January 2026: New Electronics Standards Enhance Reliability and Quality (Part 2)

January 2026 sees the introduction of four important standards in the electronics sector, each engineered to improve product reliability, manufacturing quality, and safety compliance. These updates respond directly to evolving industry requirements, integrating new test methods, refined performance metrics, and expanded material usage. Electronics manufacturers and professionals across the value chain—from process engineers and quality managers to compliance teams—are advised to take note, as these standards collectively set a higher benchmark for device integrity, connection reliability, and long-term durability.

Overview / Introduction

The global electronics industry runs on the backbone of rigorous, internationally recognized standards. Norms for testing, measuring, and assembling electronic components ensure devices function reliably in diverse and demanding environments. In January 2026, four new standards were published that respond directly to the industry's calls for more precise mechanical and environmental testing, as well as enhanced guidance on connection technologies. In this article, you'll discover what these standards mean, key changes from earlier editions, and practical steps for seamless implementation.

Detailed Standards Coverage

EN IEC 60749-22-2:2026 - Bond Strength - Wire Bond Shear Test Methods

Semiconductor Devices - Mechanical and Climatic Test Methods - Part 22-2: Bond Strength - Wire Bond Shear Test Methods

EN IEC 60749-22-2:2026 delivers an updated framework for determining the strength of ball bond wire connections in semiconductor devices. Applicable to both pre- and post-encapsulation components, this standard defines procedures for destructive wire bond shear testing, focusing on thermosonic (ball) bonds with diameters from 15 µm to 76 µm. The procedure allows manufacturers to evaluate the integrity of the metallurgical bond, a key predictor of device reliability under mechanical and climatic stress. This revision aligns closely with advances in materials (notably copper), equipment precision, and method reproducibility. It is essential for qualification laboratories, production lines, and process developers in semiconductor fabrication.

Among its notable updates, this edition splits previous guidance into two parts—this document (shear test) and EN IEC 60749-22-1 (pull test)—clarifies requirements for bond geometry, introduces requirements specific to copper wires, and includes annexes on wedge bonds and challenging bond setups. The test remains a destructive method and serves for process control, quality assurance, and developmental testing.

Key highlights:

• Expanded to cover new materials (e.g., copper wire) and advanced bond geometries
• Requires precise measurement of bond diameters and shear test placement
• Detailed guidance for "stitch on ball" and "reverse bonding" configurations

Access the full standard:View EN IEC 60749-22-2:2026 on iTeh Standards

EN IEC 60749-7:2026 - Internal Moisture Content Measurement for Hermetic Devices

Semiconductor Devices - Mechanical and Climatic Test Methods - Part 7: Internal Moisture Content Measurement and the Analysis of Other Residual Gases

The revised EN IEC 60749-7:2026 is the definitive standard for testing the moisture and atmospheric gas composition within hermetically sealed semiconductor devices. Primarily used in applications demanding high reliability—such as aerospace, military, and mission-critical industrial systems—this standard employs advanced mass spectrometry to detect water vapour, helium, nitrogen, leak-test fluids, and other trace gases inside metal or ceramic packages. Key performance criteria focus on validating seal quality and long-term chemical stability, supporting robust failure analysis in the event of device degradation.

New in this edition are enhanced calibration protocols, improved alignment with MIL-STD-883 (Method 1018.10), and clearer guidance for interpreting gas profiles indicative of non-hermeticity or contamination. Testing is destructive, usually performed on qualification samples or returned failed units, and is critical for demonstrating compliance with strict customer or regulatory requirements.

Key highlights:

• Rigorous mass spectrometric analysis of gas atmosphere within sealed packages
• Enhanced calibration requirements ensure analytical accuracy and repeatability
• Detects both moisture content and evidence of package leaks or outgassing

Access the full standard:View EN IEC 60749-7:2026 on iTeh Standards

EN IEC 61076-2:2026 - Sectional Specification for Circular Connectors

Connectors for Electrical and Electronic Equipment - Product Requirements - Part 2: Sectional Specification for Circular Connectors

EN IEC 61076-2:2026 sets out the general product requirements and quality assessment measures for circular connectors—vital components in industrial automation, instrumentation, medical, and transportation applications. This standard ensures product interoperability, compatibility levels, and environmental resilience by detailing performance categories, dimensional interfacing, climatic range, current-carrying capacity, and safety parameters. The 2026 update adds significant new content on test scheduling and transmission characteristics, clarifies temperature derating and sealing, and aligns connector performance classes with contemporary system integration demands.

With its thorough approach to reliability, the standard supports consistent connector performance across a variety of harsh environments and supports both manufacturer quality systems and end-user approval processes.

Key highlights:

• Defines dimensional, electrical, and mechanical requirements for circular connectors
• Updated test schedules and compatibility/performance level clarification
• Enhanced transmission characteristic testing for next-generation systems

Access the full standard:View EN IEC 61076-2:2026 on iTeh Standards

IEC 60352-7:2026 - Solderless Spring Clamp Connections

Solderless Connections - Part 7: Spring Clamp Connections - General Requirements, Test Methods and Practical Guidance

IEC 60352-7:2026 establishes comprehensive generic requirements and testing procedures for spring clamp (screwless) electrical connections, as widely used in terminal blocks, control panels, and circuit assemblies. This revision introduces new definitions and expands coverage to connections that use "contact pressure via insulating material" (CoPI)—addressing reliability under thermal cycling, mechanical deflection, and vibration. Requirements span wire types (solid, stranded, flexible up to 10 mm²), material properties, surface finishes, and insulation. Two test schedules (basic and full) are provided based on compliance with the defined prerequisites.

New mechanical, electrical, and climatic tests require verification of contact resilience, current-carrying capacity, and resistance to shrinkage of plastics or yielding of insulation over time. Practical annexes cover best practices for wire preparation, tool selection, and troubleshooting connection quality.

Key highlights:

• Broadened application to new designs with contact pressure via insulation (CoPI)
• Called-out test groups for aging, vibration, repeated connections, and environmental cycling
• Comprehensive annexes for practical connection guidance

Access the full standard:View IEC 60352-7:2026 on iTeh Standards

Industry Impact & Compliance

The introduction of these four new electronics standards profoundly impacts component manufacturers, OEMs, and systems integrators who must align testing, design, and process controls to international best practices. Compliance delivers clear benefits: enhanced product reliability, minimized field failures, and improved customer satisfaction—especially for mission-critical and high-reliability markets like automotive electronics, IoT, aerospace, and medical devices.

Implementation of these standards involves updating QA and testing procedures, selecting compliant components, and creating supplier quality agreements that reference new requirements for bond integrity, moisture hermeticity, connector robustness, and contact sustainability. Non-compliance exposes organizations to risks including device recalls, loss of certifications, and diminished market trust.

Timelines for enforcing these standards vary by jurisdiction and sector but generally require adoption at the next product qualification cycle, or as stipulated in customer contracts. Early engagement with compliance teams, suppliers, and test laboratories is essential to avoid supply chain or certification bottlenecks.

Technical Insights

Across these standards, several technical requirements recur:

• Destructive mechanical and climatic testing of semiconductor bonds is now defined with greater specificity, enabling improved defect detection and reliability modeling.
• Analytical methods for internal atmosphere analysis (moisture, residual gases) require state-of-the-art instrumentation—including rigorous calibration protocols and alignment with international reliability standards.
• Connector product detail alignment—dimensional, environmental, and compatibility information must be verified at both the design and procurement stages. Attention to derating curves, environmental ranges, and mounting dimensions is vital for system-level performance.
• Spring clamp connection best practices highlight the importance of preparation, aging resistance, and practical assembly—a direct response to field experience with wire failures or terminal degradation.

Implementation tips:

1. Review internal documentation and SOPs to ensure all references to superseded standards are updated.
2. Train technical and quality staff on new test and process requirements, particularly where new materials (e.g., copper wire, advanced plastics) are in use.
3. Work with certified suppliers and laboratories who can support advanced testing, including destructive methods and gas mass spectrometry.
4. For new connector designs, reference updated performance levels and ensure compatibility with industry-standard mating requirements.
5. Record environmental and stress test results to demonstrate compliance and predict field performance.

Conclusion / Next Steps

The January 2026 portfolio of electronics standards brings the industry forward with the latest in test precision, connector design, and assembly reliability. Organizations involved in electronics manufacturing, integration, and assurance should prioritize a gap analysis against these new publications, update contractual specifications, and stay informed on upcoming compliance deadlines for their market sector.

Staying current with standards is vital—not only to achieve compliance, but to secure a reputation for reliability and forward-looking engineering.

Recommendations:

• Conduct a standards impact audit across design, manufacturing, and supply chain teams.
• Engage with test labs and certification bodies to get ahead on destructive and analytical test capabilities.
• Bookmark iTeh Standards for easy access to full standard texts, technical guidance, and future updates.

Stay proactive, stay compliant, and maintain a technical edge—explore these new standards in detail with iTeh Standards and ensure your organization's electronics innovations meet the industry's highest benchmarks.