SIST EN IEC 60068-2-83:2025

SLOVENSKI STANDARD
01-oktober-2025
Nadomešča:
SIST EN 60068-2-83:2012
Okoljsko preskušanje - 2-83. del: Preskusi - Preskus tf: Preskus spajkanja
elektronskih komponent za površinsko montažo (SMD) z metodo za ugotavljanje
omočljivosti z uporabo spajkalne paste
Environmental testing - Part 2-83: Tests - Test tf: Solderability testing of electronic
components for surface mounting devices (SMD) by the wetting balance method using
solder paste
Umweltprüfungen – Teil 2-83: Prüfungen - Prüfung tf: Prüfung der Lötbarkeit von
elektronischen Bauelementen für oberflächenmontierbaren Bauelementen (SMD) nach
dem Benetzungsbilanzverfahren unter Verwendung von Lotpaste
Essais d'environnement - Partie 2-83: Essais - Essai tf: Essai de brasabilité des
composants électroniques pour les composants pour montage en surface (CMS) par la
méthode de la balance de mouillage utilisant de la pâte à braser
Ta slovenski standard je istoveten z: EN IEC 60068-2-83:2025
ICS:
19.040 Preskušanje v zvezi z Environmental testing
okoljem
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 60068-2-83

NORME EUROPÉENNE
EUROPÄISCHE NORM July 2025
ICS 19.040; 31.190 Supersedes EN 60068-2-83:2011
English Version
Environmental testing - Part 2-83: Tests - Test Tf: Solderability
testing of electronic components for surface mounting devices
(SMD) by the wetting balance method using solder paste
(IEC 60068-2-83:2025)
Essais d'environnement - Partie 2-83: Essais - Essai Tf: Umweltprüfungen - Teil 2-83: Prüfungen - Prüfung tf:
Essai de brasabilité des composants électroniques pour les Prüfung der Lötbarkeit von elektronischen Bauelementen
composants montés en surface (CMS) par la méthode de la für oberflächenmontierbaren Bauelementen (SMD) nach
balance de mouillage utilisant de la pâte à braser dem Benetzungsbilanzverfahren unter Verwendung von
(IEC 60068-2-83:2025) Lotpaste
(IEC 60068-2-83:2025)
This European Standard was approved by CENELEC on 2025-07-01. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2025 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 60068-2-83:2025 E

European foreword
The text of document 91/2026/FDIS, future edition 2 of IEC 60068-2-83, prepared by TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 60068-2-83:2025.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2026-07-31
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2028-07-31
document have to be withdrawn
This document supersedes EN 60068-2-83:2011 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 60068-2-83:2025 was approved by CENELEC as a
European Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standard indicated:
IEC 60068-2-69 NOTE Approved as EN 60068-2-69
IEC 60068-3-13:2016 NOTE Approved as EN 60068-3-13:2016 (not modified)
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1  Where an International Publication has been modified by common modifications, indicated by (mod),
the relevant EN/HD applies.
NOTE 2  Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cencenelec.eu.
Publication Year Title EN/HD Year
IEC 60068-1 - Environmental testing - Part 1: General EN 60068-1 -
and guidance
IEC 60068-2-20 2021 Environmental testing - Part 2-20: Tests - EN IEC 60068-2-20 2021
Test Ta and Tb: Test methods for
solderability and resistance to soldering
heat of devices with leads
IEC 60068-2-58 - Environmental testing - Part 2-58: Tests - EN 60068-2-58 -
Test Td: Test methods for solderability,
resistance to dissolution of metallization
and to soldering heat of surface mounting
devices (SMD)
IEC 60194-2 - Printed boards design, manufacture and - -
assembly - Vocabulary - Part 2: Common
usage in electronic technologies as well as
printed board and electronic assembly
technologies
IEC 61190-1-3 - Attachment materials for electronic EN IEC 61190-1-3 -
assembly - Part 1-3: Requirements for
electronic grade solder alloys and fluxed
and non-fluxed solid solder for electronic
soldering applications
IEC 60068-2-83 ®
Edition 2.0 2025-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Environmental testing –
Part 2-83: Tests – Test Tf: Solderability testing of electronic components for
surface mounting devices (SMD) by the wetting balance method using solder
paste
Essais d’environnement –
Partie 2-83: Essais – Essai Tf: Essai de brasabilité des composants
électroniques pour les composants montés en surface (CMS) par la méthode de
la balance de mouillage utilisant de la pâte à braser
ICS 19.040, 31.190 ISBN 978-2-8327-0449-3

IEC 60068-2-83:2025-05(en-fr)
– 2 – IEC 60068-2-83:2025 © IEC 2025
CONTENTS
FOREWORD . 5
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 7
4 Test . 8
4.1 General description . 8
4.2 Test methods . 8
5 Preconditioning . 9
6 Preparation . 9
6.1 Solder paste . 9
6.2 Test jig plate . 9
6.3 Specimen holder . 9
7 Quick heating method . 9
7.1 Equipment . 9
7.2 Test jig plate . 10
7.3 Preparation . 11
7.4 Test condition . 12
7.4.1 Test temperature . 12
7.4.2 Feed of solder paste and immersion condition . 12
7.4.3 Immersion and withdrawal conditions for test specimen . 13
7.5 Test procedure . 13
7.6 Presentation of the result . 14
7.7 Characterisation parameter examples . 15
8 Synchronous method . 15
8.1 Equipment . 15
8.2 Test jig plate . 16
8.3 Synchronous fixture . 16
8.4 Preparation . 17
8.5 Test condition . 17
8.5.1 Test temperature . 17
8.5.2 Feed of solder paste and immersion condition . 17
8.5.3 Immersion and withdrawal conditions for the test specimen . 17
8.6 Test procedure . 17
8.7 Presentation of the results . 17
8.8 Characterisation parameter examples . 18
9 Temperature profile method . 19
9.1 Equipment . 19
9.2 Test jig plate . 19
9.3 Preparation . 20
9.4 Test condition . 20
9.4.1 Test temperature . 20
9.4.2 Feed of solder paste and immersion condition . 20
9.4.3 Immersion and withdrawal conditions for test specimen . 21
9.5 Test procedure . 21
9.6 Presentation of the result . 22
9.7 Characterization parameter examples . 23

IEC 60068-2-83:2025 © IEC 2025 – 3 –
Annex A (normative) Equipment for the quick heating and synchronous method . 24
A.1 General . 24
A.2 Test equipment . 24
A.2.1 General . 24
A.2.2 Measuring system . 24
A.2.3 Heating system . 24
A.2.4 Lift system . 25
Annex B (informative) Reading of the output data and correction of the result in the
quick heating test . 26
B.1 General .
...