prEN ISO 11553-2

SLOVENSKI STANDARD
01-marec-2025
Nadomešča:
SIST EN ISO 11553-2:2009
Varnost strojev - Laserski obdelovalni stroji - 2. del: Varnostne zahteve za ročne
ali ročno upravljane laserske obdelovalne naprave (ISO/DIS 11553-2:2025)
Safety of machinery - Laser processing machines - Part 2: Safety requirements for hand-
held or hand-operated laser processing machines (ISO/DIS 11553-2:2025)
Sicherheit von Maschinen - Laserbearbeitungsmaschinen - Teil 2:
Sicherheitsanforderungen an handgeführte Laserbearbeitungsgeräte (ISO 11553-2:20xx)
Sécurité des machines - Machines à laser - Partie 2: Exigences de sécurité pour
machines de traitement laser portatives ou à commande manuelle (ISO/DIS 11553-
2:2025)
Ta slovenski standard je istoveten z: prEN ISO 11553-2
ICS:
13.110 Varnost strojev Safety of machinery
31.260 Optoelektronika, laserska Optoelectronics. Laser
oprema equipment
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

DRAFT
International
Standard
ISO/DIS 11553-2
ISO/TC 172/SC 9
Safety of machinery — Laser
Secretariat: DIN
processing machines —
Voting begins on:
Part 2: 2025-01-14
Safety requirements for hand-held
Voting terminates on:
2025-04-08
or hand-operated laser processing
machines
Sécurité des machines — Machines à laser —
Partie 2: Exigences de sécurité pour machines de traitement laser
portatives ou à commande manuelle
ICS: 31.260; 13.110
THIS DOCUMENT IS A DRAFT CIRCULATED
FOR COMMENTS AND APPROVAL. IT
IS THEREFORE SUBJECT TO CHANGE
Member bodies are requested to consult relevant national interests in IEC/TC AND MAY NOT BE REFERRED TO AS AN
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76 before casting their ballot to the e-Balloting application.
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Reference number
ISO/DIS 11553-2:2025(en)
DRAFT
ISO/DIS 11553-2:2025(en)
International
Standard
ISO/DIS 11553-2
ISO/TC 172/SC 9
Safety of machinery — Laser
Secretariat: DIN
processing machines —
Voting begins on:
Part 2:
Safety requirements for hand-held
Voting terminates on:
or hand-operated laser processing
machines
Sécurité des machines — Machines à laser —
Partie 2: Exigences de sécurité pour machines de traitement laser
portatives ou à commande manuelle
ICS: 31.260; 13.110
THIS DOCUMENT IS A DRAFT CIRCULATED
FOR COMMENTS AND APPROVAL. IT
IS THEREFORE SUBJECT TO CHANGE
Member bodies are requested to consult relevant national interests in IEC/TC AND MAY NOT BE REFERRED TO AS AN
INTERNATIONAL STANDARD UNTIL
76 before casting their ballot to the e-Balloting application.
PUBLISHED AS SUCH.
IN ADDITION TO THEIR EVALUATION AS
This document is circulated as received from the committee secretariat.
BEING ACCEPTABLE FOR INDUSTRIAL,
© ISO 2025
TECHNOLOGICAL, COMMERCIAL AND
USER PURPOSES, DRAFT INTERNATIONAL
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Published in Switzerland Reference number
ISO/DIS 11553-2:2025(en)
ii
ISO/DIS 11553-2:2025(en)
Contents Page
Foreword .vi
Introduction .vii
1 Scope . 1
2 Normative references . 2
3 Terms and definitions . 3
4 Risk assessment . 7
4.1 General .7
4.1.1 Types of HLM and special hazards .8
4.1.2 Special hazards with regard to types of HLM .8
4.2 Determination of limits of HLM .9
4.3 Hazards identification .10
4.4 Risk estimation .10
4.5 Risk evaluation .10
4.6 Hazards (significant) .10
4.6.1 Mechanical Hazards .11
4.6.2 Electrical Hazards .11
4.6.3 Thermal Hazards .11
4.6.4 Hazards by incoherent radiation . 12
4.6.5 Hazards by laser radiation . 12
4.6.6 Hazards associated with materials and substances . 15
4.6.7 Hazards by disregarding ergonomic principles .17
4.6.8 Hazards due to malfunction of the control system .18
4.6.9 Hazards due to third parties (persons) . 20
4.6.10 Hazards caused by lack or inadequacy of visual or acoustic warning means . 22
4.6.11 Hazards associated with the environment . 23
5 Safety requirements and risk reduction measures .25
5.1 General . 25
5.2 Requirements related to Mechanical Hazards . 26
5.3 Requirements related to Electrical Hazards . 26
5.4 Requirements related to Thermal Hazards . 26
5.5 Requirements related to incoherent radiation .27
5.6 Requirements related to Hazards by laser radiation .27
5.6.1 General .27
5.6.2 Laser Classification . 29
5.6.3 Design to avoid hazardous laser emission out of HLM or components respectively . 29
5.6.4 Use of a movable and interlocking guard with or without guard locking . 29
5.6.5 Design to avoid laser emission for HLMs connected to an external laser assembly. 30
5.6.6 Design to avoid laser emission by beam delivery system. 30
5.6.7 Design to avoid laser emission by damage of fibre optical cable .31
5.6.8 Design to avoid laser emission by damage or malfunction of fibre connectors .31
5.6.9 Design to avoid laser hazards by misalignment of beam path .31
5.6.10 Design to avoid laser hazards by not properly working active beam guiding and
shaping elements .31
5.6.11 Design to avoid laser emission by not properly designed HLH housing .31
5.6.12 Design to avoid laser hazards by not properly working handing system (HLH)
, where elements of the HLH (e.g., optical elements, nozzles) can be changed to
enable different applications .32
5.6.13 Safety devices for scanning laser radiation (cleaning) .32
5.6.14 Design to avoid hazards by laser radiation caused by the handheld laser
processing head .32
5.6.15 Design to avoid hazards by laser radiation in cases where HLH elements can be
changed .32

iii
ISO/DIS 11553-2:2025(en)
5.6.16 Control for the contact or the intended distance between HLH aperture (nozzle)
and workpiece .32
5.6.17 Design to avoid an unintended release/start-up of laser radiation (in cases
when the HLH is positioned on a grounded table or workpiece (welding) . 33
5.6.18 Protective enclosure (workplace) . 33
5.7 Requirements related to Hazards related to materials and substances . 33
5.7.1 Protection against hazards generated by materials and substances . 33
5.8 Requirements related to Ergonomic hazards . 34
5.8.1 Design according to ergonomic principles . 34
5.8.2 Design of machinery to facilitate its handling . 35
5.8.3 Ergonomics in design of portable hand-held and/or hand guided machinery . 35
5.9 Requirements related to malfunction of control system. 36
5.9.1 General . 36
5.9.2 Common control devices used in HLMs . 36
5.9.3 Performance requirements . . 38
5.9.4 Electromagnetic compatibility requirements . 39
5.9.5 Emergency stop control . 39
5.9.6 Procedure plan for the initial start-up . . 40
5.9.7 Laser assembly is used for several HLMs . 40
5.9.8 Provisions and controls for isolation of the laser beam .41
5.9.9 Selection of temporary protective measures .41
5.10 Requirements related to Hazards from/to third persons .42
5.10.1 Authorizing control device .42
5.10.2 Requirement of training .42
5.11 Requirements related to hazards caused by lack or inadequacy of visual or acoustic
warning means .42
5.12 Requirements related Hazards associated with the environment .42
5.12.1 Lightning .42
5.12.2 Moisture .43
5.12.3 Pollution .43
5.12.4 Snow, rain, water, wind and extreme temperatures .43
6 Verification of safety requirements and measures .45
6.1 General .45
6.2 Methods for verification and validation .45
6.3 Required verification and validation . 48
6.4 Verification and Validation of protective devices . 48
6.5 Control category classification . 49
6.6 Laser classification . 49
7 Information for user.50
7.1 General . 50
7.2 Instruction handbook / Manual . 50
7.2.1 General . 50
7.2.2 Assembly and installation .51
7.2.3 Commissioning and operating .51
7.2.4 Use .52
7.2.5 Maintenance/Servicing . 54
7.2.6 Decommissioning . 54
7.2.7 Disposal . 55
7.2.8 System information . 55
7.2.9 Information how to act in emergency cases . 55
8 Labelling .56
8.1 Information to be indicated in labels . 56
8.2 Labels styles . . 56
Annex A (informative) Representative types of hand-held or hand-operated laser processing
machines (HLMs) .57
Annex B (informative) List of significant hazards .60

iv
ISO/DIS 11553-2:2025(en)
Annex C (informative) Possible hazards related to hand-held or hand operated laser processing
machines (HLMs) .63
Annex D (informative) Examples for the design of technical safety measures for hand-held or
hand-operated laser processing machines (HLMs) .65
Annex E (informative) Recommendations for the selection of personal protective equipment
for use with hand-held or hand-operated laser processing, machines (HLMs) .69
Annex F (informative) Design recommendations for laser fume extraction systems on process
nozzles .72
Annex G (informative) Parameter information for user by manufacturer related to laser
radiation with hand-held or hand-operated laser processing, machines (HLMs) .75
Annex ZA (informative) Relationship between this European Standard and the Essential
Requirements of Directive 2006/42/EC Aimed to be Covered .78
Bibliography .80

v
ISO/DIS 11553-2:2025(en)
Foreword
ISO (the International Organization for Standardization) is a worldwide federation of national standards
bodies (ISO member bodies). The work of preparing International Standards is normally carried out through
ISO technical committees. Each member body interested in a subject for which a technical committee
has been established has the right to be represented on that committee. International organizations,
governmental and non-governmental, in liaison with ISO, also take part in the work. ISO collaborates closely
with the International Electrotechnical Commission (IEC) on all matters of electrotechnical standardization.
The procedures used to develop this document and those intended for its further maintenance are described
in the ISO/IEC Directives, Part 1. In particular, the different approval criteria needed for the different types
of ISO documents should be noted. This document was drafted in accordance with the editorial rules of the
ISO/IEC Directives, Part 2 (see www.iso.org/directives).
ISO draws attention to the possibility that the implementation of this document may involve the use of (a)
patent(s). ISO takes no position concerning the evidence, validity or applicability of any claimed patent
rights in respect thereof. As of the date of publication of this document, ISO [had/had not] received notice of
(a) patent(s) which may be required to implement this document. However, implementers are cautioned that
this may not represent the latest information, which may be obtained from the patent database available at
www.iso.org/patents. ISO shall not be held responsible for identifying any or all such patent rights.
Any trade name used in this document is information given for the convenience of users and does not
constitute an endorsement.
For an explanation of the voluntary nature of standards, the meaning of ISO specific terms and expressions
related to conformity assessment, as well as information about ISO's adherence to the World Trade
Organization (WTO) principles in the Technical Barriers to Trade (TBT), see www.iso.org/iso/foreword.html.
This document was prepared by Technical Committee ISO/TC 172, Optics and photonics, Subcommittee
SC 9, Laser and electro-optical systems in collaboration with IEC/TC 76, Optical radiation safety and laser
equipment.
This second edition cancels and replaces the first edition (ISO/IEC 11553-2:2007), which has been technically
revised with the following main changes:
a) Several terms and definitions were modified or newly added;
b) the covered hazards as well as the requirements concerning the hazards were added in more detail;
c) Table 1 was newly added in Clause 6, and the previous Annex A was deleted;
d) Several subclause headings were modified and several technical requirements were amended;
e) Some of the lists were renumbered;
f) Previous Annex B was modified and was renumbered as the new Annex A;
g) New Annex B, Annex C and Annex D were added.
h) Annex E was modified;
i) new Annex F and Annex G were added.
A list of all parts in the ISO 11553 series can be found on the ISO website/IEC website.
Any feedback or questions on this document should be directed to the user’s national standards body. A
complete listing of these bodies can be found at www.iso.org/members.html.

vi
ISO/DIS 11553-2:2025(en)
Introduction
This document is a type-C standard as stated in ISO 12100:2010.
This document is of relevance particularly for the following stakeholder groups representing the market
players with regard to machinery safety:
a) hand-held or hand-operated laser processing machines (HLMs) manufacturers (small, medium and
large enterprises); including manufacturers of sub/part machines such as devices or devices assembly
related to laser radiation, as well as system integrators (small, medium, and large enterprises);
NOTE Devices or device assemblies are including but not limited to: guiding; shaping, delivery, protective,
locking, control, enabling, limiting, impeding, switching, exhaust, stop, loading/feeding, scanning and warning
devices.
b) health and safety bodies (regulators, accident prevention organizations, market surveillance, etc.).
Others can be affected by the level of machinery safety achieved with the means of the document by the
above-mentioned stakeholder groups:
c) machine users/employers (small, medium and large enterprises);
d) machine users/employees (e.g., trade unions, organizations for people with special needs);
e) service providers, e.g., for maintenance (small, medium and large enterprise);
f) consumers (in case of machinery intended for use by consumers).
g) bystanders
The above-mentioned stakeholder groups have been given the possibility to participate at the drafting
process of this document.
The machinery concerned and the extent to which hazards, hazardous situations or hazardous events are
covered are indicated in the Scope of this document.
When requirements of this type-C standard are different from those which are stated in type-A or type-B
standards, the requirements of this type-C standard take precedence over the requirements of the other
standards for machines that have been designed and built according to the requirements of this type-C
standard.
The purpose of this document is to prevent injures to persons:
h) by listing potential hazards generated by hand-held or hand-operated laser processing machines;
i) by describing the risk assessment procedure for all relevant hazards;
j) by specifying safety measures and verification procedures necessary for reducing the risk caused by
specific hazardous conditions;
k) by providing references to pertinent standards;
l) by specifying the information which is to be supplied to the user so that they can establish proper
procedures and precautions at the workplace.

vii
DRAFT International Standard ISO/DIS 11553-2:2025(en)
Safety of machinery — Laser processing machines —
Part 2:
Safety requirements for hand-held or hand-operated laser
processing machines
1 Scope
This document specifies the requirements for hand-held or hand-operated laser processing machines (HLM)
and their components as well as assemblies. HLM is the machine in which laser radiation is generated, where
the laser provides sufficient energy/power to cause a phase transition in a part of the workpiece and where
the laser output or workpiece to be processed is guided manually or hand-held during the laser process.
HLM includes the laser device, beam-guiding device (e.g., mirror, fibre, lenses), beam-shaping device (e.g.,
telescope, focusing), and controls. The laser assembly as an integral part of the HLM or only the laser
processing head is hand-held or hand-operated during the laser process.
This document does not apply:
— to laser processing machines which are remotely controlled by a manual controller (hand-operated
controller), such as joy sticks, keyboard, etc., without touching a workpiece or a part mechanically
connected with the laser processing head by using the hand(s) of the operator (user).
— to laser processing machines without a drive system which may not belong to machinery. And the laser
processing apparatus without moving parts, which may not be considered as machinery in “Type C
standard”.
NOTE “hand-operated laser processing machine” is synonymous with “hand-guided laser processing machine”
in this document. Hand-operated laser processing machines often use manual force reduction means such as wheels,
supports, etc., for manual positioning of the laser processing heads or the workpieces.
It is applicable to HLMs using laser radiation to process materials.
The purpose of this document is to draw attention to the hazards related to HLMs and to prevent personal
injury. Depending on the application and the location/operating conditions of HLMs, a number of different
significant hazards can arise. This document describes both the areas of hazards analysis and risk
assessment as well as protective measures.
Requirements dealing with noise as a hazard are covered by ISO 11553-3.
This document deals with the specific hazards resulting from laser radiation arising in HLMs, when they are
used as intended and under conditions of misuse which are reasonably foreseeable by the manufacturer.
This document does not apply to laser products or equipment manufactured solely or expressly for
applications which are excluded from the scope of ISO 11553-1:2020. This document is not applicable for
HLMs which have been manufactured before the date of publication of this standard.
HLMs include the following types:
a) HLMs which are designed as all in-one laser assembly including the beam delivery/forming(shaping)
system and optional features such as gas nozzles, material (e.g., powder, wire) feed system;

ISO/DIS 11553-2:2025(en)
b) HLMs where the relevant devices are connected by a beam guidance system (e.g., optical fibre) and
power/control cables to an external laser assembly device and which includes only the beam delivery/
forming(shaping) system and optional features such as gas nozzles, material (e.g., powder, wire) feed system;
c) laser processing machines where the workpiece is manually moved under/relative to the laser beam
(see informative Annex A).
The intended use of HLMs covers both:
d) movement of the laser processing head (beam shaping device) by hand to move laser beam(s) over or
relative to elements or workpieces to be processed, and
e) movement of elements or workpieces by hand to be processed under/relatively to stationary laser
beams as shielded.
Laser processing machines, where laser processing is performed with hand-held or hand-operated
workpieces outside the fixed (neither hand-held nor hand-operated by the operator or user) laser processing
machines are out of the scope of this document. Such a fixed laser processing machine is to be covered by
ISO 11553-1.
HLMs are intended for the industrial use and can be only operated by trained and authorized personnel in
indoor and/or outdoor environments/locations (e.g., cleaning of facades, statues).
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content constitutes
requirements of this document. For dated references, only the edition cited applies. For undated references,
the latest edition of the referenced document (including any amendments) applies.
ISO 3864 (all parts), Graphical symbols — Safety colours and safety signs — Part 1: Design principles for safety
signs and safety markings
ISO 6385:2016, Ergonomics principles in the design of work systems
ISO 11145:2018, Optics and photonics — Lasers and laser-related equipment — Vocabulary and symbols
ISO/IEC 11553-1:2020, Safety of machinery — Laser processing machines — Part 1: General safety requirements
ISO/IEC 11553-3:2013, Safety of machinery — Laser processing machines - Part 3: Noise reduction and noise
measurement methods for laser processing machines and hand-held processing devices and associated auxiliary
equipment (accuracy grade 2)
ISO 12100:2010, Safety of machinery — General principles for design — Risk assessment and risk reduction
ISO 13732-1:2006, Ergonomics of the thermal environment — Methods for the assessment of human responses
to contact with surfaces — Part 1: Hot surfaces
ISO 13849-1:2023, Safety of machinery — Safety-related parts of control systems — Part 1: General principles
for design
ISO 13850:2015, Safety of machinery — Emergency stop function — Principles for design
ISO 13857:2019, Safety of machinery — Safety distances to prevent hazard zones being reached by upper and
lower limbs
ISO 14118:2017, Safety of machinery — Prevention of unexpected start-up
ISO 14119:2024, Safety of machinery — Interlocking devices associated with guards — Principles for design and
selection
ISO 14120:2015, Safety of machinery — Guards — General requirements for the design and construction of fixed
and movable guards
ISO/DIS 11553-2:2025(en)
ISO 20607:2019, Safety of machinery — Instruction handbook — General drafting principles
ISO 26800:2011, Ergonomics — General approach, principles and concepts
IEC 60204-1:2016, Safety of machinery — Electrical equipment of machines — Part 1: General requirements
IEC 60364 (series), Low-voltage electrical installations
IEC 60364-7-704:2017, Low-voltage electrical installations - Part 7-704: Requirements for special installations
or locations - Construction and demolition site installations
IEC 60529:1989+AMD1:1999, CSV, Degrees of protection provided by enclosures (IP Code)
IEC 60825-1:2014, Safety of laser products — Part 1: Equipment classification and requirements
IEC 60825-4:2020, Safety of laser products — Part 4: Laser guards
IEC 61000-6-2:2016, Electromagnetic compatibility (EMC) - Part 6-2: Generic standards - Immunity standard
for industrial environments
IEC 61000-6-3:2020, Electromagnetic compatibility (EMC) - Part 6-3: Generic standards - Emission standard for
equipment in residential environments
IEC 61000-6-4:2018, Electromagnetic compatibility (EMC) - Part 6-4: Generic standards - Emission standard
for industrial environments
IEC 61000-6-7:2014, Electromagnetic compatibility (EMC) - Part 6-7: Generic standards - Immunity requirements
for equipment intended to perform functions in a safety-related system (functional safety) in industrial locations
IEC 62061:2021, Safety of machinery — Functional safety of safety-related control systems
EN 379:2003+A1:2009, Personal eye-protection - Automatic welding filters
3 Terms and definitions
For the purposes of this document, the terms and definitions given in in ISO 11145, ISO 11553-1, ISO 12100,
IEC 60825-1, IEC 60825-4 and the following apply.
ISO and IEC maintain terminology databases for use in standardization at the following addresses:
— ISO Online browsing platform: available at https:// www .iso .org/ obp
— IEC Electropedia: available at https:// www .electropedia .org/
3.1
confined space
working area surrounded on all sides, or for the most part, by solid walls where they, on account of their
confinement or containment of materials, preparation or equipment, augment or can augment particular
hazards that considerably exceed the hazard potential normally prevailing at workplaces
3.2
disposal unit
equipment that captures and removes effluents and/or chemical pollutants (e.g., fumes, gases) and/or by
products during laser material processing passing these on for filtration
EXAMPLE Capture devices, pipes, filtration systems, ventilation systems.

ISO/DIS 11553-2:2025(en)
3.3
hazard area
danger zone
any space within and/or around machinery in which a person can be exposed to a hazard
Note 1 to entry: There may be several hazard areas (danger zones) on the same workplace depending on the types of
hazards and relevant safety control measures against the hazards.
Note 2 to entry: For “laser hazard area”, see 3.6.
Note 3 to entry: Hazard area (danger zone) is not synonymous to “laser hazard area” and “nominal ocular hazard area
(NOHA)”.
[SOURCE: ISO 12100:2010, 3.11, modified, Note 1 to entry, Note 2 to entry and Note 3 to entry added]
3.4
hand-held or hand operated laser processing machine
HLM
machine in which laser radiation is generated, together with essential additional facilities (e.g., cooling,
power and gas supply) that are necessary to operate the laser, where the laser provides sufficient energy/
power to melt, evaporate or cause a phase transition in a part of the workpiece and where the laser beam or
workpiece to be processed is guided manually or hand-held during the laser process
Note 1 to entry: The HLM is synonymous with “laser unit”, see, 3.10.
Note 2 to entry: Generally, HLM can be divided in two representative types (Type 1 and Type 2) (see Annex A):
— Type 1:  Machine equipped with a fixed laser assembly, where the workpiece is manually guided or manually
positioned relative to the laser processing head (beam shaping device),
— Type 2:  Machines equipped with a hand-held or hand-guided laser head (HLH) where the laser processing head is
connected to a remotely located (i.e. external) laser device via a beam delivery system (e.g. fibre optical cable) or
where the laser source is integral part of the hand-held device.
3.5
hand-held or hand-guided laser head (HLH)
component, which is hand-held or hand guided and contains the laser output/aperture
Note 1 to entry: The HLH can be equipped via an optical fibre with an external laser source or contain the laser system
itself, which can be positioned or guided on the work piece surface or in a certain distance to the workpiece. Usually
HLM comprises a housing/enclosure with optical elements for beam guidance and shaping, the operating elements,
controls and indication elements (e.g., warning LED).
Note 2 to entry: The HLH can further comprise nozzle, feeder (gas/wire/powder), feed drive support, sensors/controls
for contact or distance to workpiece, capturing device for fume and gas emissions.
Note 3 to entry: Depending on the equipment, the HLH can also be connected with feeding devices for wire, gas,
cooling water, etc.
3.6
laser hazard area
area in which the laser radiation exposure of the eye and/or the skin exceeds the respective maximum
permissible exposure values (MPEs), including the possibility of accidental misdirection of the laser beam
Note 1 to entry: To avoid ambiguities, information whether the laser hazard area is based on the eye or the skin MPEs
should be added.
Note 2 to entry: See 3.11 for nominal ocular hazard area.
[SOURCE: IEC 60825-1:2014, 3.47, modified, Note 2 to entry added]

ISO/DIS 11553-2:2025(en)
3.7
laser system
laser in combination with an appropriate laser energy source with or without additional incorporated
components
[SOURCE: IEC 60825-1:2014, 3.51]
Note 1 to entry: See Figure 1.
3.8
laser assembly
laser system together with specific, normally optical, mechanical and/or electrical system components for
beam handling and forming
[SOURCE: ISO 11145:2018, 3.19.7, modified, “laser device” replaced by “laser system”, included “normally”
and changed “beam guiding and beam shaping” to “beam handling and forming”]
Note 1 to entry: See Figure 1.
3.9
laser device
laser where the radiation is generated, together with essential additional facilities (e.g., cooling, power and
gas supply) that are necessary to operate the laser
[SOURCE: ISO 11145:2018, 3.19.6, modified]
Note 1 to entry: See Figure 1.
3.10
laser unit
one or more laser assemblies together with handling units, measurement systems and control systems
...