SIST EN 61249-5-1:2001

Overview

EN 61249-5-1:1996 (adopted as SIST EN 61249-5-1:2001) is a European sectional specification for copper foils used in the manufacture of copper-clad base materials for printed circuit boards (PCBs). Issued under CLC, this standard defines the required properties and characteristics of conductive copper foils and films - with or without coatings - intended for copper-clad laminated sheets and flexible copper-clad materials.

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Key Topics

The standard focuses on technical requirements and classification rather than prescribing manufacturing methods. Main topics covered include:

• Scope and application - intended use for manufacture of copper-clad laminates and flexible copper-clad materials for printed boards.
• Material classification - types of copper foil (e.g., treatment, coated vs uncoated, rolled vs electrolytic) and appropriate designations.
• Physical and mechanical properties - general categories such as foil thickness, tensile strength, elongation and dimensional tolerances.
• Electrical properties - electrical conductivity and related considerations important for PCB performance.
• Surface quality and treatments - surface finish, roughness and any pre-treatment or adhesion-promoting coatings relevant to lamination and bonding.
• Adhesion and compatibility - requirements that affect bonding to dielectric substrates in copper-clad laminates.
• Testing and inspection - sampling, test methods and acceptance criteria for verifying conformity to the specification.
• Marking and documentation - product identification, delivery documentation and traceability expectations.

(Exact numerical values, specific test procedures and pass/fail limits are specified in the published standard document and are not reproduced here.)

Applications

EN 61249-5-1 is directly applicable to:

• PCB manufacturers specifying copper foil inputs for rigid and flexible printed boards.
• Copper foil suppliers and converters used to certify product conformity for copper-clad base materials.
• Laminators and base-material producers who combine foil with dielectric substrates to make copper-clad laminates (CCLs).
• Quality engineers and procurement teams responsible for material specifications, incoming inspection and supplier compliance.

Using this standard helps ensure consistent electrical performance, mechanical reliability and reliable adhesion between copper foil and substrate - critical for high-volume PCB production and quality assurance.

Related standards

• EN/IEC 61249 series (materials for interconnection structures)
• National adoptions (e.g., SIST EN 61249-5-1:2001)

For exact technical limits, test methods and product classifications, consult the full EN 61249-5-1 standard document from the issuing body.