SIST HD 323.2.20 S3:2003
(Main)Basic environmental testing procedures -- Part 2: Tests - Test T: Soldering
Basic environmental testing procedures -- Part 2: Tests - Test T: Soldering
Describes solderability tests on wire and tag terminations (Ta) and printed wiring boards (Tc), also describes tests for resistance to soldering heat, applicable to components (Tb).
Umweltprüfungen -- Teil 2: Prüfungen - Prüfgruppe T: Löten
Essais fondamentaux climatiques et de robustesse mécanique -- Partie 2: Essais - Essai T: Soudure
Décrit les modes opératoires des essais de "soudabilité" applicables aux sorties par fils ou par cosses (Ta), ou aux cartes de circuits imprimés (Tc) : décrit les essais de résistance à la chaleur de soudage, applicables aux composants (Tb).
Basic environmental testing procedures - Part 2: Tests - Test T: Soldering
General Information
- Status
- Withdrawn
- Publication Date
- 30-Jun-2003
- Withdrawal Date
- 05-May-2026
- Technical Committee
- ITIV - Electronics assembly technology and Environmental standardization
- Current Stage
- 9900 - Withdrawal (Adopted Project)
- Start Date
- 06-May-2026
- Due Date
- 29-May-2026
- Completion Date
- 06-May-2026
Relations
- Effective Date
- 01-Aug-2011
- Effective Date
- 03-Feb-2026
- Effective Date
- 03-Feb-2026
- Effective Date
- 03-Feb-2026
- Effective Date
- 03-Feb-2026
- Effective Date
- 03-Feb-2026
- Effective Date
- 03-Feb-2026
- Effective Date
- 03-Feb-2026
- Effective Date
- 03-Feb-2026
- Effective Date
- 03-Feb-2026
- Effective Date
- 03-Feb-2026
- Effective Date
- 03-Feb-2026
- Effective Date
- 03-Feb-2026
- Referred By
SIST EN 61810-1:2008 - Electromechanical elementary relays -- Part 1: General requirements - Effective Date
- 03-Feb-2026
- Effective Date
- 03-Feb-2026
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Frequently Asked Questions
SIST HD 323.2.20 S3:2003 is a standardization document published by the Slovenian Institute for Standardization (SIST). Its full title is "Basic environmental testing procedures -- Part 2: Tests - Test T: Soldering". This standard covers: Describes solderability tests on wire and tag terminations (Ta) and printed wiring boards (Tc), also describes tests for resistance to soldering heat, applicable to components (Tb).
Describes solderability tests on wire and tag terminations (Ta) and printed wiring boards (Tc), also describes tests for resistance to soldering heat, applicable to components (Tb).
SIST HD 323.2.20 S3:2003 is classified under the following ICS (International Classification for Standards) categories: 19.040 - Environmental testing. The ICS classification helps identify the subject area and facilitates finding related standards.
SIST HD 323.2.20 S3:2003 has the following relationships with other standards: It is inter standard links to SIST EN 60068-2-20:2009, SIST EN 60679-1:2002, SIST EN 61881:2001, SIST EN 60068-2-21:2001, SIST EN 62391-1:2006, SIST EN 62149-6:2004, SIST EN 61643-311:2005, SIST EN 61797-1:2002, SIST EN 62025-2:2005, SIST EN 60068-2-58:2005, SIST EN 60539-1:2003, SIST EN 60512-12-2:2006, SIST EN 60539-1:2008, SIST EN 61810-1:2008, SIST EN 60934:2003. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.
SIST HD 323.2.20 S3:2003 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.
Standards Content (Sample)
SLOVENSKI SIST HD 323.2.20 S3:2003
STANDARD
julij 2003
Basic environmental testing procedures - Part 2: Tests - Test T: Soldering
ICS 19.040 Referenčna številka
© S
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