TESTING Standards Summary – May 2025: Focus on Inkjet First Drop Measurement

Looking back at May 2025, the Testing sector—particularly as it relates to printed electronics—witnessed a notable advancement in standardization with the publication of IEC 62899-302-6:2025. This single, yet significant, standard is shaping the methodology for assessing inkjet first drop performance—a critical aspect that affects quality, consistency, and yield in additive manufacturing based on printed electronics.

With only one crucial standard issued in this period, industry professionals, quality managers, compliance officers, and engineers will find this monthly review valuable for staying current, understanding evolving best practices, and benchmarking against international requirements.

Monthly Overview: May 2025

May 2025's standardization activity in Testing focused intently on the intersection of manufacturing process quality and advanced measurement methodologies in printed electronics. Unlike months with broader outputs across multiple Testing subfields, May's publication activity was concentrated but highly relevant to organizations leveraging drop-on-demand inkjet technology for electronics fabrication.

This pattern reflects a maturing trend: as printed electronics processes scale and diversify, robust, internationally harmonized measurement standards become essential for process control, yield optimization, and regulatory compliance. The standard published this month is a step toward addressing a previously under-standardized but operationally significant process parameter—first drop performance in inkjet printing.

Organizations in printed electronics, particularly those innovating with fine-pattern deposition, will find May’s developments tightly aligned with their operational challenges and quality objectives.

Standards Published This Month

IEC 62899-302-6:2025 – Printed Electronics – Equipment – Inkjet – First Drop Measurement

Printed electronics – Part 302-6: Equipment – Inkjet – First drop measurement

This standard, published by the International Electrotechnical Commission (IEC) on May 9, 2025, defines a comprehensive methodology for determining inkjet first drop behavior within the realm of printed electronics. Its scope is clearly delineated: applicable solely to drop-on-demand inkjet types (including both piezo and thermal inkjet heads), while explicitly excluding continuous inkjet systems and non-electronic printing applications.

At the heart of the document is an effort to standardize how manufacturers observe and quantify variations in jetting speed and behaviors (such as non-jetting or low jetting speed) for the first few droplets emitted after a printhead idle or pause period. As misbehavior of early drops is a well-known source of printing defects and yield reduction in high-precision printed electronics, this standard directly targets an acute and costly production risk.

Key Content and Requirements:

• Defines standardized methods for first drop measurements using either:
  • Printed pattern analysis on standardized substrates
  • Imaging-based methods with high-speed or CCD cameras
• Specifies essential procedures for instrument setup, data acquisition, and analysis
• Details requirements for test equipment, including synchronization of triggers between jetting action and data capture
• Delineates parameters for jetting frequency, pause time, measurement region, and substrate preparation
• Provides analysis protocols for evaluating jetting speed variation, identifying non-jetting, low-speed drops, and analyzing the transition between idle-to-steady jetting states
• Contextualizes findings for process development, ink formulation improvements, and preventive maintenance planning

Who Should Comply:

• Organizations developing, manufacturing, or quality-assuring printed electronic devices using drop-on-demand inkjet technology
• Process and equipment engineers in R&D or production environments
• Quality assurance and compliance specialists working under regulated or certified manufacturing environments in electronics
• Ink and substrate suppliers seeking to validate or optimize their materials for first drop reliability

Regulatory and Industry Context: IEC 62899-302-6:2025 is part of the broader IEC 62899 series, which establishes an international benchmark for printed electronics. Its establishment fills a critical gap by introducing methods that not only address first drop evaluation (a previously non-standardized operational risk) but also set best practice for integrating testing into process validation cycles. Adoption signals compliance with internationally harmonized expectations and positions organizations to meet increasing requirements for traceability and process control in electronic manufacturing.

Notable Features:

• Multi-method, technology-neutral approach (printed pattern analysis, high-speed imaging, low-frame-rate imaging)
• Focus on drop-on-demand inkjet, addressing the nuances of piezo and thermal head mechanisms
• Practical applicability for both laboratory R&D and industrial production settings
• Emphasis on documentation and repeatability in testing procedures, enabling benchmarking and process improvement
• Guidance for linking test results to corrective actions, such as maintenance or process tuning

Access the full standard:View IEC 62899-302-6:2025 on iTeh Standards

Common Themes and Industry Trends

The single standard published this month underscores two persistent, interconnected trends in the Testing sector:

1. Precision Process Control in Advanced Manufacturing:

   • As printed electronics mature from lab-scale to industrial throughput, ensuring process repeatability and minimizing yield losses tied to equipment behavior is increasingly vital.
   • The focus on first drop measurement reflects industry concern for transient operational states that directly impact end-product quality—especially as devices shrink in size and increase in complexity.

2. Methodological Rigour and Flexibility:

   • Incorporation of multiple, practically accessible measurement pathways (imaging, print-based analysis) signals a drive for methodological inclusivity but within a framework of scientific rigor and documentation
   • Standards like IEC 62899-302-6:2025 highlight the community’s expectation that manufacturers not only perform tests but understand and document how and why variations arise, enabling continual improvement.

There is also a clear drive to close standardization gaps in specialized, high-risk process steps that historically fell under disparate, often in-house protocols.

Compliance and Implementation Considerations

For organizations impacted by IEC 62899-302-6:2025, the immediate priorities for implementation include:

• Gap Assessment:

  • Review existing inkjet process validation protocols
  • Compare current first drop testing methods against IEC requirements and definitions

• Method Selection and Documentation:

  • Select the most suitable test method (printed pattern or imaging-based), taking into account practical constraints, available equipment, and required sensitivity
  • Establish or update internal standard operating procedures (SOPs) for first drop testing, ensuring traceability and repeatability

• Training and Knowledge Transfer:

  • Train process engineers and technicians in new measurement and analysis methods, ensuring alignment with the IEC framework

• Timeline and Certification:

  • Given that the standard is now in effect, organizations should plan prompt implementation, factoring in any customer or regulatory expectations for compliance
  • For suppliers seeking to qualify as trusted partners to major OEMs, rapid adoption can be a market differentiator

• Resource Utilization:

  • Leverage resources such as the full text available via iTeh Standards, as well as technical annexes and the broader IEC 62899 series, for in-depth guidance

Conclusion: Key Takeaways from May 2025

May 2025’s contribution to Testing sector standards was focused but consequential—IEC 62899-302-6:2025 addresses an industry-critical process risk with a globally harmonized methodology. For organizations involved in printed electronics, its adoption is vital for both product quality and regulatory posture.

Professionals in quality management, R&D, compliance, and manufacturing engineering should treat this standard as both an operational benchmark and a catalyst for process improvement initiatives. Staying abreast of such targeted, technical standards is central to maintaining competitive advantage and ensuring seamless compliance with evolving international expectations.

For a deeper dive into the standard and its practical implications, consult the resource directly: View IEC 62899-302-6:2025 on iTeh Standards

Explore the full Testing standards catalog and access comprehensive implementation guidance at iTeh Standards.