EN 62132-1:2006

SLOVENSKI SIST EN 62132-1:2006

STANDARD
julij 2006
Integrirana vezja – Meritve elektromagnetne odpornosti od 150 kHz do 1 GHz –
1. del: Splošni pogoji in definicije (IEC 62132-1:2006)
Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz -
Part 1: General conditions and definitions (IEC 62132-1:2006)
ICS 31.200; 33.100.20 Referenčna številka
©  Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno

EUROPEAN STANDARD
EN 62132-1
NORME EUROPÉENNE
February 2006
EUROPÄISCHE NORM
ICS 31.200
English version
Integrated circuits -
Measurement of electromagnetic immunity, 150 kHz to 1 GHz
Part 1: General conditions and definitions
(IEC 62132-1:2006)
Circuits intégrés -  Integrierte Schaltungen -
Mesure de l'immunité électromagnétique, Messung der elektromagnetischen
150 kHz à 1 GHz Störfestigkeit im Frequenzbereich
Partie 1: Conditions générales von 150 kHz bis 1 GHz
et définitions Teil 1: Allgemeine Bedingungen
(CEI 62132-1:2006) und Begriffe
(IEC 62132-1:2006)
This European Standard was approved by CENELEC on 2006-02-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania,
Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden, Switzerland
and United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2006 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62132-1:2006 E
Foreword
The text of document 47A/734/FDIS, future edition 1 of IEC 62132-1, prepared by SC 47A, Integrated
circuits, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was
approved by CENELEC as EN 62132-1 on 2006-02-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2006-11-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2009-02-01
This European Standard makes reference to International Standards. Where the International Standard
referred to has been endorsed as a European Standard or a home-grown European Standard exists, this
European Standard shall be applied instead. Pertinent information can be found on the CENELEC web
site.
__________
Endorsement notice
The text of the International Standard IEC 62132-1:2006 was approved by CENELEC as a European
Standard without any modification.
__________
NORME CEI
INTERNATIONALE
IEC
62132-1
INTERNATIONAL
Première édition
STANDARD
First edition
2006-01
Circuits intégrés –
Mesure de l'immunité électromagnétique,
150 kHz à 1 GHz –
Partie 1:
Conditions générales et définitions

Integrated circuits –
Measurement of electromagnetic
immunity, 150 kHz to 1 GHz –
Part 1:
General conditions and definitions

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62132-1  IEC:2006 – 3 –
CONTENTS
FOREWORD.7

1 Scope and object.11
2 Normative references .11
3 Terms and definitions .13
4 Test conditions .19
4.1 General .19
4.2 Ambient conditions .19
4.3 Test generator.21
4.4 Frequency range .21
5 Test equipment.21
5.1 General .21
5.2 Shielding .21
5.3 Test generator and power amplifier .21
5.4 Other components .21
6 Test set-up .23
6.1 General .23
6.2 Test circuit board .23
6.3 Pin selection scheme .23
6.4 IC pin loading/termination.23
6.5 Power supply requirements .25
6.6 IC specific considerations.25
6.7 IC stability over time.27
7 Test procedure .27
7.1 Monitoring check .27
7.2 Human exposure .27
7.3 System verification .27
7.4 Specific procedures.29
8 Test report.31
8.1 General .31
8.2 Immunity limits or levels .33
8.3 Performance classes .33
8.4 Interpretation of results .33

Annex A (informative) Test method comparison table.35
Annex B (informative) General test board specification .37

Bibliography.45

62132-1  IEC:2006 – 5 –
Figure 1 – RF signal when RF peak power level is maintained .31
Figure B.1 – Example of an immunity test board .43

Table 1 – IC pin loading recommendations .25
Table 2 – Frequency step size versus frequency range.29
Table A.1 – Test method comparison table .35
Table B.1 – Position of vias over the board.37

62132-1  IEC:2006 – 7 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC IMMUNITY,
150 kHz TO 1 GHz –
Part 1: General conditions and definitions

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62132-1 has been prepared by subcommittee 47A: Integrated
circuits, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47A/734/FDIS 47A/742/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

62132-1  IEC:2006 – 9 –
IEC 62132 consists of the following parts, under the general title Integrated circuits –
Measurement of electromagnetic immunity, 150 kHz to 1 GHz:
Part 1: General conditions and definitions
Part 2: (G-) TEM cell method
Part 3: Bulk current injection (BCI) method
Part 4: Direct RF power injection method
Part 5: Workbench Faraday cage method
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
———————
Under consideration.
62132-1  IEC:2006 – 11 –
INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC IMMUNITY,
150 kHz TO 1 GHz –
Part 1: General conditions and definitions

1 Scope and object
This part of IEC 62132 provides general information and definitions on measurement of
conducted and radiated electromagnetic immunity of integrated circuits (ICs) to conducted
and radiated disturbances. It also provides a description of measurement conditions, test
equipment and set-up, as well as the test procedures and content of the test reports. A test
method comparison table is included in Annex A to assist in selecting the appropriate
measurement method(s).
This standard describes general conditions required to obtain a quantitative measure of
immunity of ICs in a uniform testing environment. Critical parameters that are expected to
influence the test results are described. Deviations from this standard are noted explicitly in
the individual test report. The measurement results can be used for comparison or other
purposes.
Measurement of the injected voltages and currents, together with the responses of the ICs
tested at controlled conditions, yields information about the potential immunity of the IC to
conducted and radiated RF disturbances in a given application.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 61000-4-3, Electromagnetic compatibility (EMC) – Part 4-3: Testing and measurement
techniques – Radiated, radio-frequency, electromagnetic field immunity test
IEC 61000-4-6, Electromagnetic compatibility (EMC) – Part 4-6: Testing and measurement
techniques – Immunity to conducted disturbances, induced by radio-frequency fields

62132-1  IEC:2006 – 13 –
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
3.1
amplitude modulation
AM
process by which a continuous high-frequency wave (carrier) is caused to vary in amplitude
by the action of another wave containing information
[IEEE 100-1984]
3.2
artificial network
AN
agreed reference load impedance (simulated), presented to the DUT by networks (e.g.
extended power or communication lines) across which the RF disturbance voltage is
measured and which isolates the apparatus from the power supply or loads in that frequency
range
[IEV 161-04-05, modified]
3.3
associated equipment
transducers (e.g. probes, networks and antennas) connected to a measuring receiver or test
generator; also transducers which are used in the signal or disturbance transmission path
between a DUT and measuring equipment or a (test-) signal generator
3.4
auxiliary equipment
AE
equipment not under test that is nevertheless indispensable for setting up all the functions
and assessing the correct performance (operation) of the equipment under test (DUT) during
its exposure to the disturbance
3.5
biasing tee
coupling device that allows the signal superposition of an RF signal to a DC signal to an
output port without affecting the RF path
3.6
common mode voltage
asymmetrical disturbance voltage
mean of the phasor voltages appearing between each conductor and a specified reference,
usually earth or frame
[IEV 161-04-09]
3.7
common mode current
vector sum of the currents flowing through two or more conductors at a specified cross-
section of a “mathematical” plane intersected by these conductors

62132-1  IEC:2006 – 15 –
3.8
continuous wave
CW
waves, the successive oscillations of which are identical under steady state conditions
[IEEE 100-1984]
3.9
coupling network
electrical circuit for transferring energy from one circuit to another with well-defined
impedances
3.10
decoupling network
electrical circuit for preventing test signals applied to the DUT from affecting other devices,
equipment or systems that are not under test
3.11
device under test
DUT
device, equipment or system being evaluated
NOTE As used in this standard, DUT refers to the testing of a semiconductor device.
3.12
die shrink
amount of shrink of the mask used to produce the IC expressed as a percentage or
dimensions relative to the original artwork layout (drawn size)
3.13
differential mode current
in a two-conductor cable, or for two particular conductors in a multi-conductor cable, half the
magnitude of the difference of the phasors representing the currents in each conductor
3.14
differential mode voltage
voltage between any two of a specified set of active conductors
[IEV 161-04-08]
3.15
directional coupler
transmission coupling device for separately (ideally) sampling (through known coupling loss
for measuring purposes) either the forward (incident) or backward (reflected) waves in a
transmission line
(IEEE 100-1984)
3.16
electrically small PCB
printed circuit board, whose dimension is smaller than λ/2, e.g. 100 mm to 150 mm at 1 GHz

62132-1  IEC:2006 – 17 –
3.17
electromagnetic compatibility
EMC
ability of an equipment or system to function satisfactorily in its electromagnetic environment
without introducing intolerable electromagnetic disturbance to anything in that environment
[IEV 161-01-07]
3.18
forward power
amount of power that is sent from the RF source towards the (assumed matched) RF load
without considering the RF power that is being reflected backwards by the RF load
3.19
ground (reference) plane
flat conductive surface whose potential is used as a common reference
[IEV 161-04-36]
3.20
immunity (to a disturbance)
ability of a device, equipment or system to perform without degradation in the presence of an
electromagnetic disturbance
3.21
injection network
coupling network to inject RF signals onto a cable
3.22
peak power
maximum power level occurring on an AM RF signal measured over the time interval of the
(lowest LF) signal used for the amplitude modulation
NOTE In case of two-tone RF signals (to represent AM), the beat frequency should be considered for the time
interval.
3.23
reference port
specific port of the test set-up to which the disturbance signal is applied
3.24
reflected power
amount of power that is reflected backward by the RF load due to an impedance mismatch of
the RF load to the characteristic impedance of the transmission-line
3.25
RF ambient
electromagnetic environment
totality of electromagnetic phenomena existing at a given location
[IEV 161-01-01]
3.26
RF power meter
measurement system to quantify the RF signal power as function of time

62132-1  IEC:2006 – 19 –
3.27
shielded enclosure
mesh or sheet metallic housing designed expressly for the purpose of separating electro-
magnetically the internal and external environment
[IEV 161-04-37]
3.28
significant IC changes
all changes that may influence the electromagnetic immunity of an IC
EXAMPLES: Design changes, new manufacturer or process line, die-shrink, new package type, significant process
change or any other change to the die to improve or fix the die performance.
3.29
test generator
generator (RF-generator, modulation source, attenuators, broadband power amplifiers and
filters) capable of generating the required test signal
4 Test conditions
4.1 General
These default test conditions are intended to assure a consistent test environment. If the
users of this procedure agree to other values, they shall be documented in the test report.
4.2 Ambient conditions
The following ambient conditions shall be met.
4.2.1 Ambient temperature
The ambient temperature during the test shall be 23 °C ± 5 °C for repeatability.
NOTE The RF immunity of ICs may vary with temperature.
4.2.2 RF ambient
The RF ambient noise level shall be at least 6 dB (typical) below the lowest immunity level(s)
to be tested against. This shall be verified before measurements of the IC are made. The DUT
shall be installed in the test set-up, as used for testing. The DUT shall not be activated (e.g.
power supply voltage disconnected). A description of the RF ambient shall be a part of the
test report.
4.2.3 RF-immunity of the test set-up
When carrying out the test, all equipment used in the test set-up, excluding the DUT, has to
be sufficiently immune itself such that it will not influence the test results.
4.2.4 Other ambient conditions
All other ambient conditions that may affect the result shall be stated in the individual test
report.
NOTE Even the intensity of light can be a parameter which influences the test results when the device under test
(DUT) is installed in an open ceramic IC package.

62132-1  IEC:2006 – 21 –
4.3 Test generator
Depending on the hardware of the set-up and the desired
...