EN 60749-15:2010/AC:2011
(Corrigendum)Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
note: "corrigendum issued February 2011 (on the three language versions)
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 15: Beständigkeit gegen Löttemperatur bei Bauelementen zur Durchsteckmontage
Dispositifs à semiconducteurs - Méthodes d’essai mécaniques et climatiques - Partie 15: Résistance à la température de soudage pour dispositifs par trous traversants
Polprevodniški elementi - Metode za mehansko in klimatsko preskušanje - 15. del: Odpornost elementov, montiranih v skoznjih luknjah, proti spajkalni temperaturi
Ta del IEC 60749 opisuje preskus, ki se uporablja za ugotavljanje ali inkapsulirane naprave v trdnem stanju, ki se uporabljajo za montiranje v skoznjih luknjah, kljubujejo učinkom temperature, kateri so podvržene med spajkanjem njihovih vodnikov z uporabo valovitega spajkanja ali spajkanjem železa. Da bi se vzpostavil standardni preskusni postopek za najbolj ponovljive metode, se uporablja metoda spajkanja z namakanjem zaradi pogojev te metode, ki jih je lažje nadzorovati. Ta postopek določa, ali naprave lahko prenesejo spajkalno temperaturo pri postopkih montaže plošče tiskanega vezja, ne da bi se poslabšale njihove električne značilnosti ali notranji spoji. Ta preskus je porušitveni in se lahko uporabi za kvalifikacijo, sprejemljivost lotov in kontrolo proizvoda. Ta preskus ja na splošno v skladu z IEC 60068-2-20, vendar zaradi posebnih zahtev polprevodnikov veljajo točke tega standarda.
General Information
- Status
- Withdrawn
- Publication Date
- 03-Feb-2011
- Technical Committee
- CLC/SR 47 - Semiconductor devices
- Drafting Committee
- IEC/TC 47 - IEC_TC_47
- Current Stage
- 9960 - Withdrawal effective - Withdrawal
- Start Date
- 18-Aug-2023
- Completion Date
- 18-Aug-2023
Relations
- Effective Date
- 24-Jan-2023
- Effective Date
- 29-Jan-2023
Frequently Asked Questions
EN 60749-15:2010/AC:2011 is a corrigendum published by CLC. Its full title is "Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices". This standard covers: note: "corrigendum issued February 2011 (on the three language versions)
note: "corrigendum issued February 2011 (on the three language versions)
EN 60749-15:2010/AC:2011 is classified under the following ICS (International Classification for Standards) categories: 31.080.01 - Semiconductor devices in general. The ICS classification helps identify the subject area and facilitates finding related standards.
EN 60749-15:2010/AC:2011 has the following relationships with other standards: It is inter standard links to EN IEC 60749-15:2020, EN 60749-15:2010. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.
EN 60749-15:2010/AC:2011 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.
Standards Content (Sample)
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Polprevodniški elementi - Metode za mehansko in klimatsko preskušanje - 15. del: Odpornost elementov, montiranih v skoznjih luknjah, proti spajkalni temperaturiHalbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 15: Beständigkeit gegen Löttemperatur bei Bauelementen zur DurchsteckmontageDispositifs à semiconducteurs - Méthodes d’essai mécaniques et climatiques - Partie 15: Résistance à la température de soudage pour dispositifs
par trous traversantsSemiconductor devic
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