SIST EN 61189-2-721:2015
(Main)Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of Relative Permittivity and Loss Tangent for Copper Clad Laminate at Microwave Frequency Using Split Post Dielectric Resonator
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of Relative Permittivity and Loss Tangent for Copper Clad Laminate at Microwave Frequency Using Split Post Dielectric Resonator
IEC 61189-2-721:2015 outlines a way to determine the relative permittivity and loss tangent (also called dielectric constant and dissipation factor) of copper clad laminates at microwave frequencies (from 1,1 GHz to 20 GHz) using a split post dielectric resonator (SPDR). IEC 61189-2-721:2015 is applicable to copper clad laminates and dielectric base materials.
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 2-721: Prüfverfahren für Materialien für Verbindungsstrukturen - Messung der relativen Permittivität und des Verlustfaktors von kupferkaschiertem Laminat im Mikrowellen-Frequenzbereich unter Verwendung eines Split Post dielektrischen Resonators
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-721: Méthodes d'essai des matériaux pour structures d'interconnexion - Mesure de la permittivité relative et de la tangente de perte pour les stratifiés recouverts de cuivre en hyperfréquences à l'aide d'un résonateur diélectrique en anneaux fendus
L'IEC 61189-2-721:2015 présente un moyen de déterminer la permittivité relative et la tangente de perte, également appelées constante diélectrique et facteur de dissipation des stratifiés recouverts de cuivre en hyperfréquences (de 1,1 GHz à 20 GHz) à l'aide d'un résonateur diélectrique en anneaux fendus (SPDR). l'IEC 61189-2-721:2015 s'applique aux stratifiés recouverts de cuivre et aux matériaux de base diélectriques.
Preskusne metode za električne materiale, tiskane plošče ter druge povezovalne strukture in sestave - 2-721. del: Preskusne metode za materiale, namenjene uporabi v povezovalnih strukturah - Merjenje relativne permitivnosti in izgubnega tangensa pobakrenega laminata pri mikrovalovni frekvenci z uporabo resonatorja z ločenima dielektrikoma
Ta del standarda IEC 61189 opisuje način za določanje relativne permitivnosti (εr) in izgubnega tangensa (tanδ) (imenovana tudi dielektrična konstanta (Dk) in faktor disipacije (Df)) pobakrenega laminata pri mikrovalovni frekvenci (od 1,1 GHz do 20 GHz) z uporabo resonatorja z ločenima dielektrikoma. Ta del standarda IEC 61189 se uporablja za pobakrene laminate in dieletrične materiale.
General Information
- Status
- Published
- Publication Date
- 13-Aug-2015
- Technical Committee
- ITIV - Electronics assembly technology and Environmental standardization
- Current Stage
- 6060 - National Implementation/Publication (Adopted Project)
- Start Date
- 27-Jul-2015
- Due Date
- 01-Oct-2015
- Completion Date
- 14-Aug-2015
Overview
EN 61189-2-721:2015 (IEC 61189-2-721:2015) defines a test method to determine relative permittivity (dielectric constant) and loss tangent (dissipation factor) of copper-clad laminates and dielectric base materials at microwave frequencies using a Split Post Dielectric Resonator (SPDR). The procedure covers measurements in the microwave band (about 1.1 GHz to 20 GHz) and includes guidance for specimen preparation, test fixtures, instrumentation and result reporting. The standard is published by CLC/CENELEC as a European adoption of the IEC document.
Key topics and requirements
- Measurement principle: uses an SPDR fixture to detect changes in resonance frequency and Q‑factor when a specimen is introduced; these shifts are used to calculate relative permittivity (εr) and loss tangent (tan δ).
- Scope of materials: applicable to copper‑clad laminates and dielectric base materials intended for interconnection structures and PCBs.
- Frequency range: measurement guidance across microwave frequencies (≈1.1–20 GHz).
- Specimen requirements: defined specimen size, thickness limits and marking/handling instructions (see standard’s tables for dimensions).
- Equipment and setup: specifies use of a vector network analyzer (VNA), SPDR test fixture, micrometer for thickness, verify unit, circulating oven and temperature chamber for variable‑temperature tests.
- Test procedure: preconditioning, room temperature measurements, variable temperature testing, VNA parameters, resonance and Q‑factor acquisition, calculation methods and comparison steps.
- Reporting and quality: required result content for room and variable temperature tests, accuracy, maintenance and items to monitor.
- Informative annexes: example fixture designs, sample results, electric field distribution, and auxiliary calculation data (K(ε,h), p factors).
Practical applications
- Characterizing PCB dielectric properties for RF and microwave circuit design, material selection and electromagnetic simulation models.
- Quality control and supplier qualification for copper‑clad laminates used in high‑frequency applications (telecom, radar, automotive radar/ADAS, 5G, aerospace).
- Lab validation of dielectric behavior vs. frequency and temperature for reliability and thermal coefficient assessment.
- Providing dielectric data for CAD/EM simulation and impedance control in high‑speed / RF PCB manufacturing.
Who uses this standard
- RF/microwave engineers and PCB designers
- Material engineers and laminate suppliers
- Test laboratories and compliance labs
- PCB manufacturers and assemblers focused on high‑frequency products
Related standards
- IEC/EN 61189 series (test methods for electrical materials and printed boards) - this document is Part 2-721.
- CENELEC adoption: EN 61189-2-721:2015 (identical to IEC 61189-2-721:2015)
Keywords: SPDR, split post dielectric resonator, relative permittivity, loss tangent, dielectric constant, dissipation factor, copper clad laminate, microwave frequency, EN 61189-2-721, IEC 61189, VNA.
Frequently Asked Questions
SIST EN 61189-2-721:2015 is a standard published by the Slovenian Institute for Standardization (SIST). Its full title is "Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of Relative Permittivity and Loss Tangent for Copper Clad Laminate at Microwave Frequency Using Split Post Dielectric Resonator". This standard covers: IEC 61189-2-721:2015 outlines a way to determine the relative permittivity and loss tangent (also called dielectric constant and dissipation factor) of copper clad laminates at microwave frequencies (from 1,1 GHz to 20 GHz) using a split post dielectric resonator (SPDR). IEC 61189-2-721:2015 is applicable to copper clad laminates and dielectric base materials.
IEC 61189-2-721:2015 outlines a way to determine the relative permittivity and loss tangent (also called dielectric constant and dissipation factor) of copper clad laminates at microwave frequencies (from 1,1 GHz to 20 GHz) using a split post dielectric resonator (SPDR). IEC 61189-2-721:2015 is applicable to copper clad laminates and dielectric base materials.
SIST EN 61189-2-721:2015 is classified under the following ICS (International Classification for Standards) categories: 31.180 - Printed circuits and boards; 31.190 - Electronic component assemblies. The ICS classification helps identify the subject area and facilitates finding related standards.
SIST EN 61189-2-721:2015 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.
Standards Content (Sample)
SLOVENSKI STANDARD
01-september-2015
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Test methods for electrical materials, printed boards and other interconnection structures
and assemblies - Part 2-721: Test methods for materials for interconnection structures -
Measurement of Relative Permittivity and Loss Tangent for Copper Clad Laminate at
Microwave Frequency Using Split Post Dielectric Resonator
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen
und Baugruppen - Teil 2-721: Prüfverfahren für Materialien für Verbindungsstrukturen -
Messung der relativen Permittivität und des Verlustfaktors von kupferkaschiertem
Laminat im Mikrowellen-Frequenzbereich unter Verwendung eines Split Post
dielektrischen Resonators
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles - Partie 2-721: Méthodes d'essai des matériaux
pour structures d'interconnexion - Mesure de la permittivité relative et de la tangente de
perte pour les stratifiés recouverts de cuivre en hyperfréquences à l'aide d'un résonateur
diélectrique en anneaux fendus
Ta slovenski standard je istoveten z: EN 61189-2-721:2015
ICS:
31.180 7LVNDQDYH]MD7,9LQWLVNDQH Printed circuits and boards
SORãþH
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN 61189-2-721
NORME EUROPÉENNE
EUROPÄISCHE NORM
June 2015
ICS 31.180
English Version
Test methods for electrical materials, printed boards and other
interconnection structures and assemblies - Part 2-721: Test
methods for materials for interconnection structures -
Measurement of relative permittivity and loss tangent for copper
clad laminate at microwave frequency using split post dielectric
resonator
(IEC 61189-2-721:2015)
Méthodes d'essai pour les matériaux électriques, les cartes Prüfverfahren für Elektromaterialien, Leiterplatten und
imprimées et autres structures d'interconnexion et andere Verbindungsstrukturen und Baugruppen - Teil 2-
ensembles - Partie 2-721: Méthodes d'essai des matériaux 721: Prüfverfahren für Verbindungsstrukturen (Leiterplatten)
pour structures d'interconnexion - Mesure de la permittivité - Messung der relativen Permittivität und des Verlustfaktors
relative et de la tangente de perte pour les stratifiés von kupferkaschiertem Laminat im Mikrowellen-
recouverts de cuivre en hyperfréquences à l'aide d'un Frequenzbereich unter Verwendung eines Split Post
résonateur diélectrique en anneaux fendus dielektrischen Resonators
(IEC 61189-2-721:2015) (IEC 61189-2-721:2015)
This European Standard was approved by CENELEC on 2015-06-03. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2015 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN 61189-2-721:2015 E
European foreword
The text of document 91/1246/FDIS, future edition 1 of IEC 61189-2-721, prepared by
IEC/TC 91 "Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and
approved by CENELEC as EN 61189-2-721:2015.
The following dates are fixed:
(dop) 2016-03-03
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2018-06-03
standards conflicting with the
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.
Endorsement notice
The text of the International Standard IEC 61189-2-721:2015 was approved by CENELEC as a
European Standard without any modification.
IEC 61189-2-721 ®
Edition 1.0 2015-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Test methods for electrical materials, printed boards and other interconnection
structures and assemblies –
Part 2-721: Test methods for materials for interconnection structures –
Measurement of relative permittivity and loss tangent for copper clad laminate
at microwave frequency using split post dielectric resonator
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles –
Partie 2-721: Méthodes d'essai des matériaux pour structures d'interconnexion –
Mesure de la permittivité relative et de la tangente de perte pour les stratifiés
recouverts de cuivre en hyperfréquences à l'aide d'un résonateur diélectrique
en anneaux fendus
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180 ISBN 978-2-8322-2648-3
– 2 – IEC 61189-2-721:2015 © IEC 2015
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Test specimens . 6
2.1 Specimen size . 6
2.2 Preparation . 7
2.3 Marking . 7
2.4 Thickness . 7
3 Equipment/apparatus . 7
3.1 General . 7
3.2 Vector network analyzer (VNA) . 8
3.3 SPDR test fixture . 8
3.3.1 General . 8
3.3.2 Parameters . 8
3.3.3 Frequency . 8
3.4 Verify unit . 9
3.5 Micrometer . 9
3.6 Circulating oven . 9
3.7 Test chamber . 9
4 Procedure . 9
4.1 Preconditioning . 9
4.2 Testing of relative permittivity and loss tangent at room temperature . 9
4.2.1 Test conditions . 9
4.2.2 Preparation . 9
4.2.3 Fixture . 10
4.2.4 Connection to VNA . 10
4.2.5 VNA parameter . 10
4.2.6 Frequency and Q-factor without specimen . 10
4.2.7 Micrometer . 10
4.2.8 Setting the specimen . 10
4.2.9 Frequency and Q-factor with specimen . 10
4.2.10 Comparison . 10
4.2.11 Calculation . 11
4.2.12 Change the specimen . 12
4.2.13 Change in test frequency . 12
4.3 Testing of relative permittivity and loss tangent at variable temperatures . 12
4.3.1 Test conditions . 12
4.3.2 Preparation . 12
4.3.3 Fixture . 12
4.3.4 Connection to VNA . 12
4.3.5 VNA parameter . 12
4.3.6 Temperature in the chamber . 12
4.3.7 Frequency and Q-factor without specimen . 12
4.3.8 Micrometer . 12
4.3.9 Setting of the specimen . 13
4.3.10 Frequency and Q-factor with specimen . 13
4.3.11 Calculation . 13
IEC 61189-2-721:2015 © IEC 2015 – 3 –
4.3.12 Options . 13
4.3.13 Thermal coefficient . 13
4.3.14 Change in test frequency . 14
5 Report . 14
5.1 At room temperature . 14
5.2 At variable temperature . 14
6 Additional information . 14
6.1 Accuracy . 14
6.2 Maintenance . 14
6.3 Matters to be attended . 15
6.4 Additional information concerning fixtures and results . 15
6.5 Additional information on K (ε ,h) and p . 15
ε r es
Annex A (informative) Example of test fixture and test result . 16
A.1 Example of test fixture . 16
A.2 Example of test result . 16
Annex B (informative) Additional information on K (ε ,h) and p . 19
ε r es
Bibliography . 22
Figure 1 – Scheme of SPDR test fixture . 6
Figure 2 – Component diagram of test system . 8
Figure 3 – Scheme of the change of resonance frequency with or without the
specimen . 10
Figure A.1 – Test fixture . 16
Figure A.2 – Relative permittivity versus frequency (laminate of Dk 3,8 and thickness
0,51 mm) . 17
Figure A.3 – Loss tangent versus frequency (laminate of Dk 3,8 and thickness
0,51 mm) . 17
Figure A.4 – Curve of relative permittivity and loss tangent at variable temperatures
(laminate of Dk 3,8 and thickness 0,51 mm) . 18
Figure B.1 – K (ε ,h) versus relative permittivity at different sample thicknesses . 19
ε r
Figure B.2 – Distribution of the electric field of the split dielectric resonator (side view
of the dielectric resonators) . 20
Figure B.3 – Distribution of the electric field of the split dielectric resonator (top view
between the dielectric resonators) . 21
Figure B.4 – p versus relative permittivity at different sample thicknesses . 21
es
Table 1 – Specimen dimensions . 7
Table 2 – SPDR test fixture’s parameter . 9
Table B.1 – Results of measurements of different materials using a 10 GHz SPDR. 20
– 4 – IEC 61189-2-721:2015 © IEC 2015
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –
Part 2-721: Test methods for materials for interconnection structures –
Measurement of relative permittivity and loss tangent for copper clad
laminate at microwave frequency using split post dielectric resonator
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61189-2-721 has been prepared by IEC technical committee 91:
Electronics assembly technology.
The text of this standard is based on the following documents:
FDIS Report on voting
91/1246/FDIS 91/1258/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
IEC 61189-2-721:2015 © IEC 2015 – 5 –
A list of all parts in the IEC 61189 series, published under the general title Test methods for
electrical materials, printed boards and other interconnection structures and assemblies, can
be found on the IEC website.
Future standards in this series will carry the new general title as cited above. Titles of existing
standards in this series will be updated at the time of the next edition.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC website under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
– 6 – IEC 61189-2-721:2015 © IEC 2015
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –
Part 2-721: Test methods for materials for interconnection structures –
Measurement of relative permittivity and loss tangent for copper clad
laminate at microwave frequency using split post dielect
...




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