EN 60749-9:2017
(Main)Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
IEC 60749-9:2017(E) is to determine whether the marks on solid state semiconductor devices will remain legible when subjected to the application and removal of labels or the use of solvents and cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board manufacturing process. This test is applicable for all package types. It is suitable for use in qualification and/or process monitor testing. The test is considered non-destructive. Electrical or mechanical rejects can be used for the purpose of this test. This edition includes the following significant technical changes with respect to the previous edition: a) revision to Clause 4 Equipment by a complete rewriting of Clause 3 Terms and definitions; b) additional variant – ‘adhesive tape pull test’.
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 9: Beständigkeit der Kennzeichnung
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 9: Permanence du marquage
L’IEC 60749-9:2017 a pour objet de vérifier que les marquages sur les dispositifs à semiconducteurs restent lisibles lorsqu’ils sont soumis au collage et au décollage d’étiquettes, ou à l’utilisation de solvants et de solutions de nettoyage habituellement destinés à éliminer les résidus de flux de soudage, lors du procédé d’assemblage des cartes à circuits imprimés. Cet essai s’applique à tous les types de boîtiers. Il convient pour les essais de qualification et/ou de contrôle de procédé. Cet essai est considéré comme non destructif. Les rejets issus d’essais électriques ou mécaniques peuvent être utilisés pour les besoins de cet essai.AnchorAnchor Cette édition inclut les modifications techniques majeures suivantes par rapport à l’édition précédente: a) révision de l’Article 4, Equipement, découlant d’une refonte complète de l’Article 3, Termes et définitions; b) ajout d’un essai en variante, « essai à la bande adhésive ».
Polprevodniški elementi - Mehanske in klimatske preskusne metode - 9. del: Trajnost označevanja (IEC 60749-9:2017)
Namen tega dela standarda IEC 60749 je ugotavljanje, ali označbe na polprevodniških elementih v trdnem stanju ostanejo čitljive, kadar so izpostavljene pritrjevanju in odstranjevanju nalepk ali uporabi topil in čistilnih raztopin, ki se običajno uporabljajo pri odstranjevanju talila za spajkanje s tiskanega vezja pri postopku izdelave.
Ta preskus se uporablja za vse vrste embalaže. Primeren je za uporabo pri preskušanju v povezavi s kvalifikacijo in/ali nadzorom procesov. Preskus se obravnava kot neporušitveni. Za namene tega preskusa se lahko uporabljajo električne ali mehanske zavrnitve.
OPOMBA 1: Ta postopek se ne uporablja za lasersko vžgano embalažo.
Številna razpoložljiva topila, ki se bi lahko uporabila, so nezadostno aktivna, prestroga ali pri neposrednem stiku ali vdihavanju hlapov celo človeku nevarna.
OPOMBA 2: Sestava topil, ki se uporabljajo v tem dokumentu, se obravnava kot običajna in predstavlja želeno strogost v povezavi z običajnimi prevlekami in označbami.
General Information
- Status
- Published
- Publication Date
- 15-Jun-2017
- Withdrawal Date
- 06-Apr-2020
- Technical Committee
- CLC/TC 47X - Semiconductor devices and trusted chips
- Drafting Committee
- IEC/TC 47 - IEC_TC_47
- Current Stage
- 6060 - Document made available - Publishing
- Start Date
- 16-Jun-2017
- Completion Date
- 16-Jun-2017
Relations
- Effective Date
- 10-May-2016
Overview
EN 60749-9:2017 is a European standard, harmonized with IEC 60749-9:2017, focusing on the permanence of marking on semiconductor devices. It outlines mechanical and climatic test methods designed to verify whether markings on solid-state semiconductors remain legible after exposure to cleaning solvents, solder flux residue removal processes, and label application/removal. The standard applies to all semiconductor package types and is widely used for qualification and process monitoring.
Key updates in this 2017 edition include revised terminology and the introduction of the adhesive tape pull test as a variant for assessing mark durability.
Key Topics
Scope and Purpose
The standard determines the durability and legibility of markings under typical manufacturing conditions including the application/removal of labels and exposure to common solvents used during solder flux removal.Test Methods
The standard specifies two primary non-destructive tests:- Solvent resistance test using three representative solvents simulating cleaning agents.
- Adhesive tape pull test, assessing mark permanence during label removal.
Solvent Types
- Solvent A: Isopropyl alcohol mixed with petroleum spirits or kerosene-ethylbenzene blend (20–30°C).
- Solvent B: Semi-aqueous defluxer containing terpene or hydrocarbons, at controlled temperature.
- Solvent C: Mixture of deionized water, propylene glycol monomethyl ether, and monoethanolamine (63–70°C).
Test Procedure
The solvent test involves repeated immersion and brushing of devices with solvents, followed by drying and inspection. The tape test requires the careful application and removal of adhesive tape on the marking with evaluation of any damage or removal of the marking.Failure Criteria
Marks are considered failed if partially or fully missing, blurred, smeared, or dislodged to the extent that they are unidentifiable from 15 cm under normal lighting without magnification.Safety Measures
Guidelines emphasize the use of well-ventilated areas, protective gloves, eye protection, and solvent handling precautions due to the chemical nature of the solvents.
Applications
EN 60749-9:2017 is crucial for ensuring the quality and traceability of semiconductor devices throughout electronics manufacturing and assembly processes. Maintaining legible markings allows for accurate product identification, quality control, and compliance with regulatory and traceability requirements.
- Semiconductor Manufacturing: Qualification of packaging and marking durability under cleaning and labeling conditions.
- Process Monitoring: Routine testing during printed circuit board assembly to assess impact on device markings.
- Quality Assurance: Verifying that marking permanence meets industry standards to prevent misidentification.
- Non-Destructive Testing: Applicable to both electrical and mechanical rejects, enabling cost-effective process validation.
Related Standards
- IEC 60749 Series: Other parts cover various mechanical and climatic test methods for semiconductor devices, providing a comprehensive framework for reliability testing.
- EN 61340-2-3:2016: Specifies requirements related to electrostatic discharge protection, relevant for adhesive tape electrical properties during the tape pull test.
- ISO/IEC Directives Part 2: Provides guidelines for drafting and revising international standards like EN 60749-9.
Keywords: EN 60749-9, IEC 60749-9, semiconductor marking permanence, mechanical test methods, climatic test methods, solvent resistance test, adhesive tape pull test, semiconductor device testing, solder flux cleaning, label removal testing, non-destructive testing, marking durability, semiconductor packaging quality, process monitor testing, semiconductor traceability.
Frequently Asked Questions
EN 60749-9:2017 is a standard published by CLC. Its full title is "Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking". This standard covers: IEC 60749-9:2017(E) is to determine whether the marks on solid state semiconductor devices will remain legible when subjected to the application and removal of labels or the use of solvents and cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board manufacturing process. This test is applicable for all package types. It is suitable for use in qualification and/or process monitor testing. The test is considered non-destructive. Electrical or mechanical rejects can be used for the purpose of this test. This edition includes the following significant technical changes with respect to the previous edition: a) revision to Clause 4 Equipment by a complete rewriting of Clause 3 Terms and definitions; b) additional variant – ‘adhesive tape pull test’.
IEC 60749-9:2017(E) is to determine whether the marks on solid state semiconductor devices will remain legible when subjected to the application and removal of labels or the use of solvents and cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board manufacturing process. This test is applicable for all package types. It is suitable for use in qualification and/or process monitor testing. The test is considered non-destructive. Electrical or mechanical rejects can be used for the purpose of this test. This edition includes the following significant technical changes with respect to the previous edition: a) revision to Clause 4 Equipment by a complete rewriting of Clause 3 Terms and definitions; b) additional variant – ‘adhesive tape pull test’.
EN 60749-9:2017 is classified under the following ICS (International Classification for Standards) categories: 31.080.01 - Semiconductor devices in general. The ICS classification helps identify the subject area and facilitates finding related standards.
EN 60749-9:2017 has the following relationships with other standards: It is inter standard links to EN 60749-9:2002. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.
EN 60749-9:2017 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.
Standards Content (Sample)
SLOVENSKI STANDARD
01-september-2017
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Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of
marking (IEC 60749-9:2017)
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 9:
Beständigkeit der Kennzeichnung (IEC 60749-9:2017)
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 9:
Permanence du marquage (IEC 60749-9:2017)
Ta slovenski standard je istoveten z: EN 60749-9:2017
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN 60749-9
NORME EUROPÉENNE
EUROPÄISCHE NORM
June 2017
ICS 31.080.01 Supersedes EN 60749-9:2002
English Version
Semiconductor devices - Mechanical and climatic test methods -
Part 9: Permanence of marking
(IEC 60749-9:2017)
Dispositifs à semiconducteurs - Méthodes d'essais Halbleiterbauelemente - Mechanische und klimatische
mécaniques et climatiques - Partie 9: Permanence du Prüfverfahren - Teil 9: Beständigkeit der Kennzeichnung
marquage (IEC 60749-9:2017)
(IEC 60749-9:2017)
This European Standard was approved by CENELEC on 2017-04-07. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,
Switzerland, Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2017 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN 60749-9:2017 E
European foreword
The text of document 47/2348/FDIS, future edition 2 of IEC 60749-9, prepared by IEC/TC 47
"Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN 60749-9:2017.
The following dates are fixed:
• latest date by which the document has to be implemented at (dop) 2018-01-07
national level by publication of an identical national
standard or by endorsement
• latest date by which the national standards conflicting with (dow) 2020-04-07
the document have to be withdrawn
This document supersedes EN 60749-9:2002.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 60749-9:2017 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following note has to be added for the standard indicated :
IEC 61340-2-3:2016 NOTE Harmonized as EN 61340-2-3:2016 (not modified).
IEC 60749-9 ®
Edition 2.0 2017-03
INTERNATIONAL
STANDARD
Semiconductor devices – Mechanical and climatic test methods –
Part 9: Permanence of marking
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.080.01 ISBN 978-2-8322-4004-5
– 2 – IEC 60749-9:2017 © IEC 2017
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Equipment . 6
5 Safety precautions . 7
6 Procedure . 7
6.1 Solvents test . 7
6.2 Tape pull test . 7
7 Failure criteria . 8
8 Summary . 8
Bibliography . 9
IEC 60749-9:2017 © IEC 2017 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –
Part 9: Permanence of marking
FOREWORD
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patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60749-9 has been prepared by IEC technical committee 47:
Semiconductor devices.
This second edition cancels and replaces the first edition published in 2002. This edition
constitutes a
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