EN 62433-2:2010

SLOVENSKI STANDARD
01-marec-2010
Modeli integriranih vezij za vedenjsko simulacijo pri EMI - 2.del: Modeli integriranih
vezij za vedenjsko simulacijo pri EMI - Vodeni model oddajanja ICEM-CE, ICEM
(IEC 62433-2:2008)
EMC IC modelling - Part 2: Models of Integrated Circuits for EMI behavioural simulation -
Conducted Emissions modelling (ICEM-CE) (IEC 62433-2:2008)
EMV-IC-Modellierung - Teil 2: Modelle integrierter Schaltungen für die Simulation des
Verhaltens bei elektromagnetischer Beeinflussung - Modellierung leitungsgeführter
Aussendungen (ICEM-CE) (IEC 62433-2:2008)
Compatibilité électromagnétique (CEM) - Partie 2 : Modèles de circuits intégrés pour la
simulation du comportement lors de perturbations électromagnétiques - Modélisation des
émissions conduites (ICEM-CE) (CEI 62433-2:2008)
Ta slovenski standard je istoveten z: EN 62433-2:2010
ICS:
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD
EN 62433-2
NORME EUROPÉENNE
January 2010
EUROPÄISCHE NORM
ICS 31.200
English version
EMC IC modelling -
Part 2: Models of integrated circuits for EMI behavioural simulation -
Conducted emissions modelling (ICEM-CE)
(IEC 62433-2:2008)
Compatibilité électromagnétique (CEM) - EMV-IC-Modellierung -
Partie 2: Modèles de circuits intégrés Teil 2: Modelle integrierter Schaltungen
pour la simulation du comportement für die Simulation des Verhaltens
lors de perturbations électromagnétiques - bei elektromagnetischer Beeinflussung -
Modélisation des émissions conduites Modellierung leitungsgeführter
(ICEM-CE) Aussendungen (ICEM-CE)
(CEI 62433-2:2008) (IEC 62433-2:2008)

This European Standard was approved by CENELEC on 2009-12-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: Avenue Marnix 17, B - 1000 Brussels

© 2010 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62433-2:2010 E
Foreword
The text of document 47A/794/FDIS, future edition 1 of IEC 62433-2, prepared by SC 47A, Integrated
circuits, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was
approved by CENELEC as EN 62433-2 on 2009-12-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2010-09-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2012-12-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 62433-2:2008 was approved by CENELEC as a European
Standard without any modification.
__________
- 3 - EN 62433-2:2010
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year

IEC 61967 Series Integrated circuits - Measurement of EN 61967 Series
electromagnetic emissions,
150 kHz to 1 GHz
IEC 61967-4 - Integrated circuits - Measurement of EN 61967-4 -
electromagnetic emissions,
150 kHz to 1 GHz -
Part 4: Measurement of conducted
emissions - 1 ohm/150 ohm direct coupling
method
IEC 62433-2
Edition 1.0 2008-10
INTERNATIONAL
STANDARD
EMC IC modelling –
Part 2: Models of integrated circuits for EMI behavioural simulation – Conducted
emissions modelling (ICEM-CE)
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
X
ICS 31.200 ISBN 2-8318-1002-7
– 2 – 62433-2 © IEC:2008(E)
CONTENTS
FOREWORD.5
1 Scope.7
2 Normative references .7
3 Terms and definitions .7
4 Philosophy .8
4.1 General .8
4.2 Conducted emission from core activity (digital culprit) .8
4.3 Conducted emission from I/O activity.9
5 Basic components .9
5.1 General .9
5.2 Internal Activity (IA).9
5.3 Passive Distribution Network (PDN) .10
6 IC macro-models .12
6.1 General .12
6.2 General IC macro-model .12
6.3 Block-based IC macro-model.13
6.3.1 Block component .13
6.3.2 Inter-Block Coupling component (IBC) .14
6.3.3 Block-based IC macro-model structure .15
6.4 Sub-model-based IC macro-model .17
6.4.1 Sub-model component.17
6.4.2 Sub-model-based IC macro-model structure .18
7 Requirements for parameter extraction.19
7.1 General .19
7.2 Environmental extraction constraints .19
7.3 IA parameter extraction .19
7.4 PDN parameter extraction .19
7.5 IBC parameter extraction.19
Annex A (informative) Model parameter generation.20
Annex B (informative) Decoupling capacitors optimization .38
Annex C (informative) Conducted emission prediction.40
Annex D (informative) Conducted emission prediction at PCB level .41
Bibliography.43

Figure 1 – Decomposition example of a digital IC for conducted emissions analysis .8
Figure 2 – IA component.9
Figure 3 − Example of IA characteristics in time domain .10
Figure 4 − Example of IA characteristics in frequency domain.10
Figure 5 − Example of a four-terminal PDN using lumped elements .11
Figure 6 − Example of a seven-terminal PDN using distributed elements .11
Figure 7 − Example of a twelve-terminal PDN using matrix representation .12
Figure 8 – General IC macro-model .13
Figure 9 – Example of block component.13
Figure 10 – Example of block components for I/Os .14

62433-2 © IEC:2008(E) – 3 –
Figure 11 – Example of IBC with two internal terminals.15
Figure 12 – Relationship between blocks and IBC.15
Figure 13 – Block-based IC macro-model.16
Figure 14 – Example of block-based IC macro-model.17
Figure 15 – Example of simple sub-model.18
Figure 16 – Sub-model-based IC macro-model .18
Figure A.1 – Typical characterization current gate schematic.22
Figure A.2 – Current peak during switching transition .22
Figure A.3 – Example of IA extraction procedure from design .23
Figure A.4 – Technology Influence.23
Figure A.5 – Final current waveform for a program period.24
Figure A.6 – Comparison between measurement and simulation.24
Figure A.7 – Lumped element model of a package.25
Figure A.8 – Circuit structure of the netlist .26
Figure A.9 – Principle of the IA computation .27
Figure A.10 – Process involved to model i (t) .27
A
Figure A.11 – i (t) measured using IEC 61967-4.28
Ext
Figure A.12 – i (t)and i (t) profiles .28
A Ext
Figure A.13 – Example of a hardware set-up used to extract the PDN parameters .30
Figure A.14 – Miniature 50 Ω coaxial connectors .30
Figure A.15 – Impedance probe using two miniature coaxial connectors .31
Figure A.16 – Open and short terminations .31
Figure A.17 – Measurement probe model.31
Figure A.18 – De-embedding principle .32
Figure A.19 – Example of a predefined PDN structure .33
Figure A.20 – RL configuration .34
Figure A.21 – RLC configuration .34
Figure A.22 – RLC with magnetic coupling configuration.35
Figure A.23 – Impedance seen from Vcc and Gnd .35
Figure A.24 – Complete PDN component .36
Figure A.25 – Set-up for correlation (left), measurement and prediction (right).37
Figure A.26 – Set-up used to measure the internal decoupling capacitor .37
Figure B.1 – Equivalent schematic of the complete electronic system .38
Figure B.2 – Impedance prediction and measurements .39
Figure C.1 – IEC 61967-4 test set-up standard .40
Figure C.2 – Comparison between prediction and measurement .40
Figure D.1 – Prediction of the Vdcc noise level at PCB level.41
Figure D.2 – Good agreements on the noise envelope .42

– 4 – 62433-2 © IEC:2008(E)
Table A.1 – Typical parameters for CMOS logic technologies .20
Table A.2 – Typical number of logic gates vs. CPU technology .21
Table A.3 – R, L and C parameters for various package types .21
Table A.4 – Measurement configurations and extracted RLC parameters.33

62433-2 © IEC:2008(E) – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
EMC IC MODELLING –
Part 2: Models of integrated circuits for EMI behavioural simulation –
Conducted emissions modelling (ICEM-CE)

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62433-2 has been prepared by subcommittee 47A: Integrated
circuits, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47A/794/FDIS 47A/799/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all the parts in the IEC 62433 series, under the general title EMC IC modelling, can
be found on the IEC website.
– 6 – 62433-2 © IEC:2008(E)
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

62433-2 © IEC:2008(E) – 7 –
EMC IC MODELLING –
Part 2: Models of integrated circuits for EMI behavioural simulation –
Conducted emissions modelling (ICEM-CE)

1 Scope
This part of IEC 62433 specifies macro-models for ICs to simulate conducted electromagnetic
emissions on a printed circuit board. The model is commonly called Integrated Circuit
Emission Model - Conducted Emission (ICEM-CE).
The ICEM-CE model can also be used for modelling an IC-die, a functional block and an
Intellectual Property block (IP).
The ICEM-CE model can be used to model both digital and analogue ICs.
Basically, conducted emissions have two origins:
• conducted emissions through power supply terminals and ground reference structures;
• conducted emissions through input/output (I/O) terminals.
The ICEM-CE model addresses those two types of origins in a single approach.
This standard defines structures and components of the macro-model for EMI simulation
taking into account the IC’s internal activities.
This standard gives general data, which can be implemented in different formats or languages
such as IBIS, IMIC, SPICE, VHDL-AMS and Verilog. SPICE is however chosen as default
simulation environment to cover all the conducted emissions.
This standard also specifies requirements for information that shall be incorporated in each
ICEM-CE model or component part of the model for model circulation, but description syntax
is not within the scope of this standard.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 61967 (all parts), Integrated Circuits – Measurement of electromagnetic emissions, 150
KHz to 1 GHz
IEC 61967-4, Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to 1
GHz – Part 4: Measurement of conducted emissions – 1 Ω/150 Ω direct coupling method
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.

– 8 – 62433-2 © IEC:2008(E)
3.1
external terminal
terminal of an IC macro-model, which interfaces the model to the external environment of the
IC, such as power supply pins and I/O pins
NOTE In this document, the name of each external terminal starts with "ET".
3.2
internal terminal
terminal of an IC macro-model's component, which interfaces the component to other
components of the IC macro-model
NOTE In this document, the name of each internal terminal starts with "IT".
4 Philosophy
4.1 General
Integrated circuits will have more and more gates on silicon and technical progress will
develop faster. To predict the electromagnetic behaviour of equipment, it is required to model
the switching of the input and output interface and the internal activities of an integrated
circuit effectively.
Figure 1 depicts an example of decomposition of an IC to enable conducted emissions
analysis. The internal digital activity (culprit) is a source of electromagnetic noise that
originates in switching of active devices. The coupling path propagates the emissions to the
IC’s external terminals: pins/pads. The coupling path is the power distribution network or I/O
lines inside the IC.
Power Distribution
Network
Vdd Vss Vdd Vss
Digital Culprit
Digital Coupling I/Os' Coupling I/Os' Culprit
(Emission
path path (Emission Source)
Source)
IC
Inter Block Coupling Path
I/O
IEC  1644/08
Figure 1 – Decomposition example of a digital IC for conducted emissions analysis
4.2 Conducted emission from core activity (digital culprit)
The current transients are created in the core area on the IC-die. Due to the characteristics of
the digital coupling paths, the passive distribution network on printed circuit board (PCB) and
the availability of on-chip decoupling, a portion of these current transients will occur at the
power supply pins of the IC.
62433-2 © IEC:2008(E) – 9 –
NOTE These off-chip power supply currents can be measured according to the IEC 61967 series.
4.3 Conducted emission from I/O activity
I/Os activities may create voltage fluctuations of power and ground levels, and conducted
emissions appear at power and ground pins through the I/Os' coupling path. And the output
signals at output pins themselves are sources of conducted emissions to the printed circuit
boards.
NOTE The measurement set-up is done according to the IEC 61967 series.
5 Basic components
5.1 General
The basic components are component parts of the IC macro-model or block component or
sub-model component. The following subclauses define the basic components.
NOTE The block component and the sub-model component are defined in Subclause 6.3.1 and 6.4.1 respectively.
5.2 Internal Activity (IA)
The Internal Activity (IA) component is the electromagnetic noise source that originates in
switching of active devices in the IC or in a portion of the IC. This component is applicable for
both analogue and digital circuitry.
The IA is described using an independent current source or an independent voltage source
with two internal terminals as shown in Figure 2.
ITITAA--[[00]]
ITITAA++[[00]]
IEC  1645/08
Figure 2 – IA component
The characteristics of IA component are typically described in the time domain, and the
characteristics can also be described in the frequency domain.
The description of an IA component shall contain the following information.
• Name of the IA component
• Names of its internal terminals
• Operational mode or test vector
• Domain (time or frequency)
• Definition of origin of time, and cycle-time for the operational mode (for time domain)
• Definition of origin of phase (for frequency domain)
• Operational conditions and applicable ranges
a) Power supply voltage ranges
b) Temperature range
– 10 – 62433-2 © IEC:2008(E)
c) Frequency range
• Characteristics of the IA
a) Current or voltage waveform over the whole cycle-time (for time domain)
b) Current or voltage amplitude and phase, versus frequency over the whole frequency
range (for frequency domain)
EXAMPLE 1
Figure 3 shows an example of characteristics of IA in the time domain. The waveform
depends on the specific operational mode of function. A simple waveform such as a triangular
waveform can be used for the component description.
i (A)
time (s)
IEC  1646/08
Figure 3 − Example of IA characteristics in the time domain
EXAMPLE 2
Figure 4 shows an example of characteristics of IA in the frequency domain.
I (dBµA)
f (Hz)
IEC  1647/08
Figure 4 − Example of IA characteristics in the frequency domain
5.3 Passive Distribution Network (PDN)
The Passive Distribution Network component (PDN) presents the characteristics of
propagation path of electromagnetic noises such as power distribution network (part of the
PDN). The PDN can be linear or non-linear.

62433-2 © IEC:2008(E) – 11 –
The PDN consists of passive elements, and is equipped with internal terminals. And the PDN
can have external terminals.
The PDN can be described using a netlist. In the case the PDN can be assumed to be linear,
some matrix formats such as the S-parameter can also present the PDN characteristics.
The description of a PDN component shall contain the following information.
• Name of the PDN component
• Names of its internal terminals and external terminals
• Applicable ranges
a) Power supply voltage range
b) Temperature range
c) Applicable load conditions if the PDN is for output
d) Applicable frequency range
• Characteristics of the PDN
EXAMPLE 1
Figure 5 shows an example of a four-terminal PDN using lumped elements. The ETVdd and
ETVss are two external terminals of the PDN. The IT[1] and the IT[0] are two internal
terminals.
ITIT[[11]] ITIT[[00]]
PDPDNN
ETETVVdddd ETETVVssss
IEC  1648/08
Figure 5 − Example of a four-terminal PDN using lumped elements
EXAMPLE 2
Figure 6 depicts the seven-terminal PDN structure using distributed elements such as
transmission lines. The ETVxx are the four external terminals, the ITVxx are two internal
terminals and the ETGnd is the common ground of the four transmission lines, connected to
the PCB ground.
PDPDNN
EETTVVdd[dd[00]] IITTVVdd[dd[0]0]
IITTVVss[ss[00]]
EETTVVss[ss[00]]
EETTVVdd[dd[11]]
EETTVVss[ss[11]]
ETETGGnndd
IEC  1649/08
Figure 6 − Example of a seven-terminal PDN using distributed elements

– 12 – 62433-2 © IEC:2008(E)
EXAMPLE 3
Figure 7 shows an example of a twelve-terminal PDN using scattering parameters in a matrix
format (black box). The ET[x] are external terminals. The IT[1] to IT[6] are internal terminals.
A ground plane below the modelled IC is taken as an ideal reference ground for these
terminals.
ETET[[11]]
IT[IT[11]]
S1S111 -- -- -- -- SS1 121 12
ETET[[22]]
IT[IT[22]]
---- --------
---- --------
ETET[[33]]
IT[IT[33]]
ETET[[44]] ---- --------
IT[IT[44]]
---- --------
ETET[[55]]
IT[IT[55]]
SS12 112 1 -- -- -- -- SS12 1212 12
ETET[[66]]
IT[IT[66]]
IEC  1650/08
Figure 7 − Example of a twelve-terminal PDN using matrix representation
6 IC macro-models
6.1 General
An IC is modelled as an IC macro-model. Three types of IC macro-models, general model,
block-based model and sub-model-based model, are possible. These IC macro-models are
defined in this subclause.
The description of an IC macro-model shall contain the following information for model
circulation.
• Name of the IC macro-model
• Type of the model, general model or block-based model or sub-model-based model
• Names of components that are included in the IC macro-model
• Names of its external terminals
• Connections of the internal terminals of its components
6.2 General IC macro-model
The general model consists of a single PDN and one or more IAs as shown in Figure 8. The
PDN shall include both the whole PDN on the IC die(s) and the whole PDN of the package. An
on-chip decoupling capacitor shall also be included in the PDN if it exists.
NOTE This structure is suitable for the model circulation to IC users because of the least disclosure of proprietary
information of the IC vendor.
62433-2 © IEC:2008(E) – 13 –
IICC m modelodel
IAIA
IAIA IAIA
IT[6IT[6]] IITT[[77]] IT[8IT[8]] IIT[T[99]] IITT[1[100]] IT[1IT[111]]
IT[0IT[0]] IITT[[11]] IT[2IT[2]] IIT[T[33]] ITIT[4[4]] IIT[5T[5]]
PDPDNN
ET[ET[00]] ETET[1][1]
ET[4]ET[4] EET[T[5]5] ETET[[88]] ETET[[99]]
ET[ET[22]] EETT[[3]3]
ETET[[66]] EETT[[77]]
ETET[[110]0] ETET[[11]11] ETET[14][14] ET[ET[115]5]
ET[ET[118]8] EETT[[119]9]
ETET[12][12] ETET[13][13]
ET[ET[116]6] ET[ET[117]7]
PPDN ofDN of P PCCB B ((outout of of t thhe e scope)scope)

IEC  1651/08
Figure 8 – General IC macro-model
6.3 Block-based IC macro-model
6.3.1 Block component
The block component represents EMC properties of a specific functional block of IC such as
embedded memory.
The block component consists of a single PDN and one or more IAs. The PDN includes PDN
of the specific functional block, a portion of global power/ground network and a portion of
package PDN, which are directly involved into the block's functionality. The on-chip
decoupling capacitor is a part of the PDN. The component is equipped with external terminals
and internal terminals.
The description of a block component shall include the following information.
• Name of the block component
• Names of the basic components that make up the block component
• Connections of the internal terminals of its basic components
EXAMPLE 1
Figure 9 shows an example of block component. The block consists of an IA and a PDN. The
internal terminals of the IA are connected to the internal terminals of the PDN.
PDPDPDPDNNNN E E E Exxxxamamamampppplllleeee
ITITITIT[[[[1111]]]] ITITITIT[[[[3333]]]]
IAIAIAIA E E E Exxxxaaaammmmpppplelelele
ETETETET[[[[1111]]]] ITITITIT[[[[1111]]]]
ITITITIT[3[3[3[3]]]]
RVRVRVRVdddddddd
LVLVLVLVdddddddd
PDPDPDPDNNNN IAIAIAIA
CoCoCoCommmmppppoooonnnneeeennnntttt
CCCComomomomponponponponeeeentntntnt
ETETETET[[[[0000]]]] ITITITIT[0[0[0[0]]]]
RRRRVVVVssssssss LLLLVVVVssssssss CCCCVVVVdddddddd
ITITITIT[[[[0000]]]] ITITITIT[[[[2222]]]]
ITITITIT[[[[2222]]]]
ETETETET[[[[1111]]]]
ETETETET[[[[0000]]]]
PPPPDDDDNNNN & & & & I I I IAAAA IC IC IC ICEEEEMMMM C C C Coooommmmppppoooonnnneeeennnnttttssss

IEC  1652/08
Figure 9 – Example of block component

– 14 – 62433-2 © IEC:2008(E)
EXAMPLE 2
Figure 10 depicts a three I/Os model. The I/OPDN component describes how I/Os are
powered and the I/OPDNA describes noise transfer characteristics among terminals. The
I/OIA components describe the current activity. They are built up using two IA components;
one to specify the high state behaviour and the other one to specify the low state.  Figure 10
shows the two types of I/O PDN components of the complete I/O model. The IBIS model could
be an implementation example.
I/OPDN I/OIA
I/OPDNA
Component Component Internal Ports Component
Inter nal Ports
IA[2]
ITVdd[n]
ETP[2]
IA[1]
I/Os PDN Access
ETP[1]
ITVss[]n
IA[0]
Passive Distribution ETP[0]
Internal
Network of I/Os
ITOut0 0
[]
Activity
ITVdd 0 ITVdd 0
[] [ ]
ITVss 0
ITVss[0] []
I/O ICEM-CE Model
ETP_Vdd
ETP_Vss
ITVdd 0
[ ]
IAHigh
ITOut0 0
[ ]
ITVss 0
[]
IALow
IEC  1653/08
Figure 10 – Example of block components for I/Os
6.3.2 Inter-Block Coupling component (IBC)
The Inter-Block Coupling (IBC) is a network of passive elements that presents a coupling
effect between blocks. The IBC is equipped with two or more internal terminals.
The description of an IBC component shall contain the following information.
• Name of the IBC
• Names of its internal terminals
• Applicable ranges
a) Power supply voltage ranges
b) Temperature range
c) Applicable frequency range
• Characteristics of the IBC
62433-2 © IEC:2008(E) – 15 –
EXAMPLE
Figure 11 shows an example of IBC. The relationship between the block and the IBC is shown
in Figure 12.
IBIBCC
IEC  1654/08
Figure 11 – Example of IBC with two internal terminals
IC macro-model
ITIBC[1] ITIBC[0]
Inter-Block
ITIBC[2]
Coupling ITIBC[3]
Analogue Block
I/O Digital Block I/O
IEC  1655/08
Figure 12 – Relationship between blocks and IBC
6.3.3 Block-based IC macro-model structure
The block-based structure is shown in Figure 13. The model consists of block components
and IBC components. The PDN of global wiring on die and the PDN on package are
incorporated into the PDNs of blocks.
NOTE 1 This structure is suitable for modelling from measurements.
NOTE 2 By combining PDNs of block and IBCs, this structure can be converted into general structure.

ETVdd
ETVss
ETVcc
ETVee
– 16 – 62433-2 © IEC:2008(E)
ICIC m moodedell
ICICEMEM-C-CE BE Blloock Ack A IICCEEM-CM-CE E BlBloock Bck B IICCEMEM--CCE BE Blloock Cck C
IAIA IAIA
IAIA
ITIT[6][6] IIT[7T[7]] ITIT[8[8]] IITT[[99]] ITIT[1[100]] ITIT[1[111]]
ITIT[0][0] IIT[1T[1]] ITIT[2[2]] IITT[[33]] ITIT[4][4] IITT[[55]]
ITIT[[12]12] IIT[T[15]15] ITIT[1[166]] ITIT[1[199]]
PDPDNN PDPDNN PDPDNN
IBCIBC IBCIBC
((iincnclluuddiingng P PKKGG)) ((iincludincluding PKGng PKG)) ((iincludincluding PKng PKGG))
ITIT[[13]13] IIT[T[14]14] ITIT[1[177]] ITIT[1[188]]
ETET[0[0]] ETET[[11]] ET[ET[44]] EET[T[5]5]
ETET[8[8]]
ETET[[22]] ETET[[33]] ET[ET[66]] EET[T[7]7]
ETET[9[9]] EETT[[10]10]
EETT[[13]13] EETT[[14]14]
ET[ET[117]7]
ET[ET[1111]] ETET[1[12]2]
EETT[[15]15] ET[ET[16]16]
PPDN ofDN of PC PCBB (o(outut of of th the e ssccopope)e)

IEC  1656/08
Figure 13 – Block-based IC macro-model
EXAMPLE
Figure 14 depicts an example of block-based IC macro-model. Each block has two external
terminals and three internal terminals. Three IBC blocks interconnect the internal terminals,
IT2, IT3, IT4, IT5 and IT6. In this example, IBCs are used to model the substrate coupling
caused by the sheet resistance between the three internal ground terminals.

62433-2 © IEC:2008(E) – 17 –
AVCC AVSS
ICEM Model ET4 ET5
Digital ICEM Block Analogue ICEM Block
IT0 Analogue
IT7
Digital IA Analogue PDN
IA
Component Component
Component
IT1
IT8
IT3 IT4
IBC1
Digital PDN
IT2 IBC2
Component
IBC0
IT6
IT5
I/Os' ICEM Block
IT9
I/Os' IA
IOs PDN
Component
IOs ICEM
Component
Model
IT10
ET0 ET1 ET2 ET3
VCC1
VSS1
VCC2 VSS2
IEC  1657/08
Figure 14 – Example of block-based IC macro-model
6.4 Sub-model-based IC macro-model
6.4.1 Sub-model component
The sub-model in Figure 16 represents the electromagnetic behaviour of specific functional
circuits of IC. An intellectual property (IP) shall be modelled as a sub-model, and some
specific functional circuits such as embedded memory and CPU core can be modelled using
the sub-model. The sub-model can be repeatedly used in the IC and/or other ICs.
The sub-model consists of a single PDN and one or more IAs. This PDN is a PDN of the
specific functional circuits. The sub-model is equipped with internal terminals but does not
have any external terminals.
The sub-model description shall contain the following information.
• Name of the sub-model
• Names of its internal terminals
• Names of the basic components that are included in the sub-model
• Connections of the internal terminals of basic components

– 18 – 62433-2 © IEC:2008(E)
EXAMPLE
Figure 15 shows a simple sub-model example.
ITIT[1[1]] ITIT[3][3]
IAIA
PDPDNN
CoCommppoonneenntt
CoCommppoonneenntt
ITIT[0][0] ITIT[2][2]
ITIT[4][4]
ITIT[[55]]
Figure 15 – Example of simple sub-model
6.4.2 Sub-model-based IC macro-model structure
The sub-model-based structure is shown in Figure 16. It consists of one or more sub-models,
a PDN of die, and a PDN of package. The PDN of die includes the global power/ground
network of IC die and the on-chip decoupling capacitor if it exists, but does not include PDNs
that belong to sub-models. Some IAs such as IAs for standard cell circuits can be directly
connected to the PDN of die (not shown in the figure).
NOTE 1 This structure is suitable for modelling using IC design information.
NOTE 2 By combining PDNs of the whole IC macro-model, a sub-model-based IC macro-model can be converted
into a general IC macro-model.
IC model
Sub-model A Sub-model B Sub-model C
IA
IA IA
IT[6] IT[7] IT[8] IT[9] IT[10] IT[11]
IT[0] IT[1] IT[2] IT[3] IT[4] IT[5]
PDN PDN PDN
IT[20] IT[21] IT[22] IT[23] IT[24] IT[25] IT[26] IT[27]
IT[12] IT[13] IT[14] IT[15] IT[16] IT[17] IT[18] IT[19]
PDN of die excluding sub-models
IT[36] IT[37] IT[38] IT[39] IT[40] IT[41] IT[42] IT[43]
IT[28] IT[29] IT[30] IT[31] IT[32] IT[33] IT[34] IT[35]
PDN of die package
ET[0] ET[1]
ET[4] ET[5] ET[8] ET[9]
ET[2] ET[3]
ET[6] ET[7]
ET[10] ET[11]
ET[14] ET[15]
ET[18] ET[19]
ET[12] ET[13]
ET[16] ET[17]
PDN of PCB (out of the scope)
IEC  1659/08
Figure 16 – Sub-model-based IC macro-model

62433-2 © IEC:2008(E) – 19 –
7 Requirements for parameter extraction
7.1 General
ICEM-CE model parameters can be extracted from either design information or measurements.
Detailed methodology for model parameter extractions are not the purpose of this standard.
This clause gives basic requirements for model parameter extractions from measurements.
NOTE Annex A gives examples of parameter extractions from design information and from measurements.
7.2 Environmental extraction constraints
The ICEM macro-model parameter extractions have to be performed under normal room
temperature conditions: 23 °C ± 5 °C. There are no additional requirements on air pressure
and humidity.
When open silicon is used, the lights shall be dimmed or switched off in order not to generate
photonic effects.
NOTE Some substrate materials are hydroscopic which might affect the permittivity of the material and its loss
tangent.
7.3 IA parameter extraction
IA can be derived by design data or by calculating by measurements under the following
conditions:
• Nominal power supply voltages and typical loadings shall be applied to the device under
test.
• Input signals such as specific test vector which correspond to the specific operational
mode shall be applied.
7.4 PDN parameter extraction
The PDN parameters shall be derived by analyzing impedances between the terminals under
the nominal power supplies.
The derived parameters are only suited and re-useable for conducted emission simulations
when the PVT (process, voltage and temperature) conditions are the same.
NOTE 1 PDN is static, but due to the N-well and gate-oxide capacitances that are involved, the power supply
voltage will affect it.
NOTE 2 Most of the impedance parameters can be derived from measurements using an impedance analyzer of
S-parameter VNA (Vector Network Analyser)
7.5 IBC parameter extraction
The IBC impedance can be derived from the Vdd to Vss impedance by subtracting the
impedance part that belongs to the PDN. A detailed method should be elaborated in future.

– 20 – 62433-2 © IEC:2008(E)
Annex A
(informative)
Model parameter generation
A.1 Introduction
The purpose of this annex is to explain the methodologies used to extract the components.
Three different ways are possible:
• Default parameters can be used when no other data is available.
• Parameters derived from parasitic element extractor tools, which can be used at the
design phase of the IC and/or 3D electromagnetic field simulator.
• Parameters derived from measurements when the IC is already available.
A.2 Default structure and values
A.2.1 General
The PDN and IA components can be obtained using technological data coming from the IC
and the packaging suppliers. The accuracy of default values is relatively low compared to
values obtained by measurements or design information.
A.2.2 IA parameters
The IA structure is shown in Figure 2. It is possible to quickly determine the IA component
using the technological data, which can be obtained from IC suppliers. Table A.1 shows
typical values of the parameters.
As an example, for 0,5 μm ASIC technology, cell density is around 7000. The probable
number of cells in 3×3 mm area is approximately 7,000 × 9 = 63 k gates. Considering that in
average 10 % of cells are switching simultaneously, the probable CPU current at each clock

edge is 63 k gates × 10 % × 0,75 mA = 4725 mA.
Table A.1 – Typical parameters for CMOS logic technologies
Technology Year Power Cell density Clock frequency Peak gate current Rise/Fall
CMOS supply   time
V /mm MHz mA/gate ns
1985 5 1500 4 to 50 1,1 0,7
1,2μm
1990 5 4000 4 to 90 0,9 0,5
0,8μm
1993 5 7000 8 to 120 0,75 0,3
0,5μm
1995 5 to 3,3 13000 16 to 300 0,6 0,2
0,35μm
1997 5 to 2,5 18000 40 to 450 0,4 0,12
0,25μm
1999 3,3 to 2,0 22000 100 to 900 0,3 0,1
0,18μm
0,12μm 2001 2,5 to 1,2 28500 150 to 1200 0,2 0,07
Table A.2 gives the default number of logic gates for typical microcontrollers.
As an example, a 16-bit RISC microcontroller is fabricated in 0,25μm technology. The
microcontroller has approximately 15000 gates. The probable CPU current at each clock edge

is 15000 × 10 % × 0,4 mA = 600 mA. The rise and fall time of the peak current is 0,12 ns.

SIST EN 62433-
...