO/TS 80004 consists of the following parts, under the general title Nanotechnologies — Vocabulary:
— Part 1: Core terms
— Part 3: Carbon nano-objects
— Part 4: Nanostructured materials
— Part 5: Nano/bio interface
— Part 6: Nano-object characterization
— Part 7: Diagnostics and therapeutics for healthcare
— Part 8: Nanomanufacturing processes
The following parts are under preparation:
1)
— Part 2: Nano-objects: Nanoparticle, nanofibre and nanoplate
— Part 9: Nano-enabled electrotechnical products and systems
— Part 10: Nano-enabled photonic components and systems
— Part 11: Nanolayer, nanocoating, nanofilm, and related terms
— Part 12: Quantum phenomena in nanotechnology
[5]
1) Revises and replaces ISO/TS 27687 .
iv © ISO 2013 – All rights reserved

ISO/TS 80004-8:2013(E)
Graphene and other two-dimensional materials is to form the subject of a future part 13.
ISO/TS 80004-8:2013(E)
Introduction
Nanomanufacturing is the essential bridge between the discoveries of the nanosciences and real-world
nanotechnology products.
Advancing nanotechnology from the laboratory into volume production ultimately requires careful
study of manufacturing process issues including product design, reliability and quality, process design
and control, shop floor operations, supply chain management, workplace safety and health practices
during the production, use, and handling of nanomaterials. Nanomanufacturing encompasses directed
self assembly and assembly techniques, synthetic methodologies, and fabrication processes such as
lithography and biological processes. Nanomanufacturing also includes bottom-up directed assembly,
top-down high resolution processing, molecular systems engineering, and hierarchical integration with
larger scale systems. As dimensional scales of materials and molecular systems approach the nanoscale,
the conventional rules governing their behaviour may change significantly. As such, the behaviour of a
final product is enabled by the collective performance of its nanoscale building blocks.
Biological process terms are not included in this first edition of the nanomanufacturing vocabulary, but
considering the rapid development of the field, it is expected that terms in this important area will be
added in a future update to this Technical Specification or in companion documents in the 80004 series.
This could include both the processing of biological nanomaterials and the use of biological processes to
manufacture materials at the nanoscale.
Similarly, additional terms from other developing areas of nanomanufacturing, including composite
manufacturing, roll-to-roll manufacturing, and others, will be included in future documents.
There is a distinction between the terms nanomanufacturing and nanofabrication. Nanomanufacturing
encompasses a broader range of processes than does nanofabrication. Nanomanufacturing
encompasses all nanofabrication techniques and also techniques associated with materials processing
and chemical synthesis.
This document provides an introduction to processes used in the early stages of the nanomanufacturing
value chain, namely the intentional synthesis, generation or control of nanomaterials, including
fabrication steps in the nanoscale. The nanomaterials that result from these manufacturing processes
are distributed in commerce where, for example, they may be further purified, be compatabilized to
be dispersed in mixtures or composite matrices, or serve as integrated components of systems and
devices. The nanomanufacturing value chain is, in actuality, a large and diverse group of commercial
value chains that stretch across these sectors:
— the semiconductor industry (where the push to create smaller, faster, and more efficient
microprocessors heralded the creation of circuitry less than 100 nm in size);
— electronics and telecommunications;
— aerospace, defence, and national security;
— energy and automotive;
— plastics and ceramics;
— forest and paper products;
— food and food packaging;
— pharmaceuticals, biomedicine, and biotechnology;
— environmental remediation;
— clothing and personal care.
There are thousands of tonnes of nanomaterials on the market with end use applications in several of
these sectors, such as carbon black and fumed silica. Nanomaterials which are rationally designed with
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ISO/TS 80004-8:2013(E)
specific purpose are expected to radically change the landscape in areas such as biotechnology, water
purification, and energy development.
The majority of sections in this document are organized by process type. In the case of section 6, the logic
of placement is as follows: in the step before the particle is made, the material itself is in a gas/liquid/
solid phase. The phase of the substrate or carrier in the process does not drive the categorization of
the process. As an example, consider iron particles that are catalysts in a process by which you seed oil
with iron particles, the oil vaporizes and condenses forming carbon particles on the iron particles. What
vaporizes is the oil, and therefore it is a gas phase process. Nanotubes grown from the gas phase, starting
with catalyst particles that react with the gas phase to grow the nanotubes, thus this is characterized
as a gas process. Indication of whether synthesis processes are used to manufacture nano-objects,
nanoparticles, or both, is provided in Annex A.
A common understanding of the terminology used in practical applications will enable communities of
practice in nanomanufacturing and will advance nanomanufacturing strength worldwide. Extending
the understanding of terms across the existing manufacturing infrastructure will serve to bridge
the transition between the innovations of the research laboratory and the economic viability of
nanotechnologies.
For informational terms supportive of nanomanufacturing terminology, see Reference [1].
TECHNICAL SPECIFICATION ISO/TS 80004-8:2013(E)
Nanotechnologies — Vocabulary —
Part 8:
Nanomanufacturing processes
1 Scope
This Technical Specification gives terms and definitions related to nanomanufacturing processes in the
field of nanotechnologies. It forms one part of multi-part terminology and definitions documentation
covering the different aspects of nanotechnologies.
All the process terms in this document are relevant to nanomanufacturing. Many of the listed processes
are not exclusively relevant to the nanoscale. Depending on controllable conditions, such processes may
result in material features at the nanoscale or, alternatively, larger scales.
There are many other terms that name tools, components, materials, systems control methods or
metrology methods associated with nanomanufacturing that are beyond the scope of this document.
2 Terms and definitions from other parts of ISO/TS 80004
The terms and definitions in this clause are given in other parts of ISO/TS 80004. They are reproduced
here for context and better understanding.
2.1
carbon nanotube
CNT
nanotube (2.9) composed of carbon
Note 1 to entry: carbon nanotubes usually consist of curved graphene layers, including single-wall carbon
nanotubes and multiwall carbon nanotubes.
[SOURCE: ISO/TS 80004-3:2010, 4.3.]
2.2
nanocomposite
solid comprising a mixture of two or more phase-separated materials, one or more being nanophase
Note 1 to entry: Gaseous nanophases are excluded (they are covered by nanoporous material).
Note 2 to entry: Materials with nanoscale (2.7) phases formed by precipitation alone are not considered to be
nanocomposite materials.
[SOURCE: ISO/TS 80004-4:2011, 3.2.]
2.3
nanofibre
nano-object with two similar external dimensions in the nanoscale (2.7) and the third dimension
significantly larger
Note 1 to entry: A nanofibre can be flexible or rigid.
Note 2 to entry: The two similar external dimensions are considered to differ in size by less than three times and
the significantly larger external dimension is considered to differ from the other two by more than three times.
Note 3 to entry: The largest external dimension is not necessarily in the nanoscale (2.7).
ISO/TS 80004-8:2013(E)
[SOURCE: ISO/TS 27687:2008, 4.3.]
2.4
nanomaterial
material with any external dimension in the nanoscale (2.7) or having internal structure or surface
structure in the nanoscale
Note 1 to entry: This generic term is inclusive of nano-object (2.5) and nanostructured material (2.9).
Note 2 to entry: See also engineered nanomaterial, manufactured nanomaterial and incidental nanomaterial
[SOURCE: ISO/TS 80004-1:2010, 2.4.]
2.5
nano-object
material with one, two or three external dimensions in the nanoscale (2.7)
Note 1 to entry: Generic term for all discrete nano-objects.
[SOURCE: ISO/TS 80004-1:2010, 2.5.]
2.6
nanoparticle
nano-object (2.5) with all three external dimensions in the nanoscale (2.7)
Note 1 to entry: if the lengths of the longest to the shortest axes of the nano-object (2.5) differ significantly
(typically by more than three times), the terms nanofibre (2.3) or nanoplate are intended to be used instead of the
term nanoparticle.
[SOURCE: ISO/TS 27687:2008, 4.1.]
2.7
nanoscale
size range from approximately 1 nm to 100 nm
Note 1 to entry: Properties that are not extrapolations from a larger size will typically, but not exclusively, be
exhibited in this size range. For such properties the size limits are considered approximate.
Note 2 to entry: The lower limit in this definition (approximately 1 nm) is introduced to avoid single and small
groups of atoms from being designated as nano-objects (2.5) or elements of nanostructures, which might be
implied by the absence of a lower limit.
[SOURCE: ISO/TS 80004-1:2010, 2.1.]
2.8
nanostructured material
material having internal or surface structure in the nanoscale (2.7)
Note 1 to entry: If external dimensions are in the nanoscale, the term nano-object (2.4) is recommended.
Note 2 to entry: Adapted from ISO/TS 80004-1:2010, definition 2.7.
[SOURCE: ISO/TS 80004-4, 2.11.]
2.9
nanotube
hollow nanofibre (2.3)
[SOURCE: ISO/TS 27687:2008, 4.4]
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ISO/TS 80004-8:2013(E)
3 General terms
3.1
bottom up nanomanufacturing
processes that use small fundamental units in the nanoscale (2.7) to create larger functionally rich
structures or assemblies
3.2
co-deposition
simultaneous deposition of two or more source materials
Note 1 to entry: Common methods include vacuum, thermal spray, electrodeposition and liquid suspension
deposition techniques.
3.3
communition
crushing or grinding for particle size reduction
3.4
directed assembly
formation of a structure guided by external intervention using components at the
nanoscale (2.7) that can, in principle, have any defined pattern
3.5
directed self-assembly
self-assembly (3.11) influenced by external intervention to produce a preferred structure, orientation or
pattern
Note 1 to entry: Examples of external intervention include an applied field, a chemical or structural template,
chemical gradient, and fluidic flow.
3.6
lithography
reproducible creation of a pattern
Note 1 to entry: The pattern can be formed in a radiation sensitive material or by transfer of material onto a
substrate either by transfer, by printing or by direct writing.
3.7
multilayer deposition
alternating deposition of two or more source materials to produce a composite layer structure
3.8
nanofabrication
ensemble of activities, to intentionally manufacture devices in the nanoscale (2.7), for commercial purpose
3.9
nanomanufacturing
intentional synthesis, generation or control of nanomaterials, or fabrication steps in the nanoscale (2.7),
for commercial purpose
[SOURCE: ISO/TS 80004-1:2010, definition 2.11.]
3.10
nanomanufacturing process
ensemble of activities to intentionally synthesize, generate or control nanomaterials (2.4), or fabrication
steps in the nanoscale (2.7), for commercial purpose
[SOURCE: ISO/TS 80004-1:2010, 2.12.]
ISO/TS 80004-8:2013(E)
3.11
self-assembly
autonomous action by which components organize themselves into patterns or structures
3.12
surface functionalization
chemical process that acts upon a surface to impart a selected chemical or physical functionality
3.13
top-down nanomanufacturing
processes that create structures at the nanoscale (2.7) from macroscopic objects
4 Directed assembly
4.1
electrostatic driven assembly
use of electrostatic force to orient or place nanoscale (2.7) elements in a device or
material
4.2
fluidic alignment
use of fluid flow to orient nanoscale (2.7) elements in a device or material
4.3
hierarchical assembly
use of more than one type of nanomanufacturing (3.9) process to control structure
at multiple length scales
4.4
magnetic driven assembly
use of magnetic force to assemble at the nanoscale (2.7) in a desired pattern or
configuration
4.5
shape-based assembly
use of geometric shapes of nanoparticles (2.6) to achieve a desired pattern or
configuration
4.6
supramolecular assembly
use of non-covalent chemical bonding to assemble molecules or nanoparticles (2.6) with surface ligands
4.7
surface-to-surface transfer
transfer of nanoparticles (2.6) or structures from the surface of one substrate, on
which they have been deposited, grown or assembled, onto another substrate
5 Self-assembly processes
5.1
colloidal crystallization
sedimentation of nanoparticles (2.6) from a solution to form a solid which consists
of a close-packed, ordered array of repeating units
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ISO/TS 80004-8:2013(E)
5.2
graphioepitaxy
directed self-assembly (3.5) using nanoscale (2.7) topographical features
Note 1 to entry: Includes the growth of a thin layer on the surface and growth of an additional layer on top of a
substrate which has the same or different structure as the underlying crystal.
5.3
ion beam surface reconstruction
use of an accelerated ion beam to cause surface modification which may be at the
nanoscale (2.7)
5.4
Langmuir-Blodgett film formation
creation of a molecular monolayer at an air-liquid interface using a Langmuir-Blodgett trough
5.5
Langmuir-Blodgett film transfer
transfer of a Langmuir-Blodgett molecular monolayer formed at an air-liquid interface onto a solid
surface by dipping a solid substrate into the supporting liquid
5.6
layer-by-layer deposition
LbL deposition
electrostatic process of depositing polyelectrolytes with opposite charges laid over or under another
5.7
modulated elemental reactant method
use of vapour deposited precursors with regions of controlled composition as a template for the
formation of interleaved layers of two or more structures
5.8
self-assembled monolayer formation
SAM formation
spontaneous formation of an organized molecular layer on a solid surface from solution or the vapour
phase, driven by molecule-to-surface bonding and weak intermolecular interaction
5.9
Stranski-Krastanow growth
mode of thin film growth in which both layer and island formation mechanisms are present
6 Synthesis
6.1 Gas process phase — Physical methods
6.1.1
cold gas dynamic spraying
to fluidize either nanoscale (2.7) crystalline powders or conventional powders that are then consolidated
onto a surface coating in a high velocity inert gas
6.1.2
electron-beam evaporation
process in which a material is vaporized by incidence of high energy electrons in high or ultra-high
vacuum conditions for subsequent deposition onto a substrate
ISO/TS 80004-8:2013(E)
6.1.3 Electro-spark deposition processes
6.1.3.1
electro-spark deposition
pulsed-arc micro-welding process using short-duration, high-current electrical pulses to deposit an
electrode material on a substrate
6.1.4 Spray drying processes
6.1.4.1
freeze drying
dehydration or solvent removal by rapid cooling immediately followed by vacuum sublimation
6.1.4.2
spray drying
producing a dry powder from a liquid or slurry by rapid removal of liquid droplets via contact with a hot gas
6.1.5
supercritical expansion
precipitation of nano-objects (2.5) resulting from an expansion of a solution above its critical temperature
(T ) and critical pressure (P ) through a spray device
C C
6.1.6
suspension combustion thermal spray
thermal spray (7.2.16) in which the precursor is introduced to a plasma jet in the form of a liquid suspension
6.1.7
wire electric explosion
formation of nanoparticles (2.6) by applying an electrical pulse of high current density through a wire
causing it to volatilize with subsequent recondensation
6.1.8
vaporization
process of assisted change of phase from solid or liquid to gas or plasma phases
Note 1 to entry: Vaporization process is often used to consequently deposit the vaporized material on a target
[7]
substrate. The whole process is known as PVD (ISO 2080:2008, 2.12) .
−6 −9
Note 2 to entry: High Vacuum PVD is usually performed at pressures in the range of 10 to 10 Torr. Ultra-High
−9
Vacuum (UHV PVD) is the deposition performed at pressures below 10 Torr.
6.2 Gas process phase — Chemical methods
6.2.1 Flame synthesis processes
6.2.1.1
liquid precursor combustion
creation of solid product, typically a nanomaterial (2.4) in aggregate form, via exothermic reaction of a
feedstock solution with an oxidizer
[SOURCE: ISO 19353, 3.3, modified.]
6.2.1.2
plasma spray
creation of a jet of solid product, typically a nanomaterial (2.4) in aggregate form from an ionized
gaseous source
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ISO/TS 80004-8:2013(E)
6.2.1.3
pyrogenesis
using combustion or other heat source to produce solid product, typically a nanomaterial (2.4) in
aggregate form facilitated by an aerosolized spray
6.2.1.4
solution precursor plasma spray
gas phase process in which a thermal (equilibrium) plasma is formed into which a solution containing
precursors is introduced resulting in gaseous species that during cooling form a solid product, typically
a nanomaterial (2.4) in aggregate form
6.2.1.5
thermal spray pyrolysis
creation of solid product, typically a nanomaterial (2.4) in aggregate form from liquid precursors through
liquid atomization and reaction using a thermal source
6.2.2
hot wall tubular reaction
chemical vapour deposition (7.2.3) performed in a tubular furnace in which the reaction surface is
maintained at a controlled elevated temperature
6.2.3
photothermal synthesis
gas phase process where a precursor or other gaseous species is heated by absorption of infrared
radiation resulting in heating of the gas and thermal decomposition of the precursor producing a solid
product, typically a nanoparticle (2.6)
6.2.4
vapour-liquid-solid nanofibre synthesis
VLS
growth of nanofibres (2.3) onto a substrate with feed material in gaseous form in the presence of a
liquid catalyst
Note 1 to entry: The VLS method for fibres exploits a liquid phase on the end of a fibre which can rapidly adsorb a
vapour to supersaturation levels, and from which crystal growth subsequently occurs.
6.3 Liquid process phase — Physical methods
6.3.1
electrospinning
use of electrical potential to induce drawing of fine fibres from a liquid phase
6.3.2
in-situ intercalative polymerization
insertion of monomers into layered inorganic materials followed by polymerization which result in
nanocomposites (2.2)
6.3.3
nanoparticle dispersion
creating a suspension of nanoparticles (2.6) in a liquid through molecular ligands, surface charges or
other interactions to prevent or slow sedimentation
6.3.5
tape casting
deposition of macroscopic layer by spreading slurry of ceramic paste onto a flat surface
Note 1 to entry: Nanoparticles (2.6) may be part of the composition of the layer.
ISO/TS 80004-8:2013(E)
6.3.6
wet ball milling
grinding (6.5.5) process in liquid via rolling feedstock material with crushing balls of greater hardness
to create a force of impact in order to reduce the size of target components
Note 1 to entry: The product of the process is known as slurry.
6.4 Liquid process phase — Chemical methods
6.4.1
acid hydrolysis of cellulose
use of an acid to release nanocrystalline cellulose from cellulose
6.4.2
nanoparticle precipitation
formation of nanoparticles (2.6) from solution reactions where particle size may be controlled by
kinetic factors
6.4.3
prompt inorganic condensation
formation of atomically smooth and dense films by spin-coating (7.2.17) and low-temperature curing of
organic free aqueous solutions based on organometallic molecular precursors
6.4.4
reverse micelle process
synthesis of nanoparticles (2.6) in solution using reagents in the presence of reaction stopping ligands
that attach to the nanoparticle surface and inhibit further growth
6.4.5
sol-gel processing
conversion of a chemical solution or colloidal suspension (sol) to an integrated network (gel), which can
then be further densified
6.4.6
surfactant templating
use of surfactants to self-assemble molecular species such that they can be subsequently solidified in a
structured configuration at the nanoscale (2.7)
EXAMPLE MCM 41.
6.4.7
Stober process
generation of particles of silicate by using a tetra-alkyl orthosilicate and a combination of low molecular
weight alcohol and ammonia, used with or without water
Note 1 to entry: This is a sol-gel processing (6.4.5) method for synthesizing silica.
6.5 Solid process phase — Physical methods
6.5.1 Block copolymer processes
6.5.1.1
block copolymer phase segregation
formation of repeatable 2D and 3D structures from the segregation of immiscible polymer chain segments
6.5.1.2
block copolymer templating
incorporation of a material into the phase of a block copolymer to achieve nanoscale (2.7) structure
8 © ISO 2013 – All rights reserved

ISO/TS 80004-8:2013(E)
6.5.2
clay dispersion
mixing of clay particles into a liquid matrix, usually polymeric, which is then solidified to produce a
clay composite
6.5.3
cold pressing
pressing particles at the nanoscale (2.7) with applied pressure to fuse and create density
6.5.4
conshearing continuous confined strip shearing
C2S2
use of very large plastic strain to produce grains in a bulk metal without any significant change in the
overall dimensions
Note 1 to entry: The main objective is to produce lightweight parts with greatly improved mechanical properties.
6.5.5
devitrification
structural transformation from a glassy state to a crystalline state that introduces nanoscale (2.7)
voids or structure
6.5.6
grinding
creation of nanoparticles (2.6) via mechanical shearing in contact with a material
of greater hardness
6.5.7
high-speed micromachining
creating precise two and three dimensional workpieces from the bulk or on the surface of an object or
material by cutting using defined geometry cutting tools
Note 1 to entry: Precision is achieved through high cutting spindle speeds usually between 30 000 and 100 000 r/min.
Note 2 to entry: Laser, e-beam, ion beam, ultrasound, milling and CNC machining can be used.
Note 3 to entry: Definition of high speed varies with each specific technology.
6.5.8
ion implantation
use of incident flux high energy ions to modify the surface material by damage and recrystallization
6.5.9 Milling processes
6.5.9.1
cryogenic milling
grinding (6.5.5) under cryogenic temperatures (below −150 °C, −238 °F or 123 K)
6.5.9.2
dry ball milling
creation of nanoparticles (2.6) via rolling feedstock material with crushing balls
of greater hardness to mix two or more immiscible nanoparticles which are then heated to sinter them
[SOURCE: ISO 11074:2005, ISO 3252:1999, modified.]
6.5.10
multi-pass coin forging
production of nanoscale (2.7) grain structures using severe plastic deformation by mechanical pressing
a sheet of material between two sine shaped dies with successive rotation of the workpiece followed by
flat forging or rolling
ISO/TS 80004-8:2013(E)
6.5.11
nanotemplated growth
deposition from solution or vapour phase of material into nanoscale (2.7) confined spaces to form
nanoparticles (2.6) or nanostructured materials (2.8)
6.5.12
polymer nanoparticle dispersion
mixing of nanoparticles (2.6) into a liquid polymer matrix which is solidified to produce a polymer
matrix nanoparticle composite
6.5.13 Sintering processes
6.5.13.1
hot pressing
high-pressure powder metallurgy process for forming hard and brittle materials at high temperatures
Note 1 to entry: Pressures of up to 50 MPa (7 300 psi) and temperatures of typically 2 400 °C (4 350 °F) may be used.
6.5.13.2
nanoparticle sintering
joining of particles and increasing their contact interfaces by atom movement within and between the
particles due to the application of heat
[SOURCE: ISO 836:2001.]
6.5.13.3
spark plasma sintering
densifying powders under mechanical pressure by applying DC pulsed currents to conducting powders
at a very high heating or cooling rate (up to 1 000 K/min), avoiding coarsening the internal structure
6.6 Solid process phase — Chemical methods
6.6.1
block copolymer chemical derivatization
modification of block copolymer solid through the addition of atoms or molecules that selectively bind
or segregate to only one phase
6.6.2
electrochemical anodization
a process in which the anode is simultaneously oxidized and etched, resulting in
nanoscale (2.7) pores usually with a high degree of regularity and controllability
Note 1 to entry: This process may also be referred to as anodic etching.
6.6.3
intercalation
process that inserts heterogeneous material (atoms, small molecules) into a host structure (crystal
lattice or other macromolecular structure)
6.6.4
two-phase methods
heating and then rapid cooling binary mixture of materials to produce a solid composite with nanoscale
(2.7) features
10 © ISO 2013 – All rights reserved

ISO/TS 80004-8:2013(E)
7 Fabrication
7.1 Nanopatterning lithography
7.1.1
3D lithography
process in which patterns or structuring can be achieved with nanoscale (2.7) dimensions in all
three dimensions
7.1.2
additive processing
adding a layer of new material, in order to leave a pattern of deposited material on the substrate
Note 1 to entry: Two terms are used to describe additive processing using resist: lift-off and stencil. In lift-off the
layer of new material is applied to the whole surface, the pattern is revealed after the removal of the unexposed
resist with the overlaid material; with a stencil the new material is only added where the surface is not protected
by resist [as with electrodeposition (7.2.4) with a resist layer in place].
7.1.3
block copolymer lithography
use of microphase separation in diblock copolymers to create polymer templates with nanoscale
(2.7) patterns
7.1.4
colloidal crystal template lithography
use of crystallized colloidal particles to create a 2D or 3D framework for subsequent deposition or etching
7.1.5
deep ultraviolet lithography
DUV
patterned exposure of a photoactive polymer using ultraviolet light in the wavelength range 100 nm to
280 nm
7.1.6
dip-pen nanolithography
method in which a scanning tip is used to transfer specific material onto a substrate surface, via a solvent
meniscus, for patterning a substrate at length scales below 100 nm
Note 1 to entry: Often the tip is an AFM tip coated with specific molecules that are to be deposited on the surface
in a layer that can be a monolayer. In other cases, the material to be deposited could be nanoparticles (2.6).
Note 2 to entry: “Dip-Pen Nanolithography” is the trade name of a product supplied by NanoInk Inc. This
information is given for the convenience of users of this document and does not constitute an endorsement by ISO
of the product named. Equivalent products may be used if they can be shown to lead to the same results.
[SOURCE: ISO 18115-2:2010, 6.40]
7.1.7
electron-beam lithography
direct write patterning process that uses a focused, concentrated stream of electrons to modify the
solubility of a resist layer
7.1.8
extreme ultraviolet lithography
EUV
exposure of a resist material using electromagnetic radiation of approximately 10 nm to 20 nm wavelength
Note 1 to entry: Usually reflective optics are used to focus the radiation.
ISO/TS 80004-8:2013(E)
7.1.9
focused ion-beam lithography
FIB
direct write patterning process that uses a focused ion beam to modify the solubility of a resist layer
7.1.10
immersion optics
optical lithography (3.6) process that immerses the objective lens and resist in a liquid to provide
refractive index matching
7.1.11
interference lithography
use of diffraction gratings to create an interference pattern of radiation to create nanoscale (2.7)
exposure patterns in resist
7.1.12
ion induced deposition
use of a focused, concentrated stream of ions to bring about or give rise to the localized reaction of an
adsorbed molecule to deposit material
7.1.13
ion induced etching
use of a focused ion beam to induce the localized reaction of an adsorbed molecule to etch the
substrate material
7.1.14
ion projection lithography
use of accelerated ions in conjunction with a mask to create nanoscale (2.7) exposure patterns in resist
7.1.15
micro-contact printing
form of soft lithography (3.6) in which a soft mould is dipped into an ink and the pattern transferred to
a substate by pressing
Note 1 to entry: The fidelity of the transfer is strongly dependent on the local surface characteristics of the
substrate for the particular material used as an ink.
7.1.16
microfluidic deposition
use of micrometre scale or nanoscale (2.7) channels in a solid manifold to facilitate the transfer of
material from a liquid or solution state into a solid state onto a substrate surface
7.1.17
nano-embossing
transfer of a pattern using a template into bulk material rather than into a thin film
Note 1 to entry: This definition also includes 3-dimensional patterning.
Note 2 to entry: In embossing, the flow of material displaced by the template is not constrained. The embossed
artefact is normally the end product, while in imprinting, the patterned resist is used in subsequent processing.
7.1.18
nano-imprint lithography
NIL
process in which a pattern is transferred by pressing a nanoscale (2.7) template (usually called a die,
stamp, mask or mould) of the desired pattern in relief into a deformable resist, which is then cured
thermally or with light
Note 1 to entry: As the pattern is defined by the topography of the template it is a printing process and not a
primary lithography (3.6).
12 © ISO 2013 – All rights reserved

ISO/TS 80004-8:2013(E)
Note 2 to entry: Types of nano-imprint lithography are conveniently divi
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