EN 60749-27:2006/A1:2012

Overview

EN 60749-27:2006/A1:2012 is a European standard developed by CLC and harmonized with the International Electrotechnical Commission (IEC) standard IEC 60749-27:2006/A1:2012. This standard specifies mechanical and climatic test methods focused on electrostatic discharge (ESD) sensitivity testing for semiconductor devices, using the Machine Model (MM). It is part 27 of the EN 60749 series that addresses various test procedures for semiconductor reliability.

This amendment A1 updates the original 2006 edition and includes key clarifications on waveform specifications essential for ESD sensitivity evaluation. The standard is applicable to a wide range of semiconductor devices and ensures device robustness and conformity to ESD immunity requirements.

Key Topics

• Electrostatic Discharge (ESD) Sensitivity Testing
  The document defines test methods to evaluate how semiconductor devices respond to electrostatic discharges simulating the machine model (MM). This is crucial for assessing the ability of devices to withstand ESD events during manufacturing and operation.

• Machine Model (MM)
  MM represents the ESD event involving discharge from a machine or equipment onto the device. This model specifically simulates ESD current pulses with defined magnitudes and waveforms caused by typical manufacturing environments.

• Waveform Specifications
  The amendment introduces detailed parameters for the ESD current waveform including peak current values through a 500 ohm resistor, pulse duration, and inductance control. It specifically addresses “ringing” effects caused by circuit inductance and stipulates a recommended inductance value of 750 nH to ensure reproducibility and accuracy of test pulses.

• New Test Parameters and Definitions
  Addition of new terms such as ringing, defined as noise components from large inductance in the discharge circuit, improving clarity for test implementations. The updated Table 1 provides improved waveform parameter values for peak currents at various test levels.

• Compliance and Implementation
  The standard includes dates by which CENELEC member countries are required to adopt the amendment as a national standard, aligning European semiconductor testing practices.

Applications

• Semiconductor Manufacturing
  Ensures devices can survive typical static discharge events encountered during production and handling, minimizing device failures.

• Quality Assurance and Device Screening
  Semiconductor companies use EN 60749-27 tests in QA processes to screen for ESD-sensitive components and maintain product reliability.

• Component Design and Validation
  Device designers refer to this standard to validate and improve ESD robustness of semiconductor components before mass production.

• Supply Chain Compliance
  Meeting EN 60749-27 ensures seamless acceptance of semiconductor devices in European and other international markets that require machine model ESD testing certification.

• Reliability Engineering
  Employing these standardized mechanical and climatic test methods aids in predicting device lifespan and identifying weaknesses related to ESD effects.

Related Standards

• IEC 60749 Series
  The EN 60749 harmonizes with the IEC 60749 series addressing mechanical and climatic test methods for semiconductor devices, with part 27 specifically focused on ESD testing.

• IEC 61000-4-2
  Another important standard on ESD immunity testing but covers the Human Body Model (HBM), complementing the Machine Model addressed by EN 60749-27.

• ISO and MIL Standards for Component Testing
  Related component-level environmental and stress test standards may be used alongside EN 60749-27 to provide comprehensive device qualification.

• CENELEC and National Implementation Standards
  EN 60749-27 is adopted by European electrotechnical committees and integrated into national standards without modifications as per internal regulations.

In summary, EN 60749-27:2006/A1:2012 offers a critical framework for the assessment of ESD sensitivity of semiconductor devices via Machine Model testing, supporting manufacturers and designers in enhancing ESD resilience and ensuring compliance with European and international requirements. The updated waveform specifications and definitions enhance test reliability and consistency, making it an essential standard in semiconductor quality assurance and reliability engineering.