EN 61760-3:2010

SLOVENSKI STANDARD
01-september-2010
Tehnologija površinske montaže - 3. del: Standardne metode za specifikacijo
komponent za spajkanje "Through Hole Reflow" (THR) (IEC 61760-3:2010)
Surface mounting technology - Part 3: Standard method for the specification of
components for Through Hole Reflow (THR) soldering (IEC 61760-3:2010)
Oberflächenmontagetechnik - Teil 3: Genormtes Verfahren zur Spezifizierung von
Durchsteckmontage-Bauelementen für das Aufschmelzlöten (THR) (IEC 61760-3:2010)
Technique du montage en surface - Partie 3: Méthode normalisée relative à la
spécification des composants pour le brasage par refusion à trous traversants (THR,
Through Hole Reflow) (CEI 61760-3:2010)
Ta slovenski standard je istoveten z: EN 61760-3:2010
ICS:
31.020 Elektronske komponente na Electronic components in
splošno general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD
EN 61760-3
NORME EUROPÉENNE
April 2010
EUROPÄISCHE NORM
ICS 31.190
English version
Surface mounting technology -
Part 3: Standard method for the specification of components
for Through Hole Reflow (THR) soldering
(IEC 61760-3:2010)
Technique du montage en surface -  Oberflächenmontagetechnik -
Partie 3: Méthode normalisée relative Teil 3: Genormtes Verfahren
à la spécification des composants pour zur Spezifizierung
le brasage par refusion à trous traversants von Durchsteckmontage-Bauelementen
(THR, Through Hole Reflow) für das Aufschmelzlöten (THR)
(CEI 61760-3:2010) (IEC 61760-3:2010)

This European Standard was approved by CENELEC on 2010-04-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels

© 2010 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61760-3:2010 E
Foreword
The text of document 91/856/CDV, future edition 1 of IEC 61760-3, prepared by IEC TC 91, Electronics
assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC
as EN 61760-3 on 2010-04-01.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent
rights.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
(dop) 2011-01-01
national standard or by endorsement
– latest date by which the national standards conflicting
(dow) 2013-04-01
with the EN have to be withdrawn
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 61760-3:2010 was approved by CENELEC as a European
Standard without any modification.
__________
- 3 - EN 61760-3:2010
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year

IEC 60062 - Marking codes for resistors and capacitors EN 60062 -

IEC 60068 Series Environmental testing EN 60068 Series

IEC 60068-2-20 - Environmental testing - EN 60068-2-20 -
Part 2-20: Tests - Test T: Test methods for
solderability and resistance to soldering heat
of devices with leads
IEC 60068-2-21 - Environmental testing - EN 60068-2-21 -
Part 2-21: Tests - Test U: Robustness of
terminations and integral mounting devices

IEC 60068-2-45 1980 Environmental testing - EN 60068-2-45 1992
+ A1 1993 Part 2: Tests - Test Xa and guidance: + A1 1993
Immersion in cleaning solvents

IEC 60068-2-58 - Environmental testing - EN 60068-2-58 -
Part 2-58: Tests - Test Td: Test methods for
solderability, resistance to dissolution of
metallization and to soldering heat of surface
mounting devices (SMD)
IEC 60068-2-77 - Environmental testing - EN 60068-2-77 -
Part 2-77: Tests - Test 77: Body strength and
impact shock
IEC 60068-2-82 - Environmental testing - EN 60068-2-82 -
Part 2-82: Tests - Test XW1: Whisker test
methods for electronic and electric
components
IEC 60194 - Printed board design, manufacture and EN 60194 -
assembly - Terms and definitions

IEC 60286 Series Packaging of components for automatic EN 60286 Series
handling
IEC 60286-3 - Packaging of components for automatic EN 60286-3 -
handling -
Part 3: Packaging of surface mount
components on continuous tapes

IEC 60286-4 - Packaging of components for automatic EN 60286-4 -
handling -
Part 4: Stick magazines for electronic
components encapsulated in packages of
form E and G
Publication Year Title EN/HD Year

IEC 60286-5 - Packaging of components for automatic EN 60286-5 -
handling -
Part 5: Matrix trays
IEC 60749-20 - Semiconductor devices - Mechanical and EN 60749-20 -
climatic test methods -
Part 20: Resistance of plastic encapsulated
SMDs to the combined effect of moisture and
soldering heat
IEC 61760-2 - Surface mounting technology - EN 61760-2 -
Part 2: Transportation and storage conditions
of surface mounting devices (SMD) -
Application guide
IEC 62090 - Product package labels for electronic EN 62090 -
components using bar code and two-
dimensional symbologies
ISO 8601 - Data elements and interchange formats - - -
Information interchange - Representation of
dates and times
IEC 61760-3 ®
Edition 1.0 2010-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Surface mounting technology –
Part 3: Standard method for the specification of components for through hole
reflow (THR) soldering
Technique du montage en surface –
Partie 3: Méthode normalisée relative à la spécification des composants pour
le brasage par refusion à trous traversants (THR, Through Hole Reflow)

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
S
CODE PRIX
ICS 31.190 ISBN 2-8318-1083-9
– 2 – 61760-3 © IEC:2010
CONTENTS
FOREWORD.4
1 Scope and object.6
2 Normative references .6
3 Terms and definitions .7
4 Requirements to component design and component specifications .8
4.1 General requirement .8
4.2 Packaging .8
4.3 Labelling of product packaging .9
4.4 Component marking .9
4.5 Storage and transportation .10
4.6 Component outline and design .10
4.6.1 Drawing and specification.10
4.6.2 Pick-up area requirements.10
4.6.3 Bottom surface requirements .10
4.6.4 Requirements to terminals.10
4.6.5 Component height .14
4.6.6 Component weight.14
4.7 Mechanical stress .14
4.8 Component reliability.14
4.9 Additional requirements for compatibility with lead-free soldering .15
5 Specification of assembly process conditions .15
5.1 Mounting by soldering .15
5.2 Reflow soldering methods (recommended) .16
5.2.1 Vapour phase reflow soldering.16
5.2.2 Forced air convection reflow soldering.16
5.3 Cleaning (where applicable) .17
5.3.1 General .17
5.3.2 Fluid .17
5.3.3 Ultrasonic cleaning .17
5.3.4 Vapour .17
5.3.5 Spray.17
5.3.6 Plasma cleaning .17
5.4 Removal and/or replacement.17
5.4.1 Removal and/or replacement of soldered components .17
6 Typical process conditions.18
6.1 Printing of solder paste .18
6.2 Component insertion .18
6.3 Soldering processes, temperature/time profiles .18
6.3.1 Vapour phase soldering.19
6.3.2 Forced gas convection reflow soldering .20
6.4 Typical cleaning conditions for assemblies .21
6.5 Inspection of solder joints.21
7 Requirements for components and component specifications for THR  soldering
processes.21
7.1 General .21
7.2 Wettability .21

61760-3 © IEC:2010 – 3 –
7.3 Dewetting .22
7.4 Resistance to soldering heat .22
7.5 Resistance to cleaning solvent .22
7.5.1 Solvent resistance of component .22
7.5.2 Solvent resistance of marking.22
7.6 Soldering profiles .22
7.7 Moisture sensitivity level (MSL) .22

Figure 1 – Example of a component with marked specific orientation put in tape and tray.9
Figure 2 – Example of components in a tape.9
Figure 3 – Examples for clearances (stand-off) .10
Figure 4 – Examples for terminal shapes and position tolerances .12
Figure 5 – Schematic example of contrast of bottom surface – terminals underneath
component body .13
Figure 6 – Schematic example of contrast of bottom surface – terminals outside
component body .13
Figure 7 – Component weight / pipette suction strength .14
Figure 8 – Process steps for soldering .15
Figure 9 – Examples for printing of solder paste .18
Figure 10 – SnPb Vapour phase soldering – temperature/time profile (terminal
temperature) .19
Figure 11 – Lead-free SnAgCu Vapour phase soldering – temperature/time profile
(terminal temperature) .19
Figure 12 – Forced gas convection reflow soldering – temperature/time profile for
SnPb solders .20
Figure 13 – Forced gas convection reflow soldering – temperature/time profile for lead-
free SnAgCu solders.20

Table 1 – Basic cleaning processes .21

– 4 – 61760-3 © IEC:2010
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SURFACE MOUNTING TECHNOLOGY –
Part 3: Standard method for the specification of
components for through hole reflow (THR) soldering

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61760-3 has been prepared by IEC technical committee 91:
Electronics assembly technology.
The text of this standard is based on the following documents:
CDV Report on voting
91/856/CDV 91/898/RVC
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts of the IEC 61760 series, under the general title Surface mounting technology
can be found on the IEC website.

61760-3 © IEC:2010 – 5 –
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
– 6 – 61760-3 © IEC:2010
SURFACE MOUNTING TECHNOLOGY –
Part 3: Standard method for the specification of
components for through hole reflow (THR) soldering

1 Scope and object
This part of IEC 61760 gives a reference set of requirements, process conditions and related
test conditions to be used when compiling specifications of electronic components that are
intended for usage in through hole reflow soldering technology.
The object of this standard is to ensure that components with leads intended for through hole
reflow and surface mounting components can be subjected to the same placement and
mounting processes. Hereto, this standard defines test and requirements that need to be part
of any component generic, sectional or detail specification, when through hole reflow
soldering is intended. Further this standard provides component users and manufacturers with
a reference set of typical process conditions used in through hole reflow soldering technology.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60062, Marking codes for resistors and capacitors
IEC 60068 (all parts), Environmental testing
IEC 60068-2-20, Environmental testing – Part 2-20: Tests – Test T: Test methods for
solderability and resistance to soldering heat of devices with leads
IEC 60068-2-21, Environmental testing – Part 2-21: Tests – Test U: Robustness of
terminations and integral mounting devices
IEC 60068-2-45:1980, Basic environmental testing procedures – Part 2-45: Tests – Test XA
and guidance: Immersion in cleaning solvents
Amendment 1:1993
IEC 60068-2-58, Environmental testing – Part 2-58: Tests – Test Td: Test methods for
solderability resistance to dissolution of metallization and to soldering heat of surface
mounting devices (SMD)
IEC 60068-2-77, Environmental testing – Part 2-77: Tests – Body strength and impact shock
IEC 60068-2-82, Environmental testing – Part 2-82: Tests – Test XW : Whisker test methods
for electronic and electric components
IEC 60194, Printed board design, manufacture and assembly – Terms and definitions
IEC 60286 (all parts), Packaging of components for automatic handling

61760-3 © IEC:2010 – 7 –
IEC 60286-3, Packaging of components for automatic handling – Part 3: Packaging of surface
mount components on continuous tapes
IEC 60286-4, Packaging of components for automatic handling – Part 4: Stick magazines for
electronic components encapsulated in packages of form E and G
IEC 60286-5, Packaging of components for automatic handling – Part 5: Matrix trays
IEC 60749-20, Semiconductor devices – Mechanical and climatic test methods – Part 20:
Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering
heat
IEC 61760-2, Surface mounting technology – Part 2: Transportation and storage conditions of
surface mounting devices (SMD) – Application guide
IEC 62090, Product package labels for electronic components using bar code and two-
dimensional symbologies
ISO 8601, Data elements and interchange formats – Information interchange –
Representation of dates and times
3 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 60194 and the
following apply.
3.1
terminal pitch
distance between the terminals of the component, either uniformly distributed or specifically
defined
3.2
dewetting
condition that results when molten solder coats a surface and then recedes to leave
irregularly-shaped mounds of solder that are separated by areas that are covered with a thin
film of solder and with the basis metal not exposed
3.3
dissolution of metallization
process of dissolving metal or a plated metal alloy, usually by introduction of chemicals
NOTE For the purpose of this document standard, the dissolution of metallization also includes dissolution by
exposure to molten solder.
3.4
pick-up force
dynamic force exerted on the body of a component – generally from above – and its seating
plane during the pick-up of the component (e.g. from a tape or tray)
NOTE The maximum level is normally taken into account.
3.5
placement force
dynamic force exerted on the component body – generally from above – and its seating plane
occurring during the period between the component’s first contact with the substrate (or the
soldering paste or adhesive, etc.) and its coming to rest
NOTE The maximum level is normally taken into account.

– 8 – 61760-3 © IEC:2010
3.6
resistance to soldering heat
ability of a component to withstand the effects of the heat generated by the soldering process
3.7
seating plane
surface on which a component rests
3.8
...