SIST EN 1758:2000

Overview

EN 1758:1997 - Copper and copper alloys - Strip for lead frames (CEN) defines requirements for copper and copper‑alloy strip used as lead frame material in electronic packaging. The standard covers composition, property requirements and tolerances on dimensions and form for strip with widths up to 100 mm and thickness ranges typically used for stamped lead frames. It applies across common thickness bands: 0.10 mm–1.00 mm (generally for integrated circuits and low‑power devices) and 1.00 mm–2.00 mm (generally for high‑power devices).

Key topics and requirements

• Material scope: Copper and copper alloy strip specified for lead‑frame manufacture.
• Dimensional limits: Width up to and including 100 mm; defined thickness bands for low‑ and high‑power applications.
• Tolerances and form: Requirements on thickness, width, flatness and edge condition to ensure consistent stamping, forming and assembly.
• Property requirements: Mechanical and physical properties necessary for stamping, plating and bonding during lead‑frame production (as specified by the standard).
• Intended use: Strip supplied for manufacture of stamped lead frames for integrated circuits and power devices.

Note: EN 1758 sets the framework and acceptance criteria; specific production controls, plating processes and device‑level assembly requirements are addressed by complementary manufacturing and electronic‑packaging practices.

Applications

• Production of stamped lead frames for integrated circuits (ICs), semiconductor packages and low‑power devices.
• Manufacture of thicker lead frames for high‑power devices where mechanical strength and current capacity are greater concerns.
• Use by strip suppliers to certify material conformity and by electronics manufacturers to specify supplied strip suitable for their stamping and plating process steps.

Keywords: EN 1758:1997, copper and copper alloys, strip for lead frames, lead frame material, integrated circuits, high power devices, dimensional tolerances.

Who should use this standard

• Material and strip suppliers validating product conformity.
• Lead‑frame stampers and semiconductor packagers specifying incoming material.
• Quality engineers and procurement teams sourcing copper alloy strip for electronic assembly.
• Designers and process engineers concerned with stamping, plating and assembly compatibility.

Related standards

Refer to other CEN, IEC or national standards covering copper alloys, electronic packaging and plating/attachment processes for complementary requirements and device‑level specifications.