EN 60512-12-4:2006
(Main)Connectors for electronic equipment - Tests and measurements - Part 12-4: Soldering tests - Test 12d: Resistance to soldering heat, solder bath method
Connectors for electronic equipment - Tests and measurements - Part 12-4: Soldering tests - Test 12d: Resistance to soldering heat, solder bath method
Details a standard test method to assess the ability of a connector to withstand the heating stresses produced by a mass soldering operation.
Steckverbinder für elektronische Einrichtungen - Mess- und Prüfverfahren - Teil 12-4: Prüfungen der Lötbarkeit - Prüfung 12d: Lötwärmebeständigkeit, Lötbadverfahren
Connecteurs pour équipements électroniques - Essais et mesures - Partie 12-4: Essais de soudure - Essai 12d: Résistance à la chaleur de soudage, méthode de bain de brasage
Précise une méthode d'essai normalisée pour évaluer la capacité d'un connecteur à résister aux contraintes d'échauffement produites par une opération de brasage simultané.",PE
Konektorji za elektronsko opremo – Preskusi in meritve – 12-4. del: Spajkalni preskusi – Preskus 12d: Odpornost proti spajkalni temperaturi, metoda s spajkalno banjico (IEC 60512-12-4:2006)
General Information
- Status
- Published
- Publication Date
- 22-Mar-2006
- Withdrawal Date
- 28-Feb-2009
- Technical Committee
- CLC/SR 48B - Connectors
- Drafting Committee
- IEC/SC 48B - IEC_SC_48B
- Parallel Committee
- IEC/SC 48B - IEC_SC_48B
- Current Stage
- 6060 - Document made available - Publishing
- Start Date
- 23-Mar-2006
- Completion Date
- 23-Mar-2006
Relations
- Effective Date
- 03-Feb-2026
- Refers
HD 323.2.20 S3:1988 - Basic environmental testing procedures - Part 2: Tests - Test T: Soldering - Effective Date
- 03-Feb-2026
- Effective Date
- 03-Feb-2026
- Effective Date
- 03-Feb-2026
Overview
EN 60512-12-4:2006 outlines a standardized method for evaluating the resistance of connectors for electronic equipment to soldering heat, using the solder bath method. Approved by the CENELEC (European Committee for Electrotechnical Standardization) and harmonized with IEC 60512-12-4:2006, this standard is essential for testing the durability and reliability of connectors subjected to the heating stresses commonly encountered during mass soldering operations. Ensuring connectors can withstand these thermal conditions is critical for maintaining integrity in electronic assemblies and prolonging service life.
Key Topics
- Resistance to Soldering Heat: The core focus is to determine whether connectors remain functionally robust after exposure to a solder bath at specified temperature and duration.
- Solder Bath Method: Test connectors are immersed in a solder bath, typically at 260°C, simulating conditions found in industrial mass soldering processes such as wave soldering.
- Test Procedure:
- Preparation of specimens, including considerations for heat sinks or thermal screens.
- Immersion time control, tailored as outlined in the connector’s detail specification.
- Visual inspections before and after soldering, using specific magnification to detect any detrimental effects or defects.
- Pre-Aging and Conditioning: Guidance on accelerated aging cycles prior to testing, to assess product robustness after simulated field use.
- Detail Specification Requirements: The standard prescribes parameters that must be explicitly stated if the test is referenced, including pre-aging, thermal protection use, immersion duration, and method deviations.
Applications
The EN 60512-12-4:2006 standard is widely applied in the electronics manufacturing sector wherever connectors undergo mass soldering. Practical uses and benefits include:
- Product Development and Quality Assurance: Ensures connectors are engineered to endure thermal stresses during manufacturing, leading to higher product reliability.
- Supplier and Component Validation: Provides a harmonized baseline for comparing connector durability from various suppliers and ensuring compliance with international best practices.
- Manufacturing Process Optimization: Assists production engineers and process developers in understanding connector limitations during wave soldering, reflow, or other automated soldering methods.
- Regulatory Compliance and Documentation: Supports compliance efforts for manufacturers distributing products in the European market and globally, with test reports that reference recognized international standards.
Related Standards
To ensure a comprehensive approach to connector soldering performance, consider the following related standards within the EN 60512 and IEC 60068 families:
- EN 60512-1 & EN 60512-1-100: General examination procedures and structure for all connector testing.
- EN 60512-12-1 to EN 60512-12-7: Additional soldering tests covering solderability (wettability and de-wetting), alternate soldering methods, sealing against flux/cleaning solvents, and wetting balance techniques.
- IEC 60068-2-20: Environmental testing procedures specifying solder bath methods and accelerated aging options.
- IEC 60068-2-58: Test methods for soldering heat and metallization dissolution resistance, especially relevant for surface-mounted devices (SMD).
Conclusion
Compliance with EN 60512-12-4:2006 is vital for manufacturers and suppliers of electronic connectors aiming to ensure product reliability during and after automated soldering processes. By adhering to this internationally recognized test method, organizations can demonstrate robust connector performance, support product claims, and facilitate market access in the electronics industry. For optimal results, always align with the latest amendments and reference related standards for comprehensive quality assurance.
Frequently Asked Questions
EN 60512-12-4:2006 is a standard published by CLC. Its full title is "Connectors for electronic equipment - Tests and measurements - Part 12-4: Soldering tests - Test 12d: Resistance to soldering heat, solder bath method". This standard covers: Details a standard test method to assess the ability of a connector to withstand the heating stresses produced by a mass soldering operation.
Details a standard test method to assess the ability of a connector to withstand the heating stresses produced by a mass soldering operation.
EN 60512-12-4:2006 is classified under the following ICS (International Classification for Standards) categories: 31.220.10 - Plug-and-socket devices. Connectors. The ICS classification helps identify the subject area and facilitates finding related standards.
EN 60512-12-4:2006 has the following relationships with other standards: It is inter standard links to EN 60512-1-1:2002, HD 323.2.20 S3:1988, EN IEC 61076-3-123:2019, EN IEC 61076-3-126:2023. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.
EN 60512-12-4:2006 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.
Standards Content (Sample)
STANDARDKonektorji za elektronsko opremo – Preskusi in meritve – 12-4. del: Spajkalni preskusi – Preskus 12d: Odpornost proti spajkalni temperaturi, metoda s spajkalno banjico (IEC 60512-12-4:2006)Connectors for electronic equipment - Tests and measurements - Part 12-4: Soldering tests - Test 12d: Resistance to soldering heat, solder bath method (IEC 60512-12-4:2006)©
Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljenoReferenčna številkaSIST EN 60512-12-4:2006(en)ICS31.220.10
EUROPEAN STANDARD EN 60512-12-4 NORME EUROPÉENNE
EUROPÄISCHE NORM March 2006
CENELEC European Committee for Electrotechnical Standardization Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2006 CENELEC -
All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60512-12-4:2006 E
ICS 31.220.10
English version
Connectors for electronic equipment -
Tests and measurements Part 12-4: Soldering tests -
Test 12d: Resistance to soldering heat, solder bath method (IEC 60512-12-4:2006)
Connecteurs pour équipements électroniques -
Essais et mesures Partie 12-4: Essais de soudure -
Essai 12d: Résistance à la chaleur
de soudage, méthode de bain de brasage(CEI 60512-12-4:2006)
Steckverbinder für elektronische Einrichtungen -
Mess- und Prüfverfahren Teil 12-4: Prüfungen der Lötbarkeit - Prüfung 12d: Lötwärmebeständigkeit, Lötbadverfahren (IEC 60512-12-4:2006)
This European Standard was approved by CENELEC on 2006-03-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom.
- 2 - Foreword The text of document 48B/1579/FDIS, future edition 1 of IEC 60512-12-4, prepared by SC 48B, Connectors, of IEC TC 48, Electromechanical components and mechanical structures for electronic equipment, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60512-12-4 on 2006-03-01. This standard is to be read in conjunction with EN 60512-1 and EN 60512-1-100 which explains the structure of the EN 60512 series.
The following dates were fixed: – latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement
(dop) 2006-12-01 – latest date by which the national standards conflicting
with the EN have to be withdrawn
(dow) 2009-03-01 This European Standard makes reference to International Standards. Where the International Standard referred to has been endorsed as a European Standard or a home-grown European Standard exists, this European Standard shall be applied instead. Pertinent information can be found on the CENELEC web site. __________ Endorsement notice The text of the International Standard IEC 60512-12-4:2006 was approved by CENELEC as a European Standard without any modification. __________
NORME INTERNATIONALECEIIEC INTERNATIONAL STANDARD 60512-12-4Première éditionFirst edition2006-02 Connecteurs pour équipements électroniques – Essais et mesures – Partie 12-4: Essais de soudure – Essai 12d: Résistance à la chaleur de soudage, méthode de bain de soudage
Connectors for electronic equipment – Tests and measurements – Part 12-4: Soldering tests – Test 12d: Resistance to soldering heat, solder bath method
Pour prix, voir catalogue en vigueur For price, see current catalogue IEC 2006
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3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, SwitzerlandTelephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch
Web: www.iec.ch CODE PRIX PRICE CODE F Commission Electrotechnique InternationaleInternational Electrotechnical Commission
60512-12-4 IEC:2006 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION ____________
CONNECTORS FOR ELECTRONIC EQUIPMENT – TESTS AND MEASUREMENTS –
Part 12-4: Soldering tests –
Test 12d: Resistance to soldering heat,
solder bath method
FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5
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