January 2026: Five New Standards Advance Electronics Quality and Safety

Electronics manufacturers and professionals have five pivotal new standards to consider as of January 2026. These developments promise to redefine benchmarks in solderability, component durability, and connector reliability—driving higher product quality and compliance across the electronics supply chain. From updated testing methods for semiconductors to robust guidelines for power connectors, these publications mark a significant step forward for the industry.

Overview / Introduction

The electronics sector consistently relies on harmonized international standards to ensure the integrity, safety, and interoperability of devices and components. Whether integrating semiconductor packages, designing new connectors for industrial systems, or verifying product longevity, adherence to the latest standards is essential for reducing defects, improving performance, and maintaining market access.

In this article, we detail five newly published standards—each providing updated methods and requirements for solderability testing, wire bond strength evaluation, corrosion resistance in LEDs, and the design of circular power connectors. These standards, developed by organizations such as IEC and CLC, address real-world challenges for quality managers, engineers, compliance officers, and procurement professionals. Read on to learn what’s changed and how your organization can benefit from the latest guidance.

Detailed Standards Coverage

EN IEC 60749-21:2026 - Solderability Test Methods for Semiconductor Devices

Semiconductor Devices – Mechanical and Climatic Test Methods – Part 21: Solderability

This comprehensive standard defines the procedure for assessing the solderability of device package terminations intended for attachment to circuit boards using tin-lead (SnPb) or lead-free (Pb-free) solder. EN IEC 60749-21:2026 introduces updated “dip and look” test methods for through-hole, axial, and surface-mount devices (SMDs), plus an optional simulated board mounting solderability test for SMDs.

Key requirements include detailed specifications for:

• Solder bath and dipping device setup
• Flux and solder composition
• Preconditioning methods (e.g., steam ageing)
• Visual inspection and criteria for solder quality
• Optional ageing conditions to simulate actual lifecycle exposures

This revision aligns test conditions with contemporary manufacturing practices, making it especially relevant for organizations transitioning between leaded and lead-free manufacturing. Importantly, these methods are considered destructive and do not evaluate thermal stress effects (covered by other standards).

Target users include semiconductor manufacturers, PCB assemblers, quality assurance labs, and those responsible for supplier qualification.

Key highlights:

• Revised operating conditions to reflect modern production environments
• Covers “dip and look” and simulated board mounting tests
• Applicable to both SnPb and Pb-free processes

Access the full standard:View EN IEC 60749-21:2026 on iTeh Standards

EN IEC 61076-2-111:2026 - Specification for Circular Power Connectors with M12 Screw Locking

Connectors for Electrical and Electronic Equipment – Product Requirements – Part 2-111: Circular Connectors – Detail Specification for Power Connectors with M12 Screw-Locking

EN IEC 61076-2-111:2026 details the requirements for 4- to 6-way circular connectors featuring M12 screw-locking, with a focus on power connector applications in industrial settings. The standard covers:

• Current ratings of 8, 12, or 16 A per contact
• Voltage ratings from 50 V AC/60 V up to 630 V, depending on connector coding
• Termination and mounting options
• Climatic and mechanical performance benchmarks
• Safety, shielding, and ingress protection (IP) requirements

The specification targets industries deploying robust, high-reliability connectors in automation, machinery, and power distribution. By clarifying interface dimensions, thermal performance, and electrical safety, it enables interoperable, durable connections in complex environments.

Key highlights:

• Offers complete product requirements for M12 power connectors
• Addresses high current and voltage industrial applications
• Ensures standardized mechanical and environmental performance

Access the full standard:View EN IEC 61076-2-111:2026 on iTeh Standards

IEC 60747-5-13:2021 - Hydrogen Sulphide Corrosion Test for LED Packages

Semiconductor Devices – Part 5-13: Optoelectronic Devices – Hydrogen Sulphide Corrosion Test for LED Packages

This standard delivers a precise, accelerated methodology for evaluating the effects of hydrogen sulphide-induced corrosion on silver and silver alloys within LED packages. IEC 60747-5-13:2021 aims to provide actionable data on the luminous and radiant flux changes—critical for maintaining LED performance and reliability—by simulating real-world atmospheric exposures.

Scope and key procedures include:

• Testing LEDs with components made of or coated with silver or silver alloys
• Recommending test atmospheres and specimen handling
• Measuring luminous/radiant flux maintenance and changes in electric performance
• Providing guidance on interpreting degradation as it relates to field performance

This test is essential for LED package manufacturers, lighting product developers, and reliability engineers seeking to assure product longevity, especially for indoor and sensitive environments.

Key highlights:

• Quantifies silver tarnishing impact on light output and electrical characteristics
• Includes guidance for predicting real-world degradation
• Applicable for quality assessment and design validation

Access the full standard:View IEC 60747-5-13:2021 on iTeh Standards

EN IEC 60749-22-1:2026 - Wire Bond Pull Test Methods for Semiconductor Devices

Semiconductor Devices – Mechanical and Climatic Test Methods – Part 22-1: Bond Strength – Wire Bond Pull Test Methods

This first edition, together with EN IEC 60749-22-2:2026, comprehensively covers the method for determining wire bond strength in semiconductor devices, focusing on wire bond pull testing. The standard:

• Describes test setups for gold, copper, silver, and aluminium wires ranging from 15 µm to 600 µm in diameter
• Details both hook and clamp pull methods
• Specifies visual inspection and data recording procedures
• Clearly defines criteria and procedures for evaluating bond failures

Suitable for process development, quality assurance, and verification, the test is destructive and targets practitioners responsible for bond reliability in IC packaging and assembly.

Key highlights:

• Updated methods for modern wire materials (including copper and silver alloys)
• Covers both thermosonic and ultrasonic bonds
• Emphasizes correct handling and failure mode analysis

Access the full standard:View EN IEC 60749-22-1:2026 on iTeh Standards

Industry Impact & Compliance

The publication of these five new standards raises the bar for quality, consistency, and reliability in electronics development and production:

• Accelerated testing methodologies ensure early detection of reliability and assembly issues, reducing costly recalls and warranty claims.
• More rigorous materials and component specifications help supply chains meet both regulatory and market demands for safer, longer-lasting products.
• Widespread adoption minimizes compatibility issues and streamlines international procurement and sourcing.

Compliance with these standards is not just a matter of regulatory ‘box-ticking’—it is critical for market access, especially for organizations involved in exports, public sector procurement, or safety-critical applications. Most standards have recommended implementation timelines before full enforcement, so early adoption is strongly advised.

Benefits of adoption:

• Enhanced product reliability and reduced field failures
• Improved customer confidence and market reputation
• Lower long-term quality and warranty costs
• Facilitation of global market access via harmonized specifications

Risks of non-compliance:

• Increased risk of product rejections or recalls
• Loss of business with discerning OEMs and distributors
• Legal and regulatory repercussions in case of non-conformance

Technical Insights

Across these standards, several technical requirements and best practices emerge:

• Testing and Inspection: Destructive tests such as solderability evaluation and wire bond pull strength provide critical data for process control and product validation. Performing these tests as part of routine quality assurance is vital.
• Material Management: Clearly defined solder and alloy compositions, connector materials, and environmental preconditioning steps ensure processes remain aligned with international best practices—even as lead-free and advanced alloys become mainstream.
• Process Compatibility: Special provisions (such as simulated board mounting for SMDs, and testing of both hook and clamp pull methods in bond testing) allow for customization of testing to match real-world manufacturing scenarios.
• Environmental Considerations: Corrosion testing for LED packages acknowledges the increasing importance of environmental resilience, particularly in lighting and optoelectronics.

Implementation best practices:

1. Integrate the latest standards into design verification and supplier audit processes.
2. Conduct thorough training for quality and manufacturing teams on updated test methods.
3. Update in-house documentation and quality manuals to reflect new requirements.
4. Leverage third-party testing or certification when in-house facilities are insufficient.

Conclusion / Next Steps

The electronics industry is evolving rapidly, and these January 2026 standards demonstrate an ongoing commitment to continuous improvement. For professionals in engineering, procurement, quality assurance, and compliance, understanding and adopting these new requirements should be a top priority.

Key takeaways:

• Each standard introduces targeted revisions to address new material, process, and reliability challenges in the electronics field.
• Early adoption delivers competitive advantages through improved quality, reduced warranty claims, and smoother international market entry.

Recommendations:

• Review the full text of each relevant standard via iTeh Standards to ensure a complete understanding of technical details and compliance obligations.
• Incorporate updated methods into your operational processes and supplier agreements as soon as possible.
• Stay informed about forthcoming parts and further updates to maintain your organization’s leadership in quality and compliance.

For authoritative access and the latest updates, explore these and all related standards at iTeh Standards today.