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EUROPEAN STANDARD
EN 61189-5
NORME EUROPÉENNE
September 2006
EUROPÄISCHE NORM
ICS 31.180
English version
Test methods for electrical materials, interconnection structures
and assemblies
Part 5: Test methods for printed board assemblies
(IEC 61189-5:2006)
Méthodes d'essais pour les matériaux Prüfverfahren für Elektromaterialien,
électriques, les structures Verbindungsstrukturen
d'interconnexion et les ensembles und Baugruppen
Partie 5: Méthodes d'essais Teil 5: Prüfverfahren
pour les cartes imprimées équipées für bestückte Leiterplatten
(CEI 61189-5:2006) (IEC 61189-5:2006)

This European Standard was approved by CENELEC on 2006-09-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, the Czech
Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2006 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61189-5:2006 E
Foreword
The text of document 91/564/FDIS, future edition 1 of IEC 61189-5, prepared by IEC TC 91, Electronics
assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC
as EN 61189-5 on 2006-09-01.
This standard forms part of a series and should be used in conjunction with other parts in the same
series, under the main title Test methods for electrical materials, interconnection structures and
assemblies:
Part 1: General test methods and methodology
Part 2: Test methods for materials for interconnection structures
Part 3: Test methods for interconnection structures (printed boards)
Part 4: Test methods for electronic components assembling characteristics
Part 5: Test methods for printed board assemblies
Part 6: Test methods for materials used in electronic assemblies
It should also be read in conjunction with EN 60068, Environmental testing.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2007-06-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2009-09-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 61189-5:2006 was approved by CENELEC as a European
Standard without any modification.
__________
- 3 - EN 61189-5:2006
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year

1)
IEC 60068-1 1988 Environmental testing EN 60068-1 1994
Part 1: General and guidance
2) 3)
IEC 60068-2-20 - Environmental testing HD 323.2.20 S3 1988
Part 2: Tests - Test T: Soldering

2) 3)
IEC 61189-1 - Test methods for electrical materials, printed EN 61189-1 1997
boards and other interconnection structures
and assemblies
Part 1: General test methods and
methodology
2) 3)
IEC 61189-3 - Test methods for electrical materials, printed EN 61189-3 1997
boards and other interconnection structures
and assemblies
Part 3: Test methods for interconnection
structures (printed boards)
2) 3)
IEC 61189-6 - Test methods for electrical materials, EN 61189-6 2006
interconnection structures and assemblies
Part 6: Test methods for materials used in
manufacturing electronic assemblies

2) 3)
IEC 61190-1-1 - Attachment materials for electronic assembly EN 61190-1-1 2002
Part 1-1: Requirements for soldering fluxes
for high-quality interconnections in electronics
assembly
IEC 61190-1-2 2002 Attachment materials for electronic assembly EN 61190-1-2 2002
Part 1-2: Requirements for solder pastes for
high-quality interconnections in electronics
assembly
2) 3)
IEC 61190-1-3 - Attachment materials for electronic assembly EN 61190-1-3 2002
Part 1-3: Requirements for electronic grade
solder alloys and fluxed and non-fluxed solid
solders for electronic soldering applications

1)
EN 60068-1 includes corrigendum October 1988 + A1:1992 to IEC 60068-1.
2)
Undated reference.
3)
Valid edition at date of issue.

Publication Year Title EN/HD Year
2) 3)
IEC 61249-2-7 - Materials for printed boards and other EN 61249-2-7 2002
interconnecting structures + corr. September 2005
Part 2-7: Reinforced base materials, clad and
unclad - Epoxide woven E-glass laminated
sheet of defined flammability (vertical burning
test), copper-clad
IEC 62137 2004 Environmental and endurance testing - Test EN 62137 2004
+ corr. January 2005 methods for surface-mount boards of area + corr. February 2005
array type packages FBGA, BGA, FLGA,
LGA, SON and QFN
2)
ISO 5725-2 - Accuracy (trueness and precision) of - -
measurement methods and results
Part 2: Basic method for the determination of
repeatability and reproducibility of a standard
measurement method
2) 3)
ISO 9001 - Quality management systems - EN ISO 9001 2000
Requirements
2) 3)
ISO 9455-1 - Soft soldering fluxes - Test methods EN 29455-1 1993
Part 1: Determination of non-volatile matter,
gravimetric method
2) 3)
ISO 9455-2 - Soft soldering fluxes - Test methods EN ISO 9455-2 1995
Part 2: Determination of non-volatile matter,
ebulliometric method
INTERNATIONAL IEC
STANDARD 61189-5
First edition
2006-08
Test methods for electrical materials,
interconnection structures and assemblies –
Part 5:
Test methods for printed board assemblies
 IEC 2006  Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch
PRICE CODE
Commission Electrotechnique Internationale XB
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue

– 2 – 61189-5  IEC:2006(E)
CONTENTS
FOREWORD.4
INTRODUCTION.6

1 Scope.7
2 Normative references .7
3 Accuracy, precision and resolution .8
3.1 Accuracy .8
3.2 Precision .8
3.3 Resolution .9
3.4 Report .9
3.5 Student’s t distribution.10
3.6 Suggested uncertainty limits.10
4 Catalogue of approved test methods .11
5 P: Preparation/conditioning test methods.11
5.1 Test 5P01: Test-board design guideline.11
5.2 Test 5P02: Standard mounting process for CSP/BGA packages .11
6 V: Visual test methods.11
7 D: Dimensional test methods .11
8 C: Chemical test methods.11
8.1 Test 5C01: Corrosion, flux.11
9 M: Mechanical test methods .14
9.1 Test 5M01: Peel test method for test-board land .14
10 E: Electrical test methods .14
10.1 Test 5E01: Changes of the surface insulation resistance caused by fluxes .14
10.2 Test 5E02: Surface insulation resistance, assemblies .21
11 N Environmental test methods .30
11.1 Test 5N01: Reflow solderability test for soldering joint.30
11.2 Test 5N02: Resistance to reflow solderability of test board.30
11.3 Test 5N03: Solderability test for test-board land .30
12 X Miscellaneous test methods .30
12.1 Test 5X01: Liquid flux activity, wetting balance method .30
12.2 Test 5X02: Paste flux viscosity – T-Bar spindle method.34
12.3 Test 5X03: Spread test, liquid or extracted solder flux, solder paste and
extracted cored wires or preforms .34
12.4 Test 5X04: Solder paste viscosity – T-Bar spin spindle method (applicable to
300 Pa·s to 1,600 Pa·s) .37
12.5 Test 5X05: Solder paste viscosity – T-Bar spindle method (applicable to 300
Pa·s) .40
12.6 Test 5X06: Solder paste viscosity – Spiral pump method (applicable to
300 Pa·s to 1,600 Pa·s) .42
12.7 Test 5X07: Solder paste viscosity – Spiral pump method (applicable to 300
Pa·s) .44
12.8 Test 5X08: Solder paste − Slump test.47
12.9 Test 5X09: Solder paste − Solder ball test.51
12.10 Test 5X10: Solder paste − Tack test .53
12.11 Test 5X11: Solder paste − Wetting test.55

61189-5  IEC:2006(E) – 3 –
12.12 Test 5X12: Flux residues – Tackiness after drying.56
12.13 Test 5X13: Spitting of flux-cored wire solder.58
12.14 Test 5X14: Solder pool test .60

Bibliography.62

Figure 1 – Surface insulation resistance pattern .14
Figure 2 – Connector arrangement.17
Figure 3 – Specimen orientation in test chamber.18
Figure 4 – Test method 5E02.23
Figure 5 – Resistor verification coupon .24
Figure 6 – Resistor verification board with protective cover.25
Figure 7 – Test specimen location with respect to chamber air flow .25
Figure 8 – Wetting balance apparatus.32
Figure 9 – Wetting balance curve.33
Figure 10 – Slump test stencil thickness, 0,20 mm.48
Figure 11 – Slump test stencil thickness, 0,10 mm.49
Figure 12 – Solder ball test evaluation .52
Figure 13 – Solder wetting examples .56
Figure 14 – Test apparatus for spitting test .59

Table 1 – Student’s t distribution.10
Table 2 – Coupons for surface insulation resistance (SIR) testing.16
Table 3 – Qualification test report .21
Table 4 – Suggested test conditions .27
Table 5 – Typical spread areas defined in mm .35
Table 6 – Example of a test report on solder paste .39
Table 7 – Example of a test report on solder paste .41
Table 8 – Example of a test report on solder paste .43
Table 9 – Example of a test report on solder paste .46
Table 10 – Example of a test report – Stencil thickness, 0,2 mm.50
Table 11 – Example of a test report – Stencil thickness, 0,1 mm.50

– 4 – 61189-5  IEC:2006(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________
TEST METHODS FOR ELECTRICAL MATERIALS,
INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 5: Test methods for printed board assemblies

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61189-5 has been prepared by IEC technical committee 91:
Electronic assembly technology.
The text of this standard is based on the following documents:
FDIS Report on voting
91/608/FDIS 91/619/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.

61189-5  IEC:2006(E) – 5 –
This standard is to be used in conjunction with the following parts of IEC 61189:
Part 1: General test methods and methodology
Part 2: Test methods for materials for interconnection structures
Part 3: Test methods for interconnection structures (printed boards)
Part 4: Test methods for electronic components assembling characteristics
Part 6: Test methods for materials used in electronic assemblies
and also the following standard:
IEC 60068: Environmental testing
The list of all the parts of the IEC 61189 series, under the general title Test methods for
electrical materials, interconnection structures and assemblies, can be found on the IEC
website.
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC website under http://webstore.iec.ch in the
data related to the specific publication. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
– 6 – 61189-5  IEC:2006(E)
INTRODUCTION
IEC 61189 relates to test methods for printed boards and printed board assemblies, as well as
related materials or component robustness, irrespective of their method of manufacture.
The standard is divided into separate parts, covering information for the designer and the test
methodology engineer or technician. Each part has a specific focus; methods are grouped
according to their application and numbered sequentially as they are developed and released.
In some instances test methods developed by other TCs (for example, TC 104) have been
reproduced from existing IEC standards in order to provide the reader with a comprehensive
set of test methods. When this situation occurs, it will be noted on the specific test method; if
the test method is reproduced with minor revision, those paragraphs that are different are
identified.
This part of IEC 61189 contains test methods for evaluating printed board assemblies. The
methods are self-contained, with sufficient detail and description so as to achieve uniformity
and reproducibility in the procedures and test methodologies.
The tests shown in this standard are grouped according to the following principles:
P: preparation/conditioning methods
V: visual test methods
D: dimensional test methods
C: chemical test methods
M: mechanical test methods
E: electrical test methods
N: environmental test methods
X: miscellaneous test methods
To facilitate reference to the tests, to retain consistency of presentation, and to provide for
future expansion, each test is identified by a number (assigned sequentially) added to the
prefix (group code) letter showing the group to which the test method belongs.
The test method numbers have no significance with respect to an eventual test sequence; that
responsibility rests with the relevant specification that calls for the method being performed.
The relevant specification, in most instances, also describes pass/fail criterion.
The letter and number combinations are for reference purposes to be used by the relevant
specification. Thus "5C01" represents the first chemical test method described in IEC 61189-5.
In short, in this example, 5 is the number of the part of IEC 61189, C is the group of methods,
and 01 is the test number.
A list of all test methods included in this standard, as well as those under consideration, is
given in Annex B. This annex will be reissued whenever new tests are introduced.

61189-5  IEC:2006(E) – 7 –
TEST METHODS FOR ELECTRICAL MATERIALS,
INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 5: Test methods for printed board assemblies

1 Scope
This part of IEC 61189 is a catalogue of test methods representing methodologies and
procedures that can be applied to test printed board assemblies.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60068-1:1988, Environmental testing – Part 1: General and guidance
IEC 60068-2-20, Environmental testing – Part 2-20: Tests – Test T:Soldering
IEC 61189-1, Test methods for electrical materials, interconnection structures and assemblies
– Part 1: General test methods and methodology
IEC 61189-3, Test methods for electrical materials, interconnection structures and assemblies
– Part 3: Test methods for interconnection structures (printed boards)
IEC 61189-6, Test methods for electrical materials, interconnection structures and assemblies
– Part 6: Test methods for materials used in manufacturing electronic assemblies
IEC 61190-1-1, Attachment materials for electronic assembly – Part 1-1: Requirements for
soldering fluxes for high-quality interconnections in electronics assembly
IEC 61190-1-2:2002, Attachment materials for electronic assembly – Part 1-2: Requirements
for solder pastes for high-quality interconnections in electronics assembly
IEC 61190-1-3, Attachment materials for electronic assembly– Part 1-3: Requirements for
electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering
applications
IEC 61249-2-7, Materials for printed boards and other interconnecting structures – Part 2-7:
Reinforced base materials clad and unclad – Epoxide woven E-glass laminated sheet of
defined flammability (vertical burning test), copper-clad
IEC 62137:2004, Environmental and endurance testing - Test methods for surface-mount
boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
ISO 5725-2, Accuracy (trueness and precision) of measurement methods and results – Part 2:
Basic method for the determination of repeatability and reproducibility of a standard
measurement method
ISO 9001, Quality management systems – Requirements

– 8 – 61189-5  IEC:2006(E)
ISO 9455-1, Soft soldering fluxes – Test methods – Part 1: Determination of non-volatile
matter, gravimetric method
ISO 9455-2, Soft soldering fluxes –Test methods – Part 2: Determination of non-volatile
matter, ebulliometric method
3 Accuracy, precision and resolution
Errors and uncertainties are inherent in all measurement processes. The information given
below enables valid estimates of the amount of error and uncertainty to be taken into account.
Test data serve a number of purposes which include
– monitoring of a process;
– enhancing of confidence in quality conformance;
– arbitration between customer and supplier.
In any of these circumstances, it is essential that confidence can be placed upon the test data
in terms of
– accuracy: calibration of the test instruments and/or system;
– precision: the repeatability and uncertainty of the measurement;
– resolution: the suitability of the test instrument and/or system.
3.1 Accuracy
The regime by which routine calibration of the test equipment is undertaken shall be clearly
stated in the quality documentation of the supplier or agency conducting the test and shall
meet the requirements of ISO 9001.
The calibration shall be conducted by an agency having accreditation to a national or
international measurement standard institute. There should be an uninterrupted chain of
calibration to a national or international standard.
Where calibration to a national or international standard is not possible, round-robin
techniques may be used and documented to enhance confidence in measurement accuracy.
The calibration interval shall normally be one year. Equipment consistently found to be
outside acceptable limits of accuracy shall be subject to shortened calibration intervals.
Equipment consistently found to be well within acceptable limits may be subject to relaxed
calibration intervals.
A record of the calibration and maintenance history shall be maintained for each instrument.
These records should state the uncertainty of the calibration technique (in ± % deviation) in
order that uncertainties of measurement can be aggregated and determined.
A procedure shall be implemented to resolve any situation where an instrument is found to be
outside calibration limits.
3.2 Precision
The uncertainty budget of any measurement technique is made up of both systematic and
random uncertainties. All estimates shall be based upon a single confidence level, the
minimum being 95 %.
Systematic uncertainties are usually the predominant contributor and will include all
uncertainties not subject to random fluctuation. These include

61189-5  IEC:2006(E) – 9 –
– calibration uncertainties;
– errors due to the use of an instrument under conditions which differ from those under
which it was calibrated;
– errors in the graduation of a scale of an analogue meter (scale shape error).
Random uncertainties result from numerous sources but can be deduced from repeated
measurement of a standard item. Therefore, it is not necessary to isolate the individual
contributions. These may include
– random fluctuations such as those due to the variation of an influence parameter.
Typically, changes in atmospheric conditions reduce the repeatability of a measurement;
– uncertainty in discrimination, such as setting a pointer to a fiducial mark or interpolating
between graduations on an analogue scale.
Aggregation of uncertainties: Geometric addition (root-sum-square) of uncertainties may be
used in most cases. Interpolation error is normally added separately and may be accepted as
being 20 % of the difference between the finest graduations of the scale of the instrument.
2 2
U = ± (U + U ) + U
t s r i
where
U is the total uncertainty;
t
U is the systematic uncertainty;
s
U is the random uncertainty;
r
U is the interpolation error.
i
Determination of random uncertainties: Random uncertainty can be determined by repeated
measurement of a parameter and subsequent statistical manipulation of the measured data.
The technique assumes that the data exhibits a normal (Gaussian) distribution.
t × σ
U =
r
n
where
U is the random uncertainty;
r
n is the sample size;
t is the percentage point of the t distribution as shown in Table 1;
σ is the standard deviation (σ ).
n–1
3.3 Resolution
It is paramount that the test equipment used is capable of sufficient resolution. Measurement
systems used should be capable of resolving 10 % (or better) of the test limit tolerance.
It is accepted that some technologies will place a physical limitation upon resolution (for
example, optical resolution).
3.4 Report
In addition to requirements detailed in the test specification, the report shall detail
a) the test method used;
b) the identity of the sample(s);
c) the test instrumentation;
d) the specified limit(s);
– 10 – 61189-5  IEC:2006(E)
e) an estimate of measurement uncertainty and resultant working limit(s) for the test;
f) the detailed test results;
g) the test date and operators’ signature.
3.5 Student’s t distribution
Table 1 gives values of the factor t for 95 % and 99 % confidence levels, as a function of the
number of measurements.
Table 1 – Student’s t distribution
Sample t value t value Sample t value t value
size 95 % 99 % size 95 % 99 %
2 12,7 63,7  14 2,16 3,01
3 4,3 9,92  15 2,14 2,98
4 3,18 5,84  16 2,13 2,95
5 2,78 4,6  17 2,12 2,92
6 2,57 4,03  18 2,11 2,9
7 2,45 3,71  19 2,1 2,88
8 2,36 3,5  20 2,09 2,86
9 2,31 3,36  21 2,08 2,83
10 2,26 3,25  22 2,075 2,82
11 2,23 3,17  23 2,07 2,81
12 2,2 3,11  24 2,065 2,8
13 2,18 3,05  25 2,06 2,79

3.6 Suggested uncertainty limits
The following target uncertainties are suggested:
a) Voltage < 1 kV: ± 1,5 %
b) Voltage > 1 kV: ± 2,5 %
c) Current < 20 A: ± 1,5 %
d) Current > 20 A: ± 2,5 %
Resistance
e) Earth and continuity: ± 10 %
f) Insulation: ± 10 %
g) Frequency: ± 0,2 %
Time
h) Interval < 60 s: ± 1 s
i) Interval > 60 s: ± 2 %
j) Mass < 10 g: ± 0,5 %
k) Mass 10 g – 100 g: ± 1 %
l) Mass > 100 g: ± 2 %
m) Force: ± 2 %
n) Dimension < 25 mm: ± 0,5 %
o) Dimension > 25 mm: ± 0,1 mm
p) Temperature < 100 °C: ± 1,5 %

61189-5  IEC:2006(E) – 11 –
q) Temperature > 100 °C: ± 3,5 %
r) Humidity (30 – 75) % RH: ± 5 % RH
Plating thicknesses
s) Backscatter method: ± 10 %
t) Microsection: ± 2 microns
u) Ionic contamination: ± 10 %
4 Catalogue of approved test methods
This standard provides specific test methods in complete detail to permit implementation with
minimal cross-referencing to other specific procedures. The use of generic conditioning
exposures is accomplished in the methods by reference, for example, those described in
IEC 61189-1 and IEC 60068-1, and when applicable, is a mandatory part of the test method
standard.
Each method has its own title, number and revision status to accommodate updating and
improving the methods as industry requirements change or demand new methodology. The
methods are organized in test method groups and individual tests.
5 P: Preparation/conditioning test methods
5.1 Test 5P01: Test-board design guideline
For the details of this test method, see IEC 62137:2004, Clause A.4, the requirements of
which become mandatory when referenced as test 5P01.
5.2 Test 5P02: Standard mounting process for CSP/BGA packages
For the details concerning this test method, see Annex B of IEC 62137:2004, the
requirements of which become mandatory when referenced as test 5P02.
6 V: Visual test methods
(Under consideration)
7 D: Dimensional test methods
(Under consideration)
8 C: Chemical test methods
8.1 Test 5C01: Corrosion, flux
8.1.1 Object
This test method is designed to determine the corrosive properties of flux residues under
extreme environmental conditions. A pellet of solder is melted in contact with the test flux on a
sheet metal test piece. The solder is then exposed to prescribed conditions of humidity and
the resulting corrosion, if any, is assessed visually.

– 12 – 61189-5  IEC:2006(E)
8.1.2 Test specimen
At least 0,035 g of flux solids, 1 g solder paste, 1 g wire, or 1 g preform with an equivalent
amount of solids. Flux solids are defined as the residue from the solid content, flux test
described in IEC 61189-6, test method 6C03. All solvent shall have been evaporated from the
specimen in a chemical fume hood.
8.1.3 Apparatus and reagents
a) Solder pot.
b) Humidity chamber capable of achieving (40 ± 1) °C and (93 ± 2) % relative humidity.
c) Air-circulating drying oven.
d) Microscope having 20× min.
e) Chemicals: All chemicals shall be reagent grade (highly pure, without contamination) and
water shall be distilled or deionized: ammonium persulphate; sulphuric acid, % volume
(v/v); degreasing agent; acetone, or petroleum ether.
f) Analytical balance capable of weighing 0,001 g
g) Copper sheet of a thickness of (0,50 ± 0,05) mm and a purity of 99 %.
8.1.4 Procedures
8.1.4.1 Chemicals
a) Ammonium persulphate (25 % m/v in 0,5 % v/v sulphuric acid). Dissolve 250 g of
ammonium persulphate in water and add cautiously 5 ml of sulphuric acid (density
1,84 g/cm ). Mix, cool, dilute to 1 litre and mix. This solution should be freshly prepared.
b) Sulphuric acid (5 % v/v). To 400 ml of water cautiously add 50 ml of sulphuric acid
(density 1,84 g/cm ). Mix, cool, dilute to 1 litre and mix.
8.1.4.2 Test panel preparation
a) Cut a piece of 50 mm × 50 mm from the copper sheet for each test.
b) Form a circular depression in the centre of each test panel 3 mm deep by forcing a steel
ball of a diameter of 20 mm into a hole of a diameter of 25 mm to form a cup.
c) Bend one corner of each test panel up to facilitate subsequent handling with tongs.
8.1.4.3 Preconditioning test panels
Immediately before performing the test, precondition as follows using clean tongs for
handling.
a) Degrease with a suitable neutral organic solvent such as acetone or petroleum ether.
b) Immerse in 5 % sulphuric acid (by volume) at (65 ± 5) °C for 1 min to remove the tarnish
film.
c) Immerse in a solution of 25 % m/v ammonium persulphate (0,5 % v/v sulphuric acid) at
(23 ± 2) °C for 1 min to etch the surface uniformly.
d) Wash in running tap water for a maximum of 5 s.
e) Immerse in 5 % sulfuric acid (by volume) at (23 ± 2) °C for 1 min.
f) Wash for 5 s in running tap water, then rinse thoroughly in deionized water.
g) Rinse with acetone.
h) Allow to dry in clean air.
i) Use the test piece as soon as possible or store up to 1 h in a closed container.

61189-5  IEC:2006(E) – 13 –
8.1.4.4 Preparation of test solder
a) Weigh (1,00 ± 0,05) g specimen of solder for each test and place in the centre of
depression of each test panel.
b) Degrease solder specimen with a suitable neutral organic solvent such as acetone or
petroleum ether.
c) Solder may be in the form of pellets or by forming tight spirals of solder wire.
8.1.4.5 Test
a) Heat solder pot so that solder bath stabilizes at (235 ± 5) °C in the case of Sn63Pb37 and
Sn60Pb40 alloy. For solder alloys except Sn63Pb37 and Sn60Pb40, the temperature of
the solder pot may be approximately 40 °C higher than the liquid temperature of each
alloy.
b) Liquid flux, place 0,035 g of flux solids into the depression in the test panel. Add solder
sample.
c) Solder paste, cored wire or cored preform, place 1 g of solder paste, flux-cored wire or
cored-preform into the depression in the test panel.
d) Using tongs, lower each test panel onto the surface of the molten solder.
e) Allow the test panel to remain in contact until the solder specimen in the depression of the
test panel melts. Maintain this condition for (5 ± 1) s.
f) Carefully examine the test panel at 20× magnification for subsequent comparison after
humidity exposure. Record observations, especially any discoloration.
g) Preheat test panel to (40 ± 1) °C for (30 ± 2) min.
h) Preset humidity chamber to (40 ± 1) °C and (93 ± 2) % relative humidity.
i) Suspend each test panel vertically (and separately) in the humidity chamber.
j) Expose panels to the above environment for 72 h (3 days). M (moderately active) and H
(highly active) flux may be tested in the cleaned, as well as uncleaned, condition.
8.1.4.6 Evaluation
Carefully examine test panels prior to placing them in the environmental chamber. Note any
discoloration.
After the appropriate exposure period, remove test panels from humidity chamber, examine at
20× magnification and compare with observations noted prior to exposure.
Corrosion is described as follows.
– Excrescences at the interfaces of the flux residue and copper boundary or the residues or
discontinuities in the residues.
– Discrete white or coloured spots in the flux residues.
An initial change of colour which may develop when the test panel is heated during soldering
is disregarded, but subsequent development of green-blue discoloration with observation of
pitting of the copper panel is regarded as corrosion.
8.1.5 Additional information
8.1.5.1 Definition of corrosion
For the purposes of this test method, the following is the definition of corrosion: “chemical
reaction between the copper, the solder, and the constituents of the flux residues, which
occurs after soldering and during exposure to the above environmental conditions."
Colour photos before and after the test are valuable tools in identifying corrosion.

– 14 – 61189-5  IEC:2006(E)
8.1.5.2 Safety
Observe all appropriate precautions on material safety data sheets (MSDS) for chemicals
involved in this test method.
9 M: Mechanical test methods
9.1 Test 5M01: Peel test method for test-board land
For details concerning this test method, see Clause A.3 of IEC 62137, the requirements of
which become mandatory when referenced as test 5M01.
10 E: Electrical test methods
10.1 Test 5E01: Changes of the surface insulation resistance caused by fluxes
10.1.1 Object
This test method is to characterize fluxes by determining the degradation of the electrical
insulation resistance of rigid printed board specimens after exposure to the specified flux.
This test is carried out at high humidity and heat conditions.
10.1.2 Method A
10.1.2.1 Test specimens
a) Comb patterns: The test pattern shown in Figure 1 shall be used for the test specimen.
The individual comb has a line width of 0,4 mm and 0,2 mm spacing. The specimen is
approximately 100 mm × 95 mm in size. Its conductive pattern shall be unpreserved bare
copper.
IEC  1612/06
Figure 1 – Surface insulation resistance pattern
b) Laminate: The laminate material for this test shall be an epoxide woven E-glass laminated
sheet in accordance with IEC 61249-2-7.

61189-5  IEC:2006(E) – 15 –
10.1.2.2 Apparatus
a) A humidity chamber capable of being adjusted to a temperature of (90 ± 2) °C and a
relative humidity of (95 ± 3) %. The chamber should be constructed with stainless steel
inner surfaces and be well insulated. The temperature and humidity measurement should
be taken using sensors such as dry and wet bulb thermometers or solid-state sensors. The
temperature and humidity levels of the test chamber shall be recorded throughout the test,
preferably with independent control sensors.
b) The measurement system shall consist of a measuring device capable of measuring
6 12
surface insulation resistance (SIR) in the range of at least (10 to 10 )Ω. A test and bias
voltage supply capable of providing a variable voltage from (5 to 100)V d.c. (±2 %) with a
1 MΩ load.
Specimen selection system capable of individually selecting each test pattern under
measurement. The system shall incorporate a 1 MΩ current limiting resistor in each
current pathway.
The tolerance of the total measurement system shall be ±5 % up to 10 Ω, ±10 %
10 11 11
between (10 to 10 )Ω, and ±20 % above 10 Ω.
The measurement system shall be verified by substituting a resistor verification coupon in
place of the test specimens while in the chamber at ambient conditions.
c) Three 2 000 ml beakers.
d) Exhaust ventilation hood.
e) Metal tongs.
f) Soft bristle brush.
g) Deionized or distilled water (2 MΩcm, minimum resistivity recommended).
h) Drying oven capable of maintaining at least 50 °C.
10.1.2.3 Test conditions
a) Fluxes that contain more than 1 % by weight organic acid activators, such as adipic acid,
that volatilize significantly at 85 °C, and less than 5 % by weight rosin or modified-rosin
resin should be tested at 40 °C/93 % RH. Fluxes that contain more than 0,1 % by weight
ionic halide should be tested at 85 °C/85 % RH.
b) The test duration shall be not less than 72 h.
c) Test voltages: The testing should be conducted using a voltage gradient of 25 V/mm (=
5 V using the coupon proposed)
10.1.2.4 Specimen preparation
There shall be three test specimens for each liquid flux to be tested in the cleaned state,
having cleaned the boards in accordance with item d) (see Table 2, Sample group A). When
testing liquid fluxes which are intended to remain in the uncleaned state, six test specimens
are required.
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