EN 61192-1:2003

SLOVENSKI SIST EN 61192-1:2003

STANDARD
november 2003
Workmanship requirements for soldered electronic assemblies - Part 1: General
ICS 31.190 Referenčna številka
©  Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno

EUROPEAN STANDARD EN 61192-1
NORME EUROPÉENNE
EUROPÄISCHE NORM March 2003
ICS 31.190
English version
Workmanship requirements for soldered electronic assemblies
Part 1: General
(IEC 61192-1:2003)
Exigences relatives à la qualité Anforderungen an die Ausführungsqualität
d'exécution des assemblages von Lötbaugruppen
électroniques brasés Teil 1: Allgemeines
Partie 1: Généralités (IEC 61192-1:2003)
(CEI 61192-1:2003)
This European Standard was approved by CENELEC on 2003-03-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,
Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta,
Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2003 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 61192-1:2003 E
Foreword
The text of document 91/345/FDIS, future edition 1 of IEC 61192-1, prepared by IEC TC 91, Electronics
assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 61192-1 on 2003-03-01.

The following dates were fixed:

– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2003-12-01

– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2006-03-01

This standard should be used in conjunction with the following parts of EN 61192, under the general title
Workmanship requirements for soldered electronic assemblies:

Part 2: Surface-mount assemblies
Part 3: Through-hole mount assemblies
Part 4: Terminal assemblies
Annexes designated "normative" are part of the body of the standard.
In this standard, annex ZA is normative.
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 61192-1:2003 was approved by CENELEC as a European
Standard without any modification.

In the official version, for Bibliography, the following notes have to be added for the standards indicated:

IEC 60068-2-58 NOTE Harmonized as EN 60068-2-58:1999 (not modified).
IEC 60326 NOTE Related but not equivalent to EN 123600:1996, EN 123700:1996 and EN 123800:1996.
IEC 61188-5-1 NOTE Harmonized as EN 61188-5-1:2002 (not modified).
IEC 61189-2 NOTE Harmonized as EN 61189-2:1997 (not modified).
IEC 61190-1-2 NOTE Harmonized as EN 61190-1-2:2002 (not modified).
IEC 61190-1-3 NOTE Harmonized as EN 61190-1-3:2002 (not modified).
ISO 9001 NOTE Harmonized as EN ISO 9001:2000 (not modified).
ISO 9453 NOTE Harmonized as EN ISO 29453:1993 (not modified).
__________
- 3 - EN 61192-1:2003
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
This European Standard incorporates by dated or undated reference, provisions from other
publications. These normative references are cited at the appropriate places in the text and the
publications are listed hereafter. For dated references, subsequent amendments to or revisions of any
of these publications apply to this European Standard only when incorporated in it by amendment or
revision. For undated references the latest edition of the publication referred to applies (including
amendments).
NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
1)
IEC 60194 - Printed board design, manufacture and - -
assembly - Terms and definitions

- 1)
2)
IEC 61188-1-1 Printed boards and printed board EN 61188-1-1 1997
assemblies - Design and use
Part 1-1: Generic requirements -
Flatness considerations for electronic
assemblies
3)
IEC 61188-5-2 - Part 5-2: Attachment (land/joint) - -
considerations - Discrete components

- 1) 2)
IEC 61189-3 Test methods for electrical materials, EN 61189-3 1997
interconnection structures and
assemblies
Part 3: Test methods for
interconnection structures (printed
boards)
- 1) 2)
IEC 61190-1-1 Attachment materials for electronic EN 61190-1-1 2002
assembly
Part 1-1: Requirements for soldering
fluxes for high-quality interconnections
in electronics assembly
- 1) 2)
IEC 61191-1 Printed board assemblies EN 61191-1 1998
Part 1: Generic specification -
Requirements for soldered electrical
and electronic assemblies using surface
mount and related assembly
technologies
1)
Undated reference.
2)
Valid edition at date of issue.
3)
To be published.
Publication Year Title EN/HD Year
- 1) 2)
IEC 61191-2 Part 2: Sectional specification - EN 61191-2 1998
Requirements for surface mount
soldered assemblies
- 1) 2)
IEC 61191-3 Part 3: Sectional specification - EN 61191-3 1998
Requirements for through-hole mount
soldered assemblies
- 1) 2)
IEC 61191-4 Part 4: Sectional specification - EN 61191-4 1998
Requirements for terminal soldered
assemblies
3)
IEC 61192-2 - Workmanship requirements for soldered - -
electronic assemblies
Part 2: Surface-mount assemblies

- 1) 2)
IEC 61192-3 Part 3: Through-hole mount assemblies EN 61192-3 2003

- 1) 2)
IEC 61192-4 Part 4: Terminal assemblies EN 61192-4 2003

IEC 61249-8 Series Materials for interconnection structures EN 61249-8 Series
Part 8: Sectional specification set for
non-conductive films and coatings

- 1) 2)
IEC 61340-5-1 Electrostatics EN 61340-5-1 2001
Part 5-1: Protection of electronic + corr. April 2001

devices from electrostatic phenomena -
General requirements
- 1) 2)
IEC 61340-5-2 Part 5-2: Protection of electronic EN 61340-5-2 2001
devices from electrostatic phenomena - + corr. August 2001
User guide
- 1) 2)
IEC 61760-2 Surface mounting technology EN 61760-2 1998
Part 2: Transportation and storage
conditions of surface mounting devices
(SMD) - Application guide
- 1) 2)
ISO 9002 Quality systems - Model for quality EN ISO 9002 1994
assurance in production, installation
and servicing
NORME
CEI
INTERNATIONALE IEC
61192-1
INTERNATIONAL
Première édition
STANDARD
First edition
2003-02
Exigences relatives à la qualité d'exécution
des assemblages électroniques brasés –
Partie 1:
Généralités
Workmanship requirements
for soldered electronic assemblies –
Part 1:
General
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électronique ou mécanique, y compris la photocopie et les photocopying and microfilm, without permission in writing from
microfilms, sans l'accord écrit de l'éditeur. the publisher.
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Pour prix, voir catalogue en vigueur
For price, see current catalogue

61192-1 © IEC:2003 – 3 –
CONTENTS
FOREWORD . 9
INTRODUCTION .13
1 Scope and object .15
2 Normative references.15
3 Terms and definitions.17
4 General requirements.17
4.1 Order of precedence .17
4.2 Process control.23
4.3 Facilities .25
4.4 Process identification .27
5 Pre-process activities.31
5.1 Design checks .31
5.2 Specification and procurement of components.35
5.3 Specification and procurement of printed boards .35
5.4 Specification and procurement of process materials .37
5.5 Inspection plan, inspection facilities and handling.39
5.6 Storage and kitting of components, boards and materials .41
5.7 Handling during assembly, packaging and shipping .43
5.8 Electrical testing .43
6 Component preparation.45
6.1 Lead and termination solderability .45
6.2 Lead forming.49
6.3 Lead flattening .51
6.4 Lead cropping .51
6.5 Lead coplanarity.53
6.6 Thermal shock during re-tinning .53
6.7 Moisture and gas traps.53
7 Mounting structure and printed board preparation .53
7.1 Surface preparation .53
7.2 Temporary masking requirements .53
7.3 Gold on printed board surface-mount lands .55
7.4 Printed board condition .55
8 Surface-mount solder paste deposition.55
8.1 Description of process .55
8.2 Storage and handling of solder paste .57
8.3 Screen (off-contact) printing.59
8.4 Stencil (in-contact) printing.61
8.5 Syringe dispensing.63
8.6 Transfer deposition of solder preforms .63
9 Non-conductive adhesive deposition and curing.65
9.1 Stencil printing .65
9.2 Syringe dispensing.65
9.3 Pin transfer printing.67
9.4 Adhesive curing .67

61192-1 © IEC:2003 – 5 –
10 Surface-mounted component placement.69
10.1 Leadless discrete components with metallized terminations.69
10.2 Leadless circular cylinder components, for example, metal electrode leadless
faces (MELFs) .69
10.3 Leaded discrete small component packages.69
10.4 Leaded integrated circuit packages .73
10.5 Leaded 'fine-pitch' integrated circuit packages.75
10.6 Modified leaded through-hole packages.75
10.7 Leadless chip carrier packages .75
10.8 Placement equipment.75
11 Through-hole component insertion .79
11.1 General .79
11.2 Axial lead components (two leads) .81
11.3 Radial lead components (two leads) .81
11.4 Radial lead components (three or more leads).83
11.5 Multilead integrated circuit packages.83
11.6 Pin grid array (PGA) components .85
11.7 Surface-mount packages modified for insertion .85
11.8 Large components .85
11.9 Insertion methods and equipment.85
11.10 Cutting and clinching leads .87
12 Placement of terminals and press-fit pins .89
12.1 Attachment of terminals to printed boards .89
12.2 Soldering wires and component leads to terminals.89
13 Reflow soldering .91
13.1 Infrared reflow soldering in pass-through equipment.93
13.2 Convection reflow soldering in pass-through equipment.95
13.3 Mixed infrared and convection reflow soldering in pass-through equipment.95
13.4 Vapour phase reflow soldering .95
13.5 Laser scan reflow soldering.97
13.6 Thermode (hot bar) reflow soldering.99
13.7 Hot gas multijet reflow soldering.99
13.8 Focused infrared multi-point reflow soldering.101
14 Immersion soldering.101
14.1 General requirements .103
14.2 Wave soldering.105
14.3 Drag soldering .107
14.4 Hot dip soldering.107
15 Individual point soldering.107
15.1 Manual soldering with an iron .107
15.2 Hot gas pencil reflow soldering.111
16 Cleanliness/cleaning .113
16.1 Use of 'no clean' fluxes .115
16.2 Cleaning materials .115
16.3 Cleaning processes.115
16.4 Cleanliness assessment.117

61192-1 © IEC:2003 – 7 –
17 Electrical test .119
17.1 In-circuit test.121
17.2 Functional test .121
17.3 Test probes and probe lands.121
18 Rework and repair.121
18.1 General .121
18.2 Unmarked components .123
18.3 Pre-heating printed boards and sensitive components .123
18.4 Re-use of removed components.123
18.5 Selection of rework tools and equipment .125
18.6 Surface-mounted component realignment .129
18.7 Adding solder to existing joints .129
18.8 Removing excess solder .131
18.9 Component removal.131
18.10 Component replacement .131
18.11 Repair of assemblies returned from the field .133
19 Conformal coatings, including solder resist.133
19.1 General .133
19.2 Conformal protective coating.133
19.3 Solder mask coating .139
20 Packaging and shipping .141
20.1 Materials.141
20.2 Mechanical protection .143
20.3 Marking/labelling.143
20.4 Handling .143
21 Training .143
21.1 Training of designers, engineers and senior line management .143
21.2 Training production line personnel.143
Figure 1 – SM single-sided surface-mount assembly, reflow only .27
Figure 2 – SM single-sided assembly, immersion only.27
Figure 3 – Mixed technology assembly, double-sided: reflow and immersion,
flow or wave solder.29
Figure 4 – Mixed technology assembly, double-sided reflow and manual .29
Figure 5 – Mixed technology assembly, double-sided, immersion only.29
Figure 6 – Typical passive surface-mounted component package styles.71
Figure 7 – Typical semiconductor surface-mounted component package styles .73
Figure 8 – Typical axial-lead components .79
Figure 9 – Typical radial dual-lead components.79
Figure 10 – Radial lead component with shaped lead stand-off .79
Figure 11 – Typical radial lead transistor, with spacer .81
Figure 12 – Typical multilead integrated circuit package types.83
Figure 13 – Typical pin grid array package.85
Figure 14 – Examples of anchored terminals.89
Figure 15 – Types of wire attachment .91
Table 1 – Recommended rework equipment for common component types .125
Table 2 – Limits of conformal coating defects (percentage of one side of board area) .135

61192-1 © IEC:2003 – 9 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________
WORKMANSHIP REQUIREMENTS
FOR SOLDERED ELECTRONIC ASSEMBLIES –
Part 1: General
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. The IEC collaborates closely with the International Organization
for Standardization (ISO) in accordance with conditions determined by agreement between the two
organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form
of standards, technical specifications, technical reports or guides and they are accepted by the National
Committees in that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International
Standards transparently to the maximum extent possible in their national and regional standards. Any
divergence between the IEC Standard and the corresponding national or regional standard shall be clearly
indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject
of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61192-1 has been prepared by IEC technical committee 91:
Electronics assembly technology.
The text of this standard is based on the following documents:
FDIS Report on voting
91/345/FDIS 91/367/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
This standard should be used in conjunction with the following parts of IEC 61192, under the
general title Workmanship requirements for soldered electronic assemblies:
Part 2: Surface-mount assemblies
Part 3: Through-hole mount assemblies
Part 4: Terminal assemblies
61192-1 © IEC:2003 – 11 –
The committee has decided that the contents of this publication will remain unchanged until
2007. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
61192-1 © IEC:2003 – 13 –
INTRODUCTION
This part of IEC 61192 covers general workmanship requirements for the manufacture of
soldered electronic assemblies that can enable the requirements of IEC 61191-1 and its related
sectional standards to be met.
The requirements for surface-mount assemblies as well as through-hole mount assemblies and
terminal assemblies are given in IEC 61192-2, IEC 61192-3 and IEC 61192-4, which are
separate but related standards.

61192-1 © IEC:2003 – 15 –
WORKMANSHIP REQUIREMENTS
FOR SOLDERED ELECTRONIC ASSEMBLIES –
Part 1: General
1 Scope and object
This part of IEC 61192 specifies general requirements for workmanship in soldered electronic
assemblies on printed boards and on similar laminates attached to the surface(s) of organic
substrates.
This standard does not include hybrid circuits in which the conductor metallization is deposited
directly on a ceramic substrate or onto a ceramic-coated metal substrate. It includes multichip
modules assembled on organic substrates but excludes them when they are assembled on
inorganic substrate surfaces such as ceramic or silicon.
The purpose of this standards is:
a) to define requirements and guidelines for good workmanship and practice in the
preparation, soldering, inspection and testing of electronic and electrical assemblies;
b) to enable achievement of high yields and high product quality through process control in
production:
c) to enable the suppliers and users of electronic assemblies to specify good manufacturing
practice as part of a contract.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60194, Printed board design, manufacture and assembly – Terms and definitions
IEC 61188-1-1, Printed boards and printed board assemblies – Design and use – Part 1-1:
Generic requirements – Flatness considerations for electronic assemblies
IEC 61188-5-2, Printed boards and printed board assemblies – Design and use – Part 5-2:
1)
Attachment (land/joint) considerations – Discrete components
IEC 61189-3, Test methods for electrical materials, interconnection structures and assemblies –
Part 3: Test methods for interconnection structures (printed boards)
IEC 61190-1-1, Attachment materials for electronic assembly – Part 1-1: Requirements for
soldering fluxes for high-quality interconnections in electronics assembly
__________
1)
To be published.
61192-1 © IEC:2003 – 17 –
IEC 61191-1, Printed board assemblies – Part 1: Generic specification – Requirements for
soldered electrical and electronic assemblies using surface mount and related assembly
technologies
IEC 61191-2, Printed board assemblies – Part 2: Sectional specification – Requirements for
surface mount soldered assemblies
IEC 61191-3, Printed board assemblies – Part 3: Sectional specification – Requirements for
through-hole soldered assemblies
IEC 61191-4, Printed board assemblies – Part 4: Sectional specification – Requirements for
terminal soldered assemblies
IEC 61192-2, Workmanship requirements for soldered electronic assemblies – Part 2: Surface-
mount assemblies
IEC 61192-3, Workmanship requirements for soldered electronic assemblies – Part 3: Through-
hole mount assemblies
IEC 61192-4, Workmanship requirements for soldered electronic assemblies – Part 4: Terminal
assemblies
IEC 61249-8 (all parts), Materials for interconnection structures – Part 8: Sectional specifi-
cation set for non-conductive films and coatings
IEC 61340-5-1, Electrostatics – Part 5-1: Protection of electronic devices from electrostatic
phenomena – General requirements
IEC 61340-5-2, Electrostatics – Part 5-2: Protection of electronic devices from electrostatic
phenomena – User guide
IEC 61760-2, Surface mounting technology – Part 2: Transportation and storage conditions of
surface mounting devices (SMD) – Application guide
ISO 9002, Quality systems – Model for quality assurance in production, installation and
servicing
3 Terms and definitions
For the purposes of this part of IEC 61192, the definitions in IEC 60194 and the following apply.
3.1
new design
design that has not previously been assembled by the manufacturer
4 General requirements
4.1 Order of precedence
Unless the user specifies compliance with all of the requirements (or with specific items) in this
standard, for example, as part of a supply contract, the relevant mandatory clauses and
subclauses herein may be interpreted as guidance.

61192-1 © IEC:2003 – 19 –
Line drawings in this standard are intended to assist in interpretation of the written
requirements. The written requirements take precedence.
4.1.1 Conflict
When the user elects to specify compliance with all or some of the mandatory requirements of
this standard,
a) in the event of conflict between the text of this standard and the applicable documents cited
herein, refer to IEC 61191-1 for the relevant priorities and to IEC 61191-2, IEC 61191-3 and
IEC 61191-4 for technical requirements. However, nothing in this standard supersedes
applicable laws and regulations.
b) in the event of conflict between the requirements of this standard and the applicable user
assembly drawing(s) and specifications, the latter shall govern. When the conflict is
between the requirements of this standard and drawing(s) or specification(s) that have not
been approved by the user, the latter shall be submitted to the user for approval. Upon such
approval, the acceptance (or changes) shall be documented for example, by official revision
note or equivalent on the drawing(s) or specification(s) which shall then govern.
c) where the applicable user documentation requirements are less stringent than the
applicable mandatory items in IEC 61191-1, IEC 61191-2, IEC 61191-3, IEC 61191-4, or in
this standard, neither the supplier or the user shall claim compliance with this or any of the
standard listed in this clause, without identifying the specific clauses and related
requirement relaxations in each and every such claim.
4.1.2 Interpretation of requirements
When the user elects to specify compliance with the mandatory requirements of this standard,
a) unless otherwise specified by the user, the word "shall", signifies that the requirement is
mandatory. Deviation from any "shall", requirement requires written acceptance by the user,
for example, via assembly drawing, specification or contract provision.
b) the words "should", and "may", reflect recommendations and guidance respectively and are
used whenever it is intended to express non-mandatory provisions.
4.1.3 Classification
The introduction of product classification permits the user to select performance requirements
according to end-use application.
This standard recognizes that electronic and electrical assemblies are subject to classification
by intended end-item use. Subclause 4.3 of IEC 61191-1 identifies three general end-product
levels that have been established to reflect differences in producibility, complexity, functional
performance requirements and verification (inspection/test) frequency. It should be recognized
that there may be overlaps of equipment between levels.
The user of the assemblies is responsible for determining the level to which the product
belongs. The contract shall specify the level required and indicate any exceptions or additional
requirements to the parameter, where appropriate. The three levels are:

61192-1 © IEC:2003 – 21 –
Level A – general electronic products, includes consumer products, some computer and
computer peripherals and hardware suitable for applications where the major requirement is
function of the completed assembly;
Level B – dedicated service electronic products, includes communications equipment,
sophisticated business machines and instruments where high performance and extended life is
required, and for which uninterrupted service is desired but not mandatory (typically the end-
use environment would not cause failures);
Level C – high-performance electronic products, includes all equipment where continued
performance or performance-on-demand is mandatory. (Equipment downtime cannot be
tolerated, end-use environment may be uncommonly harsh, and the equipment must function
when required, such as life support systems and other critical systems.)
The status of product for each level is subdivided into the following three workmanship
conditions.
a) Target – represents a standard of practice and workmanship that shall be the goal for all
normal operations. (This is a pass category.)
b) Acceptable – represents a minimum condition that can be supplied to a user or, where
appropriate, the next manufacturing centre without correction or rework; when the incidence
of deviations within this standard increases to a significant proportion of production (as set
by pre-determined process control limits), it should represent cause for concern and call for
corrective action. (This is a pass category.)
c) Non-conforming – represents an incident that demands correction by appropriate rework
(or scrapping) and is to be formally reported as a defect for quality and process control
purposes; it is deemed likely to render the process unacceptable or the product
subsequently unreliable. (This is a fail category.)
The first occurrence of non-conformance implies that all other conditions preceding the non-
conformance are acceptable. For example, if a non-conforming condition is stated as "10 % or
more of the surface is dewetted", this implies that if 9 % of the surface is dewetted, this is
acceptable for that defect in the applicable level.
Non-conformance in level A automatically implies non-conformance in level B and level C. Non
conformance in level B implies non-conformance in level C.
The manufacturer shall dispose of the non-conforming product based on design, service and
user requirements (rework, repair, use as is, or scrap).
Actual measurement of specific material quantity, component placement, component position,
or solder fillet dimensions may be carried out for referee purposes.
The inspector should not select the level for the part under inspection. Documentation that
specifies the applicable level for the inspection should be provided to the inspector.
Acceptance and/or rejection workmanship decisions shall be based on applicable
documentation such as the contract, the relevant specification or referenced documents.
In some cases, inset tolerances may be applied to minimize the risk of subsequent process
deviations or defects.
61192-1 © IEC:2003 – 23 –
4.2 Process control
4.2.1 Defects and process deviation indicators (PDIs)
Table 2 in IEC 61191-1, Table 1 in IEC 61191-2, Table 2 in IEC 61191-3 and Table 3 in
IEC 61191-4 list typical defects that are unacceptable and require disposition, for example,
rework, repair. The manufacturer is responsible for identifying other areas of risk and treating
those additional concerns. Such items should be documented on the assembly drawing. Other
than the unacceptable defects listed, anomalies and variances from within ‘acceptable’ limits
are considered as process deviation indicators and shall be monitored when their occurrence is
observed. Disposition of process deviations revealed by PDIs is not required.
4.2.2 Process control and process improvement requirements
IEC 61191-1 requires the use of process control methodologies in the implementation and
evaluation of processes used to produce electrical and electronic assemblies. Subject to
agreement by the user, the manufacturer/assembler may be exempt from performing specific
quality conformance evaluations and inspections detailed in this standard provided objective
evidence of a comprehensive and current process improvement plan is available.
The means of control of design, of materials and component quality, and of machine operation
control shall be demonstrated.
Process improvement plans do not necessarily require statistical process control methods
provided evidence demonstrating alternative data collection, feedback and corrective action
procedures and methods is available.
4.2.3 Requirements flowdown
The applicable requirements of this standard shall be imposed by each manufacturer or
supplier on all applicable subcontracts and purchase orders. The manufacturer or supplier shall
not impose or allow any variation from these requirements on subcontracts or purchase orders
other than those that have been approved by the user.
Unless otherwise specified, the requirements of this document are not imposed on the
procurement of off-the-shelf (catalogue) items. However, the manufacturers of these items may
comply as deemed appropriate.
4.2.4 Designs
4.2.4.1 New designs
Refer to clause 3 and 5.1.
4.2.4.2 Existing designs
The requirements of this standard should not constitute the sole cause for redesign of a
currently approved design. However, when existing designs undergo changes that impact
hardware configuration, the design shall be reviewed and user-approved changes made that
allow for maximum practical compliance.

61192-1 © IEC:2003 – 25 –
4.2.5 Personnel proficiency
The following requirements shall be:
a) prior to commencing work, all instructors, operators and inspection personnel shall be
proficient in the tasks to be performed;
b) objective evidence that proficiency shall be maintained and be available for review and shall
include records of training to the applicable job functions being performed, testing to the
requirements in this standard, and results of periodic reviews of proficiency.
NOTE For further information, refer to ISO 9001 and ISO 9002. Details of relevant training categories are given in
clause 21.
4.2.6 Electrostatic discharge (ESD)
The ESD control programme shall be in accordance with IEC 61340-5-1 and IEC 61340-5-2.
Documented procedures, electrostatic discharge control for the protection of ESD-sensitive
electrical and electronic parts, components, assemblies and equipment shall be maintained
during, but not limited to
a) receipt and test of incoming items;
b) board, component, and part storage and kitting;
c) manufacturing and rework;
d) inspection and test cycles
e) storage, packing and shipping of completed products;
f) transport and installation.
Failure analysis ESD procedures shall be documented and be available for review.
4.3 Facilities
4.3.1 Workplace cleanliness
The workplace shall meet the following requirements:
a) cleanliness and ambient environments in all work areas shall be maintained at levels that
prevent contamination or deterioration of soldering tools, materials and surfaces to be
soldered;
b) eating, drinking and use of tobacco products and drugs shall be prohibited in the work
areas.
4.3.2 Environmental controls
The soldering facility should be enclosed, temperature and humidity controlled and maintained
at a positive pressure.
For operator comfort and solderability maintenance, the temperature should be maintained
between 18 °C and 30 °C and the relative humidity (RH) should not exceed 70 %. For process
control, the need for closer temperature and humidity limits may apply, for example, in solder
paste and adhesive deposition.
When relative humidity decreases to 30 % or lower, the manufacturer shall verify that
electrostatic discharge control is adequate and that sufficient moisture is present for flux
performance and solder paste application.

61192-1 © IEC:2003 – 27 –
4.3.3 Lighting
Illumination at the working surface of manual soldering and inspection surfaces shall be
1 000 lm/m minimum.
4.3.4 Field conditions
In field operations where the controlled environment conditions required by this standard
cannot be effectively achieved, special precautions shall be taken to maximize the quality of
solder connections and to minimize the effects of uncontrolled envi
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